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Ceramic circuit board with heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B22F-003/00
  • H01L-023/10
출원번호 US-0916258 (1997-08-22)
우선권정보 JP-0072962 (1997-03-26)
발명자 / 주소
  • Nagase Toshiyuki,JPX
  • Kuromitsu Yoshirou,JPX
  • Sugamura Kunio,JPX
  • Kanda Yoshio,JPX
  • Hatsushika Masafumi,JPX
  • Otsuki Masato,JPX
출원인 / 주소
  • Mitsubishi Materials Corporation, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 45  인용 특허 : 8

초록 ▼

A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated

대표청구항 ▼

[ What is claimed as new and desired to be secured by Letters Patent of the United States is:] [1.] A ceramic circuit board with a heat sink, comprising:a ceramic substrate,first and second aluminum plates laminated and bonded onto opposite sides of said ceramic substrate through Al--Si-based brazin

이 특허에 인용된 특허 (8)

  1. Sasame Akira (Hyogo JPX) Sakanoue Hitoyuki (Hyogo JPX), Aluminum nitride sintered body having a metallized coating layer on its surface.
    상세보기
  2. Horiguchi Akihiro (Yokohama JPX) Kasori Mituo (Kawasaki JPX) Ueno Fumio (Kawasaki JPX) Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Endo Mitsuyoshi (Yamato JPX) Tanaka Shun-ichiro (Yok, Aluminum nitride sintered body having conductive metallized layer.
    상세보기
  3. Foley Paul (Oldwick NJ) Buckpesch Rainer (Hofheim am Taunus DEX), Ceramic composition of matter and its use.
    상세보기
  4. Yoshida Hideaki (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX) Toriumi Makoto (Saitama JPX) Yuzawa Michio (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
    상세보기
  5. Yoshida Hideaki (Saitama JPX) Toriumi Makoto (Saitama JPX) Tanaka Hirokazu (Saitama JPX) Umezawa Masao (Saitama JPX) Yuzawa Michio (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
    상세보기
  6. Takeuchi Yukihisa (Nagoya JPX) Ishikawa Masayasu (Nagoya JPX) Kimura Koji (Komaki JPX), Glass ceramic substrate having electrically conductive film.
    상세보기
  7. Nagase Toshiyuki (Omiya JPX) Kanda Yoshio (Omiya JPX) Kuromitu Yoshiro (Omiya JPX) Hatsushika Masafumi (Omiya JPX) Tanaka Hirokazu (Omiya JPX), Highly heat-radiating ceramic package.
    상세보기
  8. Sawtell Ralph R. (Monroeville PA) Premkumar Mosur K. (Monroeville PA) Yun David I. (Murrysville PA), Metal matrix composites containing electrical insulators.
    상세보기

이 특허를 인용한 특허 (45)

  1. Nagase, Toshiyuki; Nagatomo, Yoshiyuki; Kubo, Kazuaki; Negishi, Takeshi, Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material.
    상세보기
  2. Nagase, Toshiyuki; Nagatomo, Yoshiyuki; Kubo, Kazuaki; Negishi, Takeshi, Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material.
    상세보기
  3. Osanai, Hideyo, Aluminum bonding member and method for producing same.
    상세보기
  4. Terasaki, Nobuyuki; Nagatomo, Yoshiyuki, Bonding structure of aluminum member and copper member.
    상세보기
  5. Takayuki Naba JP; Hiroshi Komorita JP; Noritaka Nakayama JP; Kiyoshi Iyogi JP, Ceramic circuit board.
    상세보기
  6. Tani, Makoto; Tanaka, Yoshihiro; Ebigase, Takashi, Ceramic circuit board and electronic device.
    상세보기
  7. Fukuda,Yoshiyuki; Kato,Hiromasa, Ceramic circuit board, method for making the same, and power module.
    상세보기
  8. Ikuhashi, Ryoichi, Chip-type semiconductor device.
    상세보기
  9. Hirashima Yutaka,JPX ; Taniguchi Yoshitaka,JPX ; Hushii Yasuhito,JPX ; Tujimura Yoshihiko,JPX ; Terano Katsunori,JPX ; Gotoh Takeshi,JPX ; Takakura Syoji,JPX ; Yoshino Nobuyuki,JPX ; Sugimoto Isao,JP, Circuit substrate.
    상세보기
  10. Osanai, Hideyo; Namioka, Makoto; Iyoda, Ken, Combined member of aluminum-ceramics.
    상세보기
  11. Yamashita, Seiji; Teshima, Tamotsu; Murao, Amane; Ishizaki, Hiroshi; Honda, Takashi; Kuroyanagi, Hitoshi; Masubuchi, Tomoyuki, Electronic component unit and manufacturing method thereof.
    상세보기
  12. Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou, Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate.
    상세보기
  13. Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou, Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate.
    상세보기
  14. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials.
    상세보기
  15. Mei, Chong; Len, Michael J.; Ostergaard, Hans P., High power RF circuit.
    상세보기
  16. Furo,Masahiro; Osanai,Hideyo, Insulating substrate boards for semiconductor and power modules.
    상세보기
  17. Reed, Paul W.; Mackinnon, Duncan P.; Curl, Ronald D.; Long, Joe R., Laser alignment tool.
    상세보기
  18. Thompson, Joseph B., Light emitting assemblies and portions thereof.
    상세보기
  19. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Low temperature method for hermetically joining non-diffusing ceramic materials.
    상세보기
  20. Sun, Shih-Hao, Manufacturing method of package carrier.
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  21. Osanai,Hideyo; Furo,Masahiro, Metal-ceramic circuit board.
    상세보기
  22. Meyer, Andreas; Wehe, Christoph; Schulz-Harder, Jürgen; Schmidt, Karsten, Metal-ceramic substrate.
    상세보기
  23. Osanai,Hideyo; Ibaraki,Susumu; Iyoda,Ken; Namioka,Makoto, Metal/ceramic bonding substrate and method for producing same.
    상세보기
  24. Karandikar,Prashant G.; Rossing, legal representative,Marlene; Rossing, deceased,Barry R., Method for brazing ceramic-containing bodies, and articles made thereby.
    상세보기
  25. Rossing, Barry R.; Karandikar, Prashant G., Method for brazing ceramic-containing bodies, and articles made thereby.
    상세보기
  26. Herderick, Edward D.; Cooper, Kirk E.; Ames, Nathan D., Method for fabricating silicon carbide assemblies.
    상세보기
  27. Sadek, Alber; Herderick, Edward D.; Cooper, Kirk E.; Ames, Nathan D., Method for joining silicon carbide components to one another.
    상세보기
  28. Kitahara, Takeshi; Nagatomo, Yoshiyuki; Nagase, Toshiyuki; Kuromitsu, Yoshirou, Method for manufacturing power module substrate, power module substrate, and power module.
    상세보기
  29. Gotoh, Takeshi; Fukazawa, Motoharu, Method for producing ceramic sheet, ceramic substrate using ceramic sheet obtained by such method, and use thereof.
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  30. Schulz-Harder, Jurgen; Frischmann, Andreas Karl; Rogg, Alexander; Exel, Karl, Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method.
    상세보기
  31. Knoll, Heiko, Method of joining metal-ceramic substrates to metal bodies.
    상세보기
  32. Osanai, Hideyo; Furo, Masahiro, Method of manufacturing a metal-ceramic circuit board.
    상세보기
  33. Osanai,Hideyo; Furo,Masahiro, Method of manufacturing a metal-ceramic circuit board.
    상세보기
  34. Yamashita, Seiji; Teshima, Tamotsu; Murao, Amane; Ishizaki, Hiroshi; Honda, Takashi; Kuroyanagi, Hitoshi; Masubuchi, Tomoyuki, Method of manufacturing electronic component unit.
    상세보기
  35. Oohiraki, Tomoya; Oi, Sotaro, Method of manufacturing power-module substrate with heat-sink.
    상세보기
  36. Tanaka,Katsufumi; Kinoshita,Kyoichi; Sugiyama,Tomohei; Kono,Eiji, Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate.
    상세보기
  37. Emoto,Hideyuki; Ibukiyama,Masahiro; Sugimoto,Isao; Uto,Manabu, Module structure and module comprising it.
    상세보기
  38. Lucke,Olaf; Thyzel,Bernd, Power electronics component.
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  39. Nagatomo,Yoshiyuki; Nagase,Toshiyuki; Shimamura,Shoichi, Power module and power module with heat sink.
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  40. Nagatomo Yoshiyuki,JPX ; Nagase Toshiyuki,JPX ; Kubo Kazuaki,JPX ; Shimamura Shoichi,JPX, Power module substrate.
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  41. Nagatomo, Yoshiyuki; Ishizuka, Hiroya; Nagase, Toshiyuki; Kuromitsu, Yoshirou; Edo, Masakazu; Miyake, Hideyuki, Power module substrate with heat sink, and method for producing power module substrate with heat sink.
    상세보기
  42. Nagase, Toshiyuki; Nagatomo, Yoshiyuki; Terasaki, Nobuyuki, Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module.
    상세보기
  43. Kuromitsu, Yoshirou; Akiyama, Kazuhiro; Kitahara, Takeshi; Tonomura, Hiroshi, Power module substrate, power module, and method for manufacturing power module substrate.
    상세보기
  44. Kuromitsu, Yoshirou; Akiyama, Kazuhiro; Kitahara, Takeshi; Tonomura, Hiroshi, Power module substrate, power module, and method for manufacturing power module substrate.
    상세보기
  45. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
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