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Cooling computer systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0976323 (1997-11-21)
발명자 / 주소
  • Chrysler Gregory M.
  • Chu Richard C.
  • Goth Gary F.
  • Simons Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter, Esq.
인용정보 피인용 횟수 : 74  인용 특허 : 11

초록

A redundant refrigeration system is used in conjunction with a dual passage cold plate to provide reliable cooling for electronic circuit modules particularly to such modules which incorporate computer processors for which long term "up time" is very highly desirable. Separate compressor-expansion d

대표청구항

[ The invention claimed is:] [1.] An apparatus for cooling electronic circuits, said apparatus comprising:a cold plate evaporator having a surface which conforms to the outer dimensions of a package containing electronic circuits which are to be cooled, said cold plate also having first and second c

이 특허에 인용된 특허 (11)

  1. Niggemann Richard E. (Rockford IL), Cold chassis for cooling electronic circuit components on an electronic board.
  2. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  3. Ohashi Shingeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Hatada Toshio (Tsuchiura JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hir, Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards.
  4. Bennett Benjamin R. (West Covina CA) McBee Leroy D. (Brea CA) Horak Richard F. (Fullerton CA), Fail-safe refrigeration for continuous process.
  5. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  6. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  7. McMinn Brian S., Method and apparatus for tracking power of an integrated circuit.
  8. Priot Robert (Trevoux FRX), Method of cooling electrical components, device for implementing same and application to vehicle-borne components.
  9. Cowans Kenneth W. (Fullerton CA), Refrigeration system and method for very large scale integrated circuits.
  10. Chan Chung K. (Los Angeles CA), Self-actuating heat switches for redundant refrigeration systems.
  11. Heffner Joseph H. (Chesterfield MO) Hoehne Dennis L. (St. Louis MO), Shuttle valve for a refrigeration system.

이 특허를 인용한 특허 (74)

  1. Dighde, Rajesh Manohar; Schultz, Bernie; Abzarian, David, Adaptive flow for thermal cooling of devices.
  2. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  3. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  4. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  5. Pokhama,Himanshu; Mongia,Rajiv K.; DiStefano,Eric, Apparatus to use a refrigerator in mobile computing device.
  6. Allison,Matthew, Beverage dispensing system.
  7. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  8. Moseley, Joel, Capacity control systems and methods for a compressor.
  9. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  10. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  11. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  12. Zaffetti, Mark A.; Laurin, Michael B., Compact two sided cold plate with transfer tubes.
  13. Moody, Bruce A.; Chumley, Eugene K.; Edwards, Jerry D.; Wampler, Tim M.; Tolbert, Jr., John W., Compressor speed control system for bearing reliability.
  14. Jadric, Ivan; Hoover, Stephen M.; Rogers, Kathleen S.; Todd, Michael S., Cooling member.
  15. Jadric, Ivan; Hoover, Steve M.; Rogers, Kathleen S.; Todd, Michael S.; Fox, Mathias R.; Keizer, Christopher J.; Perry, Ronald C.; Boerma, Matthew T.; Warner, Justin D.; Slothower, Scott V.; Muszynski, Julie S.; Laforme, David J., Cooling member.
  16. Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
  17. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  18. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  19. Harvey, Thomas E.; Sillato, Stephen, Cooling system for high density heat loads.
  20. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Cooling system for portable electronic and computer devices.
  21. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
  22. Schnetzka, Harold R.; Jadric, Ivan; Hoover, Steve; Rogers, Kathleen S.; Yanik, Mustafa Kemel, Cooling systems for variable speed drives and inductors.
  23. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  24. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  25. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  26. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  27. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  28. Monfarad, Ali Heydari, Field replaceable packaged refrigeration heat sink module for cooling electronic components.
  29. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  30. Pal, Debabrata, Heat exchanger for motor controller.
  31. Cordova, Jose Luis; Heshmat, Hooshang, High effectiveness low pressure drop heat exchanger.
  32. Shedd, Timothy A., High efficiency thermal management system.
  33. Wexler, Peter, In-row air containment and cooling system and method.
  34. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Integrated heat sink system for a closed electronics container.
  35. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  36. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  37. Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Isothermal heat sink with tiered cooling channels.
  38. Steven N. Roy ; John F. Judge ; Harold R. Schnetzka, Liquid-cooled power semiconductor device heatsink.
  39. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Liquid-to-air cooling system for portable electronic and computer devices.
  40. Kung, Chang Cheng, Lubricant circulation system.
  41. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  42. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  43. Tutunoglu, Ozan, Method and apparatus for cooling.
  44. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  45. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  46. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  47. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  48. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  49. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  50. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  51. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  52. Manole,Dan M, Modular heating or cooling system.
  53. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  54. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  55. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  56. Tipton, Russ; Bush, Terry; Graham, Mike; Saunders, Jack, Multi-stage refrigeration system.
  57. Monfarad, Ali Heydari, Multiple compressor refrigeration heat sink module for cooling electronic components.
  58. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  59. Monfarad, Ali Heydari, Refrigeration cooling assisted MEMS-based micro-channel cooling system.
  60. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  61. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  62. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  63. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  64. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  65. Mainers, Larry D.; Goyen, Mark J.; Lake, Vince, Retractable computer rack aisle roof.
  66. Mainers, Larry D.; Goyen, Mark J.; Lake, Vincent M., Retractable computer rack aisle roof.
  67. Bear, Daniel B., Single or dual buss thermal transfer system.
  68. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  69. Tolbert, Jr., John Willard, System and method for compressor capacity modulation in a heat pump.
  70. Tolbert, Jr., John W.; Moody, Bruce A.; Edwards, Jerry D.; Gilliam, David R.; Chumley, Eugene K.; Denzau, Richard C.; Hix, Scott; Toner, Justin M.; Trent, Mark R.; Wampler, Tim M.; Williams, John R., System and method for detecting a fault condition in a compressor.
  71. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  72. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  73. Tolbert, Jr., John W.; Moody, Bruce A.; Chumley, Eugene K.; Denzau, Richard C.; Edwards, Jerry D.; Gilliam, David R.; Hix, Scott; Toner, Justin M.; Trent, Mark R.; Wampler, Tim M.; Williams, John R., System and method for starting a compressor.
  74. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
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