초록 ▼

A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper and lower surfaces of the package are aligned. The package includes a semiconductor chip, a plurality of

A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper and lower surfaces of the package are aligned. The package includes a semiconductor chip, a plurality of lower leads attached to the lower side of the chip by an adhesive, a plurality of upper leads attached to the upper side of the chip by an adhesive and to the upper surfaces of the lower leads, wherein metal wires electrically connect the upper leads with a plurality of chip pads formed on the chip, and wherein a molding section packages the chip, the metal wires and the upper and lower leads, such that the upper and lower surfaces of the upper and lower leads, respectively, are externally exposed.

대표청구항 ▼

[ What is claimed is:] [1.] A chip package, comprising:a chip;a plurality of lower leads that are attached to a lower side of the chip;a plurality of upper leads that are attached to an upper side of the chip and that are connected to corresponding ones of the lower leads;a plurality of conductive m

[ What is claimed is:] [1.] A chip package, comprising:a chip;a plurality of lower leads that are attached to a lower side of the chip;a plurality of upper leads that are attached to an upper side of the chip and that are connected to corresponding ones of the lower leads;a plurality of conductive media that couple ones of the upper and lower leads with corresponding ones of a plurality of chip pads formed on the chip; anda molding section packaging the chip, the conductive media and the upper and lower leads such that upper and lower surfaces of the upper and lower leads, respectively, are externally exposed.