이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

1. Hench Larry L. (Gainesville FL) Orcel Gerard F. (Gainesville FL), Drying control chemical additives for rapid production of large sol-gel derived silicon, boron and sodium containing mon.

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2. Cogliati Guido (Rome ITX), Inorganic oxide aerogel microbeads of narrow pore diameter distribution and the method for their preparation.

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3. Havemann Robert H. ; Jeng Shin-Puu ; Gnade Bruce E. ; Cho Chih-Chen, Interconnect structure with an integrated low density dielectric.

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4. Gnade Bruce (Dallas TX) Cho Chih-Chen (Richardson TX) Levine Jules D. (Dallas TX), Low density, high porosity material as gate dielectric for field emission device.

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5. Gnade Bruce E. ; Cho Chih-Chen ; Smith Douglas M., Low dielectric constant material for electronics applications.

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6. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics a.

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7. Sasaki Shigeo (Yokkaichi JPX), Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same.

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8. Tillotson Thomas M. (Tracy CA) Poco John F. (Livermore CA) Hrubesh Lawrence W. (Pleasanton CA) Thomas Ian M. (Livermore CA), Method for producing metal oxide aerogels.

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9. Tillotson Thomas M. (Tracy CA) Poco John F. (Livermore CA) Hrubesh Lawrence W. (Pleasanton CA) Thomas Ian M. (Livermore CA), Method for producing metal oxide aerogels having densities less than 0.02 g/cc.

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10. Chi Frank K. (Midland MI), Method for rendering non-ferrous metals corrosion resistant.

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11. Poco John F. (Livermore CA), Method of casting aerogels.

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12. Havemann Robert H. (Garland TX) Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX), Method of fabricating porous dielectric material with a passivation layer for electronics applications.

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13. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method of making a semiconductor device using a low dielectric constant material.

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14. Havemann Robert H. (Garland TX) Jeng Shin-Puu (Plano TX) Gnade Bruce E. (Rowlett TX) Cho Chih-Chen (Richardson TX), Method of making an interconnect structure with an integrated low density dielectric.

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15. Nogues Jean-Luc (Gainesville FL) Balaban Canan (Gainesville FL) Moreshead William V. (Alachua FL), Method of making sol-gel monoliths.

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16. Mielke Manfred (Heidelberg DEX) Seybold Guenther (Neuhofen DEX), Moldings or sheets made from silica aerogels.

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17. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Porous composites as a low dielectric constant material for electronics applications.

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18. Havemann Robert H. (Garland TX) Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX), Porous dielectric material with a passivation layer for electronics applications.

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19. Cho Chi-Chen (Richardson TX) Gnade Bruce E. (Dallas TX) Smith Douglas M. (Albuquerque NM), Porous dielectric material with improved pore surface properties for electronics applications.

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20. Cho Chi-Chen (Richardson TX) Gnade Bruce E. (Dallas TX) Smith Douglas M. (Albuquerque NM), Porous dielectric material with improved pore surface properties for electronics applications.

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21. Jeng Shin-Puu (Plano TX), Porous insulator for line-to-line capacitance reduction.

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22. Beratan Howard R. (Richardson TX) Cho Chih-Chen (Richardson TX) Summerfelt Scott R. (Dallas TX), Porous thermal isolation mesas for hybrid uncooled infrared detectors.

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23. Weidenbach Guenter (Hanover DEX) Bonse Dirk (Arpke DEX), Preparation of water-insoluble enzyme compositions.

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24. Cogliati Guido (Rome ITX) Bezzi Giovanni (Bagnacavallo ITX), Process for preparing monoliths of aerogels of metal oxides.

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25. Fabry Laszlo (Burghausen DEX) Grundner Manfred (Burghausen DEX) Graef Dieter (Burghausen DEX) Bauer-Mayer Susanne (Burghausen DEX) John Peter (Burghausen DEX), Process for producing storage-stable silicon wafer surfaces having advantageous oxidation properties and silicon wafer f.

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26. Hoshino Sumio (Yokohama JPX) Ito Masumi (Yokohama JPX) Kanamori Hiroo (Yokohama JPX), Process for producing thin glass film by sol-gel method.

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27. Yokogawa Hiroshi (Hirakata JPX) Yokoyama Masaru (Yao JPX) Takahama Koichi (Amagasaki JPX) Uegaki Yuriko (Hirakata JPX), Process of forming a hydrophobic aerogel.

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28. Blount David H. (6728 Del Cerro Blvd. San Diego CA 92120), Production of silica aerogels.

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29. Fujimoto Takamitsu (Amagasaki JPX) Kita Shuichi (Amagasaki JPX) Noda Atsuko (Amagasaki JPX) Koezuka Hiroshi (Amagasaki JPX), Resin-sealed semiconductor device.

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30. Marsh Gary B. (Pittstown NJ) Fanelli Anthony J. (Rockaway NJ) Armor John N. (Morris Plains NJ) Zambri Patrick M. (Montclair NJ), Spray-dried inorganic oxides from non-aqueous gels or solutions.

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31. Campet Guy (Canejan FRX) Chabagno Jean-Michel (Pau FRX) Delmas Claude (Talence FRX) Portier Joseph (Gradignan FRX) Salardenne Jean (Pessac FRX), Target component for cathode sputtering.

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이 특허를 인용한 특허 (46) 인용/피인용 타임라인 분석

1. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Shin-Puu Jeng ; Bruce E. Gnade, Aerogel thin film formation from multi-solvent systems.

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2. Endisch, Denis H.; Drage, James S., Contact planarization using nanoporous silica materials.

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3. Endisch, Denis H.; Drage, James S., Contact planarization using nanoporous silica materials.

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4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.

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5. Harvey, Michael; Meredith, Paul, Control of morphology of silica films.

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6. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.

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7. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.

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8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.

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9. Cooney, III, Edward C; Fitzsimmons, John A; Gambino, Jeffrey P; Luce, Stephen E; McDevitt, Thomas L; Nicholson, Lee M; Stamper, Anthony K, Exposed pore sealing post patterning.

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10. Cooney, III,Edward C.; Fitzsimmons,John A.; Gambino,Jeffrey P.; Luce,Stephen E.; McDevitt,Thomas L.; Nicholson,Lee M.; Stamper,Anthony K., Exposed pore sealing post patterning.

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11. Buriak, Jillian M.; Stewart, Michael P.; Robins, Edward, Functionalized silicon surfaces.

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12. Nakata, Yoshihiro; Suzuki, Katsumi; Sugiura, Iwao; Yano, Ei, Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device.

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13. Leung,Roger Y.; Deng,Eric; Xie,Songyuan; Lu,Victor Y., Low metal porous silica dielectric for integral circuit applications.

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14. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Richard A. Stoltz ; Alok Maskara ; Teresa Ramos ; Shin-Puu Jeng ; Bruce E. Gnade, Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.

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15. Smith, Douglas M.; Johnston, Gregory P.; Ackerman, William C.; Stoltz, Richard A.; Maskara, Alok; Ramos, Teresa; Jeng, Shin-Puu; Gnade, Bruce E., Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.

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16. Wong, Lawrence D., Mechanically reinforced highly porous low dielectric constant films.

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17. Matos, Jeffrey A.; Milde, Jr., Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.

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18. Matos,Jeffrey A.; Milde, Jr.,Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.

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19. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.

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20. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.

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21. Yang, Tahorng, Method for forming low dielectric constant insulating layer with foamed structure.

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22. Agarwal Vishnu K., Method for forming wiring with extremely low parasitic capacitance.

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23. Joseph A Levert ; Daniel Lynne Towery ; Denis Endisch, Method for integrated circuit planarization.

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24. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.

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25. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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26. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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27. Morris, Michael A.; Ryan, Kevin M.; Holmes, Justin D.; Lawton, Willie J., Method of fabrication of low dielectric constant porous metal silicate films.

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28. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.

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29. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.

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30. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.

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31. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.

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32. Wu, Hui-Jung; Drage, James S.; Smith, Douglas M.; Ramos, Teresa; Wallace, Stephen; Viernes, Neil, Multifunctional reagents for the surface modification of nanoporous silica films.

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33. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Jeng Shin-Puu, Nanoporous dielectric thin film formation using a post-deposition catalyst.

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34. Buriak, Jillian M.; Hurley, Patrick T., Patterned functionalized silicon surfaces.

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35. Smith, Douglas M.; Ackerman, William C.; Stoltz, Richard A., Polyol-based method for forming thin film aerogels on semiconductor substrates.

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36. Lu,Victor Y.; Leung,Roger Y.; Deng,Eric; Xie,Songyuan, Porogens for porous silica dielectric for integral circuit applications.

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37. Martin, John R., Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor.

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38. Martin,John R., Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor.

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39. Martin,John R., Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor.

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40. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.

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41. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.

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42. Jahns, Michael, Systems and methods for making monolithic gel bodies.

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43. Seo, Sang-Joon; Huh, Myung-Soo; Kim, Seung-Hun; Kim, Jin-Kwang; Jo, Cheol-Rae; Jang, Choel-Min; Yi, Jeong-Ho, Thin film deposition apparatus and thin film deposition method using the same.

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44. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.

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45. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.

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46. Wu, Hui-Jung; Drage, James S., Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films.

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