초록 ▼

A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the w

A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining member is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of vacuum and a source of pressurized fluid alternately to be connected to the cavity. An additional wafer carrier membrane is internally located with respect to the cavity formed by the wafer carrier membrane, and forms another cavity with respect to the rigid plate. Another fluid conduit is connected to the internal wafer carrier membrane's cavity, which is selectively pressurized to make the internal wafer carrier membrane contact the wafer contact section.

대표청구항 ▼

[ What is claimed is:] [1.] A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises:a rigid plate having a major surface;a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer sur

[ What is claimed is:] [1.] A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises:a rigid plate having a major surface;a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer surface and an inner surface wherein the outer surface is for contacting an opposite surface of the workpiece, the wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a first cavity therebetween;an internal wafer carrier membrane with a section having an outer surface for contacting the inner surface of the wafer contact section, the internal wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a second cavity therebetween;a first fluid conduit by which a source of pressurized fluid is connected to the first cavity; anda second fluid conduit by which a source of pressurized fluid is connected to the second cavity.