|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||428/141 ; 428/156 ; 428/164 ; 428/209 ; 428/212 ; 428/421 ; 428/469 ; 428/472 ; 428/473.5 ; 428/480 ; 428/698|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 18 인용 특허 : 13|
A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.
[ We claim:] [1.] A composite comprising a polymeric substrate having at least one surface modified by plasma etching to form a micro-roughened substrate surface, a layer on said micro-roughened substrate surface comprising a first metal nitride layer, a second nonstoichiometric metal nitride layer on said first metal nitride layer, said first metal nitride layer and said second nonstoichiometric metal nitride layer capable of being dissolved in an alkaline etchant composition and a third electrically conductive metal layer on said nonstoichoimetric meta...