초록 ▼

A semiconductor package includes a substrate having one or more dice mounted thereto, and a cover adapted to protect and form a sealed space for the dice. The cover can be pre-fabricated of molded plastic, or stamped metal, and attached to the substrate using a cured seal. A hole can also be provide

A semiconductor package includes a substrate having one or more dice mounted thereto, and a cover adapted to protect and form a sealed space for the dice. The cover can be pre-fabricated of molded plastic, or stamped metal, and attached to the substrate using a cured seal. A hole can also be provided through the substrate to permit pressure equalization during formation of the seal. The cover can be prefabricated in an enclosed configuration for attachment directly to the substrate, or in a planar configuration for attachment to a peripheral ridge on the substrate. In either embodiment, the cover is removable to permit defective dice to be replaced or repaired.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor package comprising:a substrate comprising an external contact;a ridge on the substrate comprising a photopatterned resist;a semiconductor die on the substrate in electrical communication with the external contact and encompassed by the ridge;a cover attach

[ What is claimed is:] [1.] A semiconductor package comprising:a substrate comprising an external contact;a ridge on the substrate comprising a photopatterned resist;a semiconductor die on the substrate in electrical communication with the external contact and encompassed by the ridge;a cover attached to the ridge to form an enclosed space on the substrate for the die;a seal between the cover and the substrate configured to attach the cover to the ridge and to seal the space; anda vent hole in the substrate in flow communication with the space.