초록 ▼

A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die c

A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.

대표청구항 ▼

[ What is claimed is:] [1.] A cooling system for a semiconductor die carrier comprising:a cooling fan disposed at a substantial distance from a semiconductor die carrier;a cooling duct comprising an inlet portion and an outlet portion, said inlet portion having a first cross-sectional area, said out

[ What is claimed is:] [1.] A cooling system for a semiconductor die carrier comprising:a cooling fan disposed at a substantial distance from a semiconductor die carrier;a cooling duct comprising an inlet portion and an outlet portion, said inlet portion having a first cross-sectional area, said outlet portion having a second cross-sectional area, said first cross-sectional area being greater than said second cross-sectional area, said cooling duct inlet portion attached to said cooling fan; anda heat exchanger disposed on an upper surface of the semiconductor die carrier, wherein said heat exchanger comprises heat dissipating extensions, said heat dissipating extensions comprising a plurality of fins that comprise first and second groups of fins, said first group of fins comprise fins of a first length interspersed between fins of a second length, said first length being shorter than said second length, said cooling duct outlet portion is disposed upstream of and adjacent to an edge of said heat exchanger such that said cooling fan draws ambient air into said cooling duct and said ambient air exits said cooling duct outlet portion and passes along said heat exchanger in a direction parallel to said upper surface of the semiconductor die carrier in a heat exchange relationship with said heat exchanger.