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Eliminating stiction with the use of cryogenic aerosol 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0873270 (1997-06-11)
발명자 / 주소
  • Becker David Scott
  • Hanestad Ronald J.
  • Thomes Gregory P.
  • Weygand James F.
  • Zimmerman Larry D.
출원인 / 주소
  • FSI International Inc.
대리인 / 주소
    Vidas, Arrett & Steinkraus
인용정보 피인용 횟수 : 12  인용 특허 : 53

초록

Stiction in a microstructure may be eliminated by directing a cryogenic aerosol at the portion of the microstructure subject to stiction with sufficient force so as to free the portion of the microstructure.

대표청구항 ▼

[ What is claimed is as follows:] [1.] A method for freeing a stuck microdevice on a substrate comprisingapplying a cryogenic aerosol to said stuck microdevice so as to free the stuck microdevice wherein:said cryogenic aerosol is comprised of at least one chemical that is chemically unreactive with

이 특허에 인용된 특허 (53)

  1. Srikrishnan Kris V. (Wappingers Falls NY) Wu Jin J. (Ossining NY), Aerosol cleaning method.
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  2. Ogawa Mitsuhiro (Yao JPX) Ouno Toshiki (Fukuoka JPX) Ejima Taizou (Fukuoka JPX) Kotou Satoru (Amagasaki JPX), Apparatus and method for cleaning semiconductor wafers.
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  3. Whitlock Walter H. (Peapack NJ) Weltmer ; Jr. William R. (Murray Hill NJ) Clark James D. (Mountainside NJ), Apparatus and method for removing minute particles from a substrate.
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  4. Bauer Tibor L. (Hopewell Junction NY) Cavaliere William A. (Verbank NY) Dart ; II Charles R. (Coral Springs FL) Freebern Timothy H. (LaGrangeville NY) Linnell David C. (Poughkeepsie NY) Miller James , Apparatus for producing cryogenic aerosol.
    상세보기
  5. Hayashi Chikara (Chigasaki JPX), Apparatus for removing covering film.
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  6. Layden Lawrence M. (Stanton NJ), Apparatus for removing small particles from a substrate.
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  7. McDermott Wayne T. (Allentown PA) Wu Jin J. (Ossining NY) Ockovic Richard C. (Northampton PA), Apparatus to clean solid surfaces using a cryogenic aerosol.
    상세보기
  8. Fong Calvin C. (Beverly Hills CA) Altizer John W. (Simi Valley CA) Arnold Vernon E. (Fillmore CA) Lawson John K. (Granada Hills CA), Blasting machine utilizing sublimable particles.
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  9. Swain Eugene A. (Webster NY) Carter Stephen R. (Tucson AZ) Hoenig Stuart A. (Tucson AZ), Carbon dioxide snow agglomeration and acceleration.
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  10. Ichinoseki Tsuyoshi ((Yoshizawa Jutaku E-206) No. 844-2 ; Yoshizawa-cho Mito-shi ; Ibaragi-ken JPX) Kato Hirobumi ((Hyakujuen Jutaku D-302) No. 2617-2 ; Motoyoshida-cho Mito-shi ; Ibaragi-ken JPX) Mi, Cleaning method.
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  12. Goffnett David M. (Alma MI) Richardson Mark D. (Hemlock MI) Bielby Eugene F. (Saginaw MI), Cleaning of CVD reactor used in the production of polycrystalline silicon by impacting with carbon dioxide pellets.
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  13. Rattan William D. (San Jose CA) Walwyn Craig M. (San Jose CA), Disc cleaning machine.
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  14. Mastrangelo Carlos H. (Ann Arbor MI), Dry-release method for sacrificial layer microstructure fabrication.
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  15. Cherry Roger L. (2636 Maria Ct. West Linn OR 97068), High-purity cleaning system, method, and apparatus.
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  16. Tada Masuo (Yao JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Ice particle forming and blasting device.
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  17. Bowers Charles W., Integrated circuit chip module cleaning using a carbon dioxide jet spray.
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  18. Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.
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  19. Pickering Raymond E. (Vassalboro ME) Waitkus Patricia E. (Rockport MA) Parsons Delmar R. (Greenfield MA) Soule Lincoln (Wendell MA) Walker William T. (South Deerfield MA) Bedaw Robert E. (Turner Fall, Method and apparatus for the aqueous cleaning of populated printed circuit boards.
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  20. Kawai Akira (Itami) Uoya Shigeo (Itami JPX), Method for applying a treatment liquid on a semiconductor wafer.
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  21. Sneed John D. (Long Beach CA) Krone-Schmidt Wilfried (Fullerton CA) Slattery Michael J. (Gardena CA) Bowen Howard S. (Los Angeles CA), Method for cleaning surface by heating and a stream of snow.
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  22. Williford ; Jr. John F. (7155 NE. 126th St. Kirkland WA 98034), Method for removing particulate matter.
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  23. Ohmori Toshiaki (Itami JPX) Kanno Itaru (Itami JPX) Fukumoto Takaaki (Itami JPX), Method of cleaning a surface by blasting the fine frozen particles against the surface.
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  24. Moriya Kozo (Ibaragi JPX) Ookatsu Tadashi (Kobe JPX), Method of cleaning wafers or the like.
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  25. Orsen Mikael (Kungalv SEX), Method of removing paint.
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  26. Reed Michael L. (Pittsburgh PA) Abe Takeshi (Pittsburgh PA), Method to prevent adhesion of micromechanical structures.
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  27. Reed Michael L. ; Abe Takeshi,JPX, Method to prevent adhesion of micromechanical structures.
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  28. Martin John R. (Foxborough MA) Zhao Yang (North Andover MA), Micromachined device packaged to reduce stiction.
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  29. Cavaliere William A. (Verbank NY) Kuder ; II Robert P. (Hopewell Junction NY) Wu Jin J. (Ossining NY), Mounting apparatus for cryogenic aerosol cleaning.
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  30. Bauer Tibor L. (Hopewell Junction NY) Cavaliere William A. (Verbank NY) Linnell David C. (Poughkeepsie NY) Wu Jin J. (Ossining NY), Nozzle apparatus for producing aerosol.
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  31. Moore David E. (212 Southampton Rd. Louisville KY 40223) Crane Newell D. (5988 Woodridge Dr. Milford OH 45150), Particle-blast cleaning apparatus and method.
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  32. Anderson Max F. (R.R. #1 Stewardson IL 62463), Portable cleaning apparatus.
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  33. Gifford George G. (Poughkeepsie NY) Lii Yeong-Jyh T. (Peekskill NY) Wu Jin J. (Ossining NY), Process for fabricating a semiconductor structure having sidewalls.
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  34. Hayashi Chikara (Chigasaki JPX), Process for removing covering film and apparatus therefor.
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  35. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), Process for surface and fluid cleaning.
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  36. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
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  37. Tada Masuo (Yao JPX) Hata Takeki (Kobe JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX), Processing apparatus for semiconductor wafers.
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  38. Tada, Masuo; Hata, Takeki; Fukumoto, Takaaki; Ohmori, Toshiaki, Processing method for semiconductor wafers.
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  39. Fong Calvin C. (Beverly Hills CA), Sandblasting with pellets of material capable of sublimation.
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  40. Hatton Derald R. (Middletown OH) Chupka David E. (Middletown OH), Self-sealing valve assembly to facilitate unplugging of a centrifugal cleaner.
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  41. Menon Venugopal B. (Austin TX), Submicron particle removal using liquid nitrogen.
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  42. Menon Venugopal B. (Austin TX), Submicron particle removal using liquid nitrogen.
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  43. McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Allentown PA) Wu Jin J. (Ossining NY) Cooper Douglas W. (Millwood NY) Schwarz Alexander (Allentown PA) Wolfe Henry L. (Pleasant Valley NY), Surface cleaning using a cryogenic aerosol.
    상세보기
  44. McDermott Wayne T. (Allentown PA) Ockovic Richard C. (Northampton PA) Wu Jin J. (Ossining NY) Cooper Douglas W. (Milwood NY) Schwarz Alexander (Bethlehem PA) Wolfe Henry L. (Pleasant Valley NY), Surface cleaning using an argon or nitrogen aerosol.
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  45. Tamai Tadamoto (Tokyo JPX) Ikeya Yoichiro (Houya JPX), Surface cleaning with argon.
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  46. Peterson Ronald V. (Thousand Oaks CA) Krone-Schmidt Wilfried (Fullerton CA), System for precision cleaning by jet spray.
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  47. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
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  48. Hodge Robert J. (Colorado Springs CO), Vehicle cleansing method.
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  49. Levi Mark W. (Utica NY), Wafer cleaning method.
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  50. Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX), Wafer cleaning method and apparatus therefor.
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  51. Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX), Wafer cleaning method and apparatus therefore.
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  52. Roger Tanguy (Villeneuve d\Ascq FRX), Washing device.
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  53. Goff James R. (Seminole OK), Washing device for machine parts and method of using the device.
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이 특허를 인용한 특허 (12)

  1. Chen, Dongmin; Xiong, Fulin, Anti-stiction gas-phase lubricant for micromechanical systems.
    상세보기
  2. Endisch, Denis H., Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning.
    상세보기
  3. Endisch, Denis H., Edge bead removal for spin-on materials containing low volatility solvents using carbon dioxide cleaning.
    상세보기
  4. Chen,Dongmin; Xiong,Fulin, Method of operating a micromechanical device that contains anti-stiction gas-phase lubricant.
    상세보기
  5. Chen,Dongmin; Xiong,Fulin, Method of using a preferentially deposited lubricant to prevent anti-stiction in micromechanical systems.
    상세보기
  6. Ellis, Christina Ann, Methods of achieving selective etching.
    상세보기
  7. Shih, Hong; Leonte, Oana M.; Daugherty, John E.; Huang, Tuochuan; Goldspring, Gregory J.; May, Michael C., On-line chamber cleaning using dry ice blasting.
    상세보기
  8. Chen, Dongmin; Xiong, Fulin; Worley, Spencer, Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems.
    상세보기
  9. Chen, Dongmin; Xiong, Fulin; Worley, Spencer, Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems.
    상세보기
  10. Chen,Dongmin; Xiong,Fulin, Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant.
    상세보기
  11. Bellis, Matthew William; Chen, Dongmin; Miller, Gregory Allen, Spatially offset multi-imager-panel architecture for projecting an image.
    상세보기
  12. Prophet, Eric M., Stiction alleviation using passivation layer patterning.
    상세보기

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