초록 ▼

A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding

A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding pad is rinsed with deionized water comprising carbon dioxide to reduce the effects of the corrosion phenomenon.

대표청구항 ▼

[ What is claimed is:] [1.] A method for treating a bonding pad, compromising:providing a substrate having the bonding pad formed thereon, the bonding pad comprising aluminum (Al);forming a passivation layer on the bonding pad and the substrate;using an etchant containing fluorine (F) to etch the pa

[ What is claimed is:] [1.] A method for treating a bonding pad, compromising:providing a substrate having the bonding pad formed thereon, the bonding pad comprising aluminum (Al);forming a passivation layer on the bonding pad and the substrate;using an etchant containing fluorine (F) to etch the passivation layer until a top surface of the bonding pad is exposed, and a product of F.sub.x Al.sub.y is formed on the exposed top surface with a ratio of F to Al; andrinsing the bonding pad with a deionized water injected with carbon dioxide gas to decrease the ratio of F to Al on the exposed top surface of the bonding pad.