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Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-027/108
  • H01L-029/76
  • H01L-029/94
  • H01L-031/119
출원번호 US-0939742 (1997-10-06)
발명자 / 주소
  • Noble Wendell P.
  • Forbes Leonard
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 133  인용 특허 : 64

초록

A memory cell for a memory array in a folded bit line configuration. The memory cell includes an access transistor formed in a pillar of single crystal semiconductor material. The access transistor has first and second source/drain regions and a body region that are vertically aligned. The access tr

대표청구항

[ What is claimed is:] [1.] A memory cell for a memory array in a folded bit line configuration, the memory cell comprising:an access transistor formed in a pillar of single crystal semiconductor material, the transistor having first and second source/drain regions and a body region that are vertica

이 특허에 인용된 특허 (64)

  1. Roberts Ceredig (Boise ID), BiCMOS process and process for forming bipolar transistors on wafers also containing FETs.
  2. Chatterjee Pallab K. (Richardson TX) Malhi Satwinder (Garland TX) Richardson William F. (Richardson TX), DRAM Cell with trench capacitor and vertical channel in substrate.
  3. Gotou Hiroshi (Niiza JPX), Dram cell formed on an insulating layer having a buried semiconductor pillar structure and a manufacturing method thereo.
  4. Kosa Yasunobu (Austin TX), Dram with a vertical capacitor and transistor.
  5. Hieda Katsuhiko (Yokohama JPX), Dynamic ram and method of manufacturing the same.
  6. Gonzales Fernando (Boise ID), Dynamic random access memory array having a cross-point layout, tungsten digit lines buried in the substrate, and vertic.
  7. Kim Jong S. (Sungnam KRX) Yoon Hee-Koo (Seoul KRX) Choi Chung G. (Kyoungki-Do KRX), Dynamic random access memory having a vertical transistor.
  8. Yamamoto Tadashi (Kawasaki JPX) Sawada Shizuo (Yokohama JPX), Dynamic random access memory having bit lines buried in semiconductor substrate.
  9. Kimura Shin\ichiro (Kunitachi JPX) Kure Tokuo (Tokyo JPX) Kaga Toru (Urawa JPX) Hisamoto Digh (Kokubunji JPX) Takeda Eiji (Koganei JPX), Dynamic random access memory having trench capacitors and vertical transistors.
  10. Sung-Mu Hsu (I-Lan TWX), Electrically programmable memory device with improved dual floating gates.
  11. Sung-Mu Hsu (I-Lan TWX), Electrically programmable memory device with improved dual floating gates.
  12. Sharma Umesh (Austin TX) Kawasaki Hisao (Austin TX), Electrically programmable read-only memory cell.
  13. Choate William Clay (Dallas TX), Fault-tolerant cell addressable array.
  14. Sobczak Zbigniew P. (Colorado Springs CO), Formation and planarization of silicon-on-insulator structures.
  15. Dennison Charles H. (Boise ID) Manning Monte (Kuna ID), Fully planarized thin film transistor (TFT) and process to fabricate same.
  16. Sandhu Gurtej S. (Boise ID) Fazan Pierre (Boise ID), High performance thin film transistor (TFT) by solid phase epitaxial regrowth.
  17. Hsieh Chang-Ming (Fishkill NY) Hsu Louis L. C. (Fishkill NY) Ogura Seiki (Hopewell Junction NY), High-density DRAM structure on soi.
  18. K. O. Kenneth (Cambridge MA) Lee Hae-Seung (Watertown MA) Reif L. Rafael (Newton MA), Merged bipolar and insulated gate transistors.
  19. Kersh ; III David V. (Houston TX) Norwood Roger D. (Sugarland TX), Method and apparatus for inhibiting a predecoder when selecting a redundant row line.
  20. Tuan Hsiao-Chin (Hsin-Chu TWX) Chou Hsiang-Ming J. (Hsin-Chu TWX), Method for producing a roughened surface capacitor.
  21. Doan Trung T. (1574 Shenandoan Dr. Boise ID 83712), Method for roughening a silicon or polysilicon surface for a semiconductor substrate.
  22. Dhong Sang H. (Mahopac NY) Hwang Wei (Armonk NY) Lu Nicky C. (Yorktown Heights NY), Method of fabricating cross-point lightly-doped drain-source trench transistor.
  23. Pein Howard B. (333 N. State Rd. Briarcliff Manor NY 10510), Method of fabricating non-volatile sidewall memory cell.
  24. Yang Ming-Tzong (Hsin-Chu TWX) Hong Gary (Hsin-Chu TWX), Method of fabrication of MOSFET device with buried bit line.
  25. Mathews Viju K. (Boise) Yu Chang (Boise) Tuttle Mark E. (Boise) Doan Trung T. (Boise ID), Method of forming a capacitor in semiconductor wafer processing.
  26. Jeng Nanseng (Boise ID) Harshfield Steven T. (Emmett ID) Schuele Paul J. (Boise ID), Method of forming a contact using a trench and an insulation layer during the formation of a semiconductor device.
  27. Hirota Toshiyuki (Tokyo JPX), Method of forming a roughened surface capacitor with two etching steps.
  28. Birrittella Mark S. (Phoenix AZ) Liaw Hang M. (Scottsdale AZ) Reuss Robert H. (Scottsdale AZ), Method of forming transistors with poly-sidewall contacts utilizing deposition of polycrystalline and insulating layers.
  29. Hsieh Chang-Ming (Fishkill NY) Hsu Louis L. C. (Fishkill NY) Ogura Seiki (Hopewell Junction NY), Method of making a high-density DRAM structure on SOI.
  30. Shimizu Masahiro (Hyogo JPX) Tsukamoto Katsuhiro (Hyogo JPX), Method of making a sidewall contact.
  31. Kim Jong S. (Sungnam KRX) Yoon Hee-Koo (Seoul KRX) Choi Chung G. (Kyoungki-Do KRX), Method of making dynamic random access memory having a vertical transistor.
  32. Chin Daeje (Seoul NY KRX) Dhong Sang H. (Mahopac NY), Method of making ultra dense dram cells.
  33. Matsuo Naoto (Ibaraki JPX) Okada Shozo (Kobe JPX) Inoue Michihiro (Ikoma JPX), Method of producing a semiconductor device having trench capacitors and vertical switching transistors.
  34. Sandhu, Gurtej S.; Doan, Trung T., Method of providing a silicon film having a roughened outer surface.
  35. Pein Howard B. (Briarcliff Manor NY), Non-volatile sidewall memory cell method of fabricating same.
  36. Geiss Peter J. (Underhill VT) Kenney Donald M. (Shelburne VT), Porous silicon trench and capacitor structures.
  37. Orlowski Marius K. ; Chang Ko-Min, Process for forming an electrically programmable read-only memory cell.
  38. Hong Gary (Hsin-Chu TWX), Process for high density flash EPROM cell.
  39. Hong Gary (Hsin-Chu TWX), Process for high density split-gate memory cell for flash or EPROM.
  40. Turner John E. (Beaverton OR) Josephson Gregg R. (Lake Oswego OR), Programmable logic array.
  41. Turner John E. (Beaverton OR) Rutledge David L. (Beaverton OR), Programmable logic device.
  42. Beyer Klaus D. (Poughkeepsie NY) Yapsir Andrie S. (Pleasant Valley NY), Reach-through isolation silicon-on-insulator device.
  43. Manning Monte (Kuna ID), Redundancy elements using thin film transistors (TFTs).
  44. Manning Monte (Kuna ID), Redundancy elements using thin film transistors (TFTs).
  45. Lu Chih-Yuan (Taipei TWX), Roughened polysilicon surface capacitor electrode plate for high denity dram.
  46. Bronner Gary B. (Stormville NY) DeBrosse John K. (Burlington VT) Mandelman Jack A. (Stormville NY), SOI DRAM with field-shield isolation and body contact.
  47. Rajeevakumar Thekkemadathil V. (Scarsdale NY), SOI trench DRAM cell for 256 MB DRAM and beyond.
  48. Huang Cheng H. (Hsin-Chu TWX) Lur Water (Taipei TWX), Self-aligned trenched contact (satc) process.
  49. Gotou Hiroshi (Saitama JPX), Semiconductor device and method of producing same.
  50. Kim Hyoung-sub (Suwon KRX), Semiconductor device having vertical conduction transistors and cylindrical cell gates.
  51. Ozaki Hiroji (Hyogo JPX), Semiconductor memory device having memory cells formed in trench and manufacturing method therefor.
  52. Ozaki Tohru (Tokyo JPX), Semiconductor memory device having surrounding gate transistor.
  53. Tsukude Masaki (Hyogo JPX) Arimoto Kazutami (Hyogo JPX), Sense amplifier including MOS transistors having threshold voltages controlled dynamically in a semiconductor memory dev.
  54. Harari Eliyahou (2320 Friars La. Los Altos CA 94022), Sidewall capacitor DRAM cell.
  55. Manning Monte (Kuna ID), Sixteen megabit static random access memory (SRAM) cell.
  56. Hong Gary (Hsin-Chu TWX), Split-gate flash memory cell.
  57. Hefele Hermann L. (Augsburg DEX), Stencils having enhanced wear-resistance and methods of manufacturing the same.
  58. Gonzalez Fernando (Boise ID), Structure for cross coupled thin film transistors and static random access memory cell.
  59. Forbes Leonard (Corvallis OR), Technique for producing small islands of silicon on insulator.
  60. Manning Monte (Boise ID), Trench isolation method having a double polysilicon gate formed on mesas.
  61. Chatterjee Pallab K. (Richardson TX) Shah Ashwin H. (Dallas TX), Vertical DRAM cell and method.
  62. Chatterjee Pallab K. (Richardson TX) Shah Ashwin H. (Dallas TX), Vertical DRAM cell and method.
  63. Lu Chih-Yuan (Hsin-chu TWX), Vertical DRAM cross point memory cell and fabrication method.
  64. Nishimura Tadashi (Hyogo JPX) Sugahara Kazukyuki (Hyogo JPX) Kusunori Shigeru (Hyogo JPX) Ohsaki Akihiko (Hyogo JPX), Vertical type MOS transistor and method of formation thereof.

이 특허를 인용한 특허 (133)

  1. Kavalieros,Jack T.; Shah,Uday; Rachmady,Willy; Doyle,Brian S., Apparatus and method for selectively recessing spacers on multi-gate devices.
  2. Derderian, Garo J.; Sandhu, Gurtej Singh, Atomic layer deposition and conversion.
  3. Derderian, Garo J.; Sandhu, Gurtej Singh, Atomic layer deposition and conversion.
  4. Lindert, Nick; Cea, Stephen M., Bulk non-planar transistor having strained enhanced mobility and methods of fabrication.
  5. Doyle, Brian S.; Jin, Been-Yih; Kavalieros, Jack T.; Datta, Suman; Brask, Justin K.; Chau, Robert S., CMOS devices with a single work function gate electrode and method of fabrication.
  6. Noble,Wendell P.; Forbes,Leonard, Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor.
  7. Noble,Wendell P.; Forbes,Leonard, Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor.
  8. Forbes, Leonard; Noble, Wendell P., Circuit and method for an open bit line memory cell with a vertical transistor and trench plate trench capacitor.
  9. Forbes, Leonard; Noble, Wendell P., Circuit and method for an open bit line memory cell with a vertical transistor and trench plate trench capacitor.
  10. Leonard Forbes, Circuits and methods for a memory cell with a trench plate trench capacitor and a vertical bipolar read device.
  11. Leonard Forbes, Circuits and methods for a memory cell with a trench plate trench capacitor and a vertical bipolar read device.
  12. Leonard Forbes, Circuits and methods for a memory cell with a trench plate trench capacitor and a vertical bipolar read device.
  13. Leonard Forbes, Circuits and methods for a memory cell with a trench plate trench capacitor and a vertical bipolar read device.
  14. Noble Wendell P., Circuits and methods for a static random access memory using vertical transistors.
  15. Wendell P. Noble, Circuits and methods for a static random access memory using vertical transistors.
  16. Wendell P. Noble, Circuits and methods for a static random access memory using vertical transistors.
  17. Luk, Win K.; Cai, Jin, Computing apparatus employing dynamic memory cell structures.
  18. Abbott, Todd R., DRAM including a vertical surround gate transistor.
  19. Abbott, Todd R., DRAM including a vertical surround gate transistor.
  20. Forbes,Leonard; Geusic,Joseph E.; Ahn,Kie Y., Device, system, and method for a trench capacitor having micro-roughened semiconductor surfaces.
  21. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
  22. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
  23. Brask, Justin K.; Datta, Suman; Doczy, Mark L.; Blackwell, James M.; Metz, Matthew V.; Kavalieros, Jack T.; Chau, Robert S., Dielectric interface for group III-V semiconductor device.
  24. Luk, Win K.; Cai, Jin, Dynamic memory cell methods.
  25. Luk, Wing K.; Cai, Jin, Dynamic memory cell structures.
  26. Kavalieros, Jack T.; Mukherjee, Niloy; Dewey, Gilbert; Somasekhar, Dinesh; Doyle, Brian S., Embedded memory cell and method of manufacturing same.
  27. Jae Kap Kim KR, Ferroelectric memory integrated circuit.
  28. Radosavljevic, Marko; Datta, Suman; Doyle, Brian S.; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Majumdar, Amian; Chau, Robert S., Field effect transistor with metal source/drain regions.
  29. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  30. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  31. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  32. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  33. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  34. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  35. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  36. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  37. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  38. Noble, Wendell P.; Forbes, Leonard, Field programmable logic arrays with vertical transistors.
  39. Wendell P. Noble ; Leonard Forbes, Field programmable logic arrays with vertical transistors.
  40. Forbes, Leonard; Ahn, Kie Y., Flash memory with ultra thin vertical body transistors.
  41. Forbes,Leonard; Ahn,Kie Y., Folded bit line DRAM with vertical ultra thin body transistors.
  42. Forbes,Leonard; Ahn,Kie Y., Folded bit line DRAM with vertical ultra thin body transistors.
  43. Rudeck, Paul, High coupling floating gate transistor.
  44. Rudeck, Paul, High coupling floating gate transistor.
  45. Rudeck, Paul, High coupling floating gate transistor.
  46. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors.
  47. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  48. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  49. Chang, Peter L. D., Integration of planar and tri-gate devices on the same substrate.
  50. Chang,Peter L. D., Integration of planar and tri-gate devices on the same substrate.
  51. Tabata,Tsuyoshi; Nakazato,Kazuo; Kujirai,Hiroshi; Moniwa,Masahiro; Matsuoka,Hideyuki; Kisu, legal representative,Teruo; Kisu, legal representative,Haruko; Haga,Satoru; Kisu, deceased,Teruaki, Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device.
  52. Forbes, Leonard, Memory array and memory device.
  53. Forbes, Leonard, Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines.
  54. Forbes, Leonard, Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines.
  55. Forbes, Leonard, Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines.
  56. Slesazeck, Stefan, Memory cell array comprising floating body memory cells.
  57. Forbes,Leonard; Ahn,Kie Y., Memory having a vertical transistor.
  58. Datta,Suman; Doyle,Brian S.; Chau,Robert S.; Kavalieros,Jack; Zheng,Bo; Hareland,Scott A., Method and apparatus for improving stability of a 6T CMOS SRAM cell.
  59. Noble, Wendell P.; Forbes, Leonard; Reinberg, Alan R., Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction.
  60. Noble,Wendell P.; Forbes,Leonard; Reinberg,Alan R., Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction.
  61. Noble Wendell P. ; Forbes Leonard ; Reinberg Alan R., Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction.
  62. Noble, Wendell P.; Forbes, Leonard; Reinberg, Alan R., Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction.
  63. Noble,Wendell P.; Forbes,Leonard; Reinberg,Alan R., Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction.
  64. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  65. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  66. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  67. Leonard Forbes ; Kie Y. Ahn, Method of fabricating a semiconductor-on-insulator memory cell with buried word and body lines.
  68. Forbes Leonard ; Noble Wendell P., Method of forming a logic array for a decoder.
  69. Forbes, Leonard; Ahn, Kie Y., Method of forming a memory having a vertical transistor.
  70. Wendell P. Noble ; Leonard Forbes, Method of forming multiple oxide thicknesses for merged memory and logic applications.
  71. Doyle,Brian S.; Datta,Suman; Kavalieros,Jack T.; Majumdar,Amlan, Method of ion implanting for tri-gate devices.
  72. Forbes, Leonard, Method of making a memory array with surrounding gate access transistors and capacitors with global staggered local bit lines.
  73. Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Chau, Robert S., Method of patterning a film.
  74. Ahn, Kie Y.; Forbes, Leonard, Methods for atomic-layer deposition.
  75. Naeem, Munir D., Methods for etching tungsten stack structures.
  76. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
  77. Gordon, Haller A.; Sanh, Tang D.; Steven, Cummings, Methods of fabricating a memory device.
  78. Haller, Gordon; Tang, Sanh D.; Cummings, Steve, Methods of fabricating a memory device.
  79. Haller, Gordon; Tang, Sanh Dang; Cummings, Steve, Methods of fabricating a memory device.
  80. Kavalieros, Jack T.; Brask, Justin K.; Datta, Suman; Doyle, Brian S.; Chau, Robert S., Multigate device with recessed strain regions.
  81. Noble, Wendell P.; Forbes, Leonard, Multiple oxide thicknesses for merged memory and logic applications.
  82. Noble, Wendell P.; Forbes, Leonard, Multiple oxide thicknesses for merged memory and logic applications.
  83. Noble,Wendell P.; Forbes,Leonard, Multiple oxide thicknesses for merged memory and logic applications.
  84. Brask,Justin K.; Kavalieros,Jack T.; Doyle,Brian S.; Chau,Robert S., Non-planar microelectronic device having isolation element to mitigate fringe effects and method to fabricate same.
  85. Doyle,Brian S; Datta,Suman; Jin,Been Yih; Zelick,Nancy M; Chau,Robert, Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow.
  86. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Datta,Suman; Jin,Been Yih, Nonplanar device with stress incorporation layer and method of fabrication.
  87. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  88. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  89. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  90. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  91. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  92. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  93. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  94. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  95. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  96. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Rios,Rafael; Linton,Tom; Datta,Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  97. Brask, Justin K.; Dovle, Brian S.; Kavalleros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Nonplanar transistors with metal gate electrodes.
  98. Brask,Justin K.; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  99. Ding,Yi; Chan,Vei Han, Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate.
  100. Ding,Yi; Chan,Vei Han, Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate.
  101. Kavalieros, Jack T.; Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Datta, Suman; Doczy, Mark L.; Metz, Matthew V.; Chau, Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  102. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  103. Noble, Wendell P.; Forbes, Leonard, Programmable logic array with vertical transistors.
  104. Wendell P. Noble ; Leonard Forbes, Programmable logic array with vertical transistors.
  105. Forbes, Leonard, Programmable memory address and decode circuits with vertical body transistors.
  106. Forbes, Leonard; Noble, Wendell P., Programmable memory address decode array with vertical transistors.
  107. Rachmady, Willy; Shah, Uday; Kavalieros, Jack T.; Doyle, Brian S., Selective anisotropic wet etching of workfunction metal for semiconductor devices.
  108. Kim, Jae Kap, Semiconductor device and method of manufacturing thereof.
  109. Kim, Kyung Do, Semiconductor device having vertical pillar transistors and method for manufacturing the same.
  110. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  111. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  112. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  113. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  114. Haller, Gordon; Tang, Sanh Dang; Cummings, Steve, Semiconductor memory device.
  115. Forbes Leonard ; Ahn Kie Y., Semiconductor-on-insulator memory cell with buried word and body lines.
  116. Doyle,Brian S; Rakshit,Titash; Chau,Robert S; Datta,Suman; Brask,Justin K; Shah,Uday, Stacked multi-gate transistor design and method of fabrication.
  117. Hudait, Mantu K.; Shaheen, Mohamad A.; Chow, Loren A.; Tolchinsky, Peter G.; Fastenau, Joel M.; Loubychev, Dmitri; Liu, Amy W. K., Stacking fault and twin blocking barrier for integrating III-V on Si.
  118. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  119. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  120. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  121. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  122. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  123. Doyle, Brian S.; Jin, Been-Yih; Kavalieros, Jack T.; Datta, Suman, Substrate band gap engineered multi-gate pMOS devices.
  124. Forbes, Leonard, Surround gate access transistors with grown ultra-thin bodies.
  125. Forbes, Leonard, Surround gate access transistors with grown ultra-thin bodies.
  126. Forbes, Leonard, Surround gate access transistors with grown ultra-thin bodies.
  127. Forbes, Leonard, Surround gate access transistors with grown ultra-thin bodies.
  128. Ban,Ibrahim; Chang,Peter L. D., Tri-gate integration with embedded floating body memory cell using a high-K dual metal gate.
  129. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  130. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  131. Metz,Matthew V.; Datta,Suman; Doczy,Mark L.; Kavalieros,Jack T.; Brask,Justin K.; Chau,Robert S., Uniform silicide metal on epitaxially grown source and drain regions of three-dimensional transistors.
  132. Noble,Wendell P., Vertical gain cell and array for a dynamic random access memory and method for forming the same.
  133. Dyer, Thomas W.; Kudelka, Stephan P.; Jaiprakash, Venkatachaiam C.; Radens, Carl J., Vertical gate top engineering for improved GC and CB process windows.
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