초록 ▼

Openings are created in a structure by a process in which a plate is furnished with a sacrificial patterned masking layer divided into multiple laterally separated mask portions. A primary layer of actinic material is provided over the masking layer and in space between the mask portions. Material o

Openings are created in a structure by a process in which a plate is furnished with a sacrificial patterned masking layer divided into multiple laterally separated mask portions. A primary layer of actinic material is provided over the masking layer and in space between the mask portions. Material of the primary layer not shadowed by a mask formed with the mask portions is backside exposed to actinic radiation. Material of the primary layer not exposed to the radiation is removed. Segments of the masking layer not covered by exposed material of the primary layer are then removed. Consequently, openings extend through the primary layer where the segments of the masking layer have been removed. The process is typically employed in forming an optical device such as a flat-panel cathode-ray tube display in which the openings in the primary layer receive light-emissive material.

대표청구항 ▼

[ We claim:] [1.] A method comprising the steps of:forming a patterned masking layer over a first surface of a plate having a second surface opposite the first surface such that the masking layer is patterned into multiple laterally separated mask portions;providing a primary layer of actinic materi

[ We claim:] [1.] A method comprising the steps of:forming a patterned masking layer over a first surface of a plate having a second surface opposite the first surface such that the masking layer is patterned into multiple laterally separated mask portions;providing a primary layer of actinic material over the masking layer and in space between the mask portions;backside exposing material of the primary layer not shadowed by a mask comprising the mask portions to backside actinic radiation that passes through the plate traveling from its second surface to its first surface;removing material of the primary layer not exposed to the radiation; andremoving segments of the masking layer not covered by exposed material of the primary layer, whereby openings extend through the primary layer where the segments of the masking layer have been removed.