초록 ▼

A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the

A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

대표청구항 ▼

[ What is claimed is:] [35.] A method for in-situ monitoring of a wafer while polishing the wafer with a polishing device comprising a polishing surface, said method comprising the steps of:(a) providing a polishing device comprising a polishing surface and a window, said window movably disposed wit

[ What is claimed is:] [35.] A method for in-situ monitoring of a wafer while polishing the wafer with a polishing device comprising a polishing surface, said method comprising the steps of:(a) providing a polishing device comprising a polishing surface and a window, said window movably disposed within said polishing device to move toward and away from said polishing surface; then(b) moving said window toward the polishing surface; then(c) performing an in-situ measurement of said wafer; and then(d) moving said window away from the polishing surface.