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특허 상세정보

Multilayer metalized composite on polymer film product and process

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) G32B-003/00   
미국특허분류(USC) 428/141 ; 428/156 ; 428/164 ; 428/209 ; 428/212 ; 428/421 ; 428/469 ; 428/472 ; 428/473.5 ; 428/480 ; 428/698
출원번호 US-0053859 (1998-03-26)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Cook
인용정보 피인용 횟수 : 18  인용 특허 : 13
초록

A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.

대표
청구항

[ We claim:] [1.] A composite comprising a polymeric substrate having at least one surface modified by plasma etching to form a micro-roughened substrate surface, a layer on said micro-roughened substrate surface comprising a first metal nitride layer, a second nonstoichiometric metal nitride layer on said first metal nitride layer, said first metal nitride layer and said second nonstoichiometric metal nitride layer capable of being dissolved in an alkaline etchant composition and a third electrically conductive metal layer on said nonstoichoimetric meta...

이 특허에 인용된 특허 (13)

  1. Saia Richard Joseph ; Durocher Kevin Matthew ; Cole Herbert Stanley. Flexible interconnect film including resistor and capacitor layers. USP1999025874770.
  2. Knudsen Philip D. (South Berwick ME) Walsh Daniel P. (Peabody MA). Metal coated laminate products made from textured polyimide film. USP1988024725504.
  3. Gibbons Kevin P. (Sunnyvale CA) Lau Louis C. (Alameda CA) Woodard Floyd E. (Los Altos CA). Metal on plastic films with adhesion-promoting layer. USP1996125589280.
  4. Swisher Richard L. (Northfield MN). Metal-film laminate resistant to delamination. USP1992085137791.
  5. Polak Anthony J. (Wauconda IL). Method for increasing the peel strength of metal-clad polymers. USP1982064337279.
  6. Polak, Anthony J.. Method for increasing the peel strength of metal-clad polymers. USP1983054382101.
  7. Barton Carlos L. (Brooklyn CT) McGraw Robert B. (Westport CT). Method for metallizing fluoropolymer substrates. USP1995055413687.
  8. Tadros Jehane (Mississauga CAX). Method of manufacturing printed circuit boards. USP1986074597828.
  9. Brill Klaus (Korntal DEX) Grothe Wolfgang (Tiefenbronn DEX). Multiple-layer heat barrier. USP1984054450201.
  10. Blackwell Kim J. (Owego NY) Matienzo Luis J. (Endicott NY) Knoll Allan R. (Endicott NY). Process for creating organic polymeric substrate with copper. USP1994125372848.
  11. Walsh Daniel P. (Peabody MA). Textured polyimide film. USP1989024806395.
  12. Walsh Daniel P. (Peabody MA) Knudsen Philip D. (South Berwick ME). Thermally stable dual metal coated laminate products made from textured polyimide film. USP1989094868071.
  13. Ferraris Giampiero (Milan ITX). Titanium nitride as one layer of a multi-layered coating intended to be etched. USP1980104226932.

이 특허를 인용한 특허 피인용횟수: 18

  1. Li, Jiutao. Agglomeration elimination for metal sputter deposition of chalcogenides. USP2009057528401.
  2. Asada, Misa; Kawata, Takashi; Nakayasu, Tomoaki; Yoshimoto, Kota; Uchida, Nobuhiro. Chain component and chain. USP2018029903441.
  3. Seki, Yasuaki; Ito, Takashi; Mochizuki, Shuji; Furuta, Kiyonori; Hatajima, Toshihiko. Insulating resin composition for multilayer printed-wiring board. USP2003096613987.
  4. Tsuchiya,Yoshihiro; Sasaki,Tetsuro. Manufacturing method of magnetoresistive effect sensor. USP2006087086141.
  5. Ochi, Shinya; Nakagami, Ryuichi; Kohtoku, Makoto; Hamada, Mika. Metal-laminated polyimide substrate, and method for production thereof. USP20180710021789.
  6. Burke, Thomas F.. Metalized dielectric substrates for EAS tags. USP2004126835412.
  7. Burke,Thomas F.. Metalized dielectric substrates for EAS tags. USP2006097113131.
  8. Michio Asahina JP; Eiji Suzuki JP; Kazuki Matsumoto JP; Naohiro Moriya JP. Method for manufacturing semiconductor devices. USP2002026350685.
  9. Fang, Sunfei. Method of cleaning an inter-level dielectric interconnect. USP2005036872652.
  10. George, Steven M.; Ferguson, John D.; Weimar, Alan W.; Wilson, Christopher A.. Method of depositing an inorganic film on an organic polymer. USP2016069376750.
  11. Kang, Un Byoung; Kwon, Yong Hwan; Lee, Chung Sun; Kwon, Woon Seong; Jang, Hyung Sun. Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device. USP2010087786581.
  12. Takahashi, Kazuyuki. Method of manufacturing wiring substrate. USP2004066742250.
  13. Yeduru, Srinivasa Reddy; Hirschler, Joachim; Wiedenhofer, Harald; Kleinbichler, Franz. Method of processing a semiconductor device and chip package. USP2017049614045.
  14. Claar, James A.; Cuomo, Jerome J.; Diehl, David A.; Oldham, Christopher J.; Sanwald, Roger C.; Wilt, Truman F.; Yancey, Peter J.. Methods for removal of polymeric coating layers from coated substrates. USP2012038133324.
  15. Yializis, Angelo. Polymer film capacitor. USP2003076594134.
  16. Weber, Joern. Reflective optical element for EUV lithography. USP2015018928972.
  17. Saeki, Noriyuki; Sakou, Takefumi; Watanabe, Hiroto; Ishii, Yoshiro. Two-layer copper polyimide substrate. USP2005046875519.
  18. Ohmi, Tadahiro; Goto, Tetsuya. Wiring board and method of manufacturing the same. USP2015038981234.