초록 ▼

Photopolymerizable plastisol and organosol photoresist and solder mask coating compositions are described herein. These compositions include an ethylenically unsaturated photopolymerizable liquid plasticizer; a particulate, thermoplastic resin is dispersed in the plasticizer, the said resin having a

Photopolymerizable plastisol and organosol photoresist and solder mask coating compositions are described herein. These compositions include an ethylenically unsaturated photopolymerizable liquid plasticizer; a particulate, thermoplastic resin is dispersed in the plasticizer, the said resin having a midpoint Tg greater than 110.degree. C. and an acid number greater than 110; a tertiary amine stabilizer; and a photoinitiator. The organosol includes a diluent along with the other ingredients.

대표청구항 ▼

[ What is claimed is:] [1.] A photopolymerizable, aqueous developable, plastisol photoresist and solder mask coating composition comprising(1) a plasticizer which is an ethylenically unsaturated photopolymerizable monomer,(2) a particulate, thermoplastic resin which is soluble or dispersible in a ba

[ What is claimed is:] [1.] A photopolymerizable, aqueous developable, plastisol photoresist and solder mask coating composition comprising(1) a plasticizer which is an ethylenically unsaturated photopolymerizable monomer,(2) a particulate, thermoplastic resin which is soluble or dispersible in a basic aqueous solution and has a midpoint Tg greater than 110.degree. C. and an acid number greater than 110, at an amount in the range of from about 30 to about 70% by weight of the total weight of the resin and plasticizer wherein further the plasticizer is present at an amount in the range of from about 70 to about 30% by total weight of the resin and plasticizer, wherein the resin is selected from the group consisting of a copolymer of styrene and maleic acid half ester and a copolymer of N-alkylacrylamide/alkylamino(meth)acrylate/(meth)acrylic acid,(3) a tertiary amine stabilizer which is present at an amount in the range of from about 1 to about 10 parts by weight per hundred parts of resin, and is selected from the group consisting of triethyl amine, N-butyl diethanol amine, 4-methyl morpholine, and dimethyl aminoethanol, and(4) a photoinitiator.