[특허]Vacuum processing and operating method with wafers, substrates and/or semiconductors

[미국특허] Vacuum processing and operating method with wafers, substrates and/or semiconductors 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F26B-005/04
출원번호	US-0390681 (1999-09-07)
우선권정보	JP-0225321 (1990-08-29)
발명자 / 주소	Kato Shigekazu,JPX Nishihata Kouji,JPX Tsubone Tsunehiko,JPX Itou Atsushi,JPX
출원인 / 주소	Hitachi, Ltd., JPX
대리인 / 주소	Antonelli, Terry, Stout & Kraus, LLP
인용정보	피인용 횟수 : 0 인용 특허 : 44

초록 ▼

This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

대표청구항 ▼

[ What is claimed is:] [1.] A method of treating a sample in a vacuum processing chamber, comprising the steps of:providing a cassette table, for mounting a cassette in which plural samples are stored, disposed under atmospheric pressure;supplying said cassette to said cassette table using one of a mechanical transfer and a manual transfer;carrying in the sample from said cassette to the vacuum processing chamber through a lock chamber;treating the sample in said vacuum processing chamber; andcarrying out said treated sample to said cassette through said lock chamber.

이 특허에 인용된 특허 (44) 인용/피인용 타임라인 분석

Savage Richard N. (Livermore CA), Apparatus and method for automatically identifying chemical species within a plasma reactor environment.
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Hijikata Isamu (Tokyo JPX) Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of semiconductor wafers by plasma reaction.
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Niwa Kazuo (Yokohama JPX), Apparatus for the treatment of semiconductors.
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Petz Andreas (Bruchkoebel DEX) Costescu Dan (Hainburg DEX), Apparatus on the carousel principle for the coating of substrates.
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Takahashi Nobuyuki (Tokyo JPX) Sugimoto Ryuji (Tokyo JPX) Shirai Yasuyuki (Tokyo JPX), Automatic loader.
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Davies John T. (El Sobrante CA) Reichelderfer Richard F. (Castro Valley CA), Computer controlled system for processing semiconductor wafers.
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Michael Klaus (Gelnhausen-Haitz DEX) Petz Andreas (Bruchkbel DEX), Device for cleaning, testing and sorting of workpieces.
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Hutchinson Martin A. (Santa Clara CA), Gate valve for wafer processing system.
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Jakubiec Antoni F. (San Mateo CA) Daley Thomas M. (San Jose CA), Isolation valve for vacuum and non-vacuum application.
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Jovanovic Dejan (Dallas TX) Randall John N. (Richardson TX), Lateral resonant tunneling device having gate electrode aligned with tunneling barriers.
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Ackley James W. (Los Altos CA), Load lock pumping mechanism.
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Giles Brian A. (Honeoye Falls NY) Schwab Frederick J. (Churchville NY), Method and apparatus for cleaning semiconductor wafers.
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Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
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Hurwitt Steven D. (Park Ridge NJ) Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
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Brooks Ray G. (Irving TX) Brooks Timothy W. (Irving TX) Corris C. James (Elkmont AL), Method and apparatus for maintaining clean articles.
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Shibata Fumio (Kudamatsu JPX) Nagatomo Katsuaki (Kudamatsu JPX) Fukuhara Hidetomo (Kudamatsu JPX) Marumoto Gen (Kudamatsu JPX) Okudaira Sadayuki (Oume JPX), Method and apparatus for plasma process.
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Lin Jung-Hui (Gilbert AZ), Method for forming a tapered opening in silicon.
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Bajor George (Melbourne FL) Rivoli Anthony L. (Palm Bay FL), Method for forming recessed oxide isolation containing deep and shallow trenches.
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Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers.
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Kawasaki Yoshinao (Kumage JPX) Kawahara Hironobu (Kudamatsu JPX) Sato Yoshiaki (Kudamatsu JPX) Fukuyama Ryooji (Kudamatsu JPX) Nojiri Kazuo (Higashimurayama JPX) Torii Yoshimi (Tachikawa JPX), Method of removing residual corrosive compounds by plasma etching followed by washing.
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Fukuyama Ryooji (Kudamatsu JPX) Nawata Makoto (Kudamatsu JPX) Kakehi Yutaka (Hikari JPX) Kawahara Hironobu (Kudamatsu JPX) Sato Yoshiaki (Kudamatsu JPX) Torii Yoshimi (Tachikawa JPX) Kawaraya Akira (, Method of treating samples.
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Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
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Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
상세보기
Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multichamber integrated process system.
상세보기
Yano Kensaku (Kanagawa JPX) Furukawa Akihiko (Tokyo JPX) Miyagawa Ryohei (Kanagawa JPX) Iida Yoshinori (Tokyo JPX), Photo chemical reaction apparatus.
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Miyamura Tadashi (Osaka JPX) Sugawara Shigeo (Osaka JPX), Plasma apparatus.
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Gallagher James P. (Newburgh NY) Schmidt ; Jr. Howard W. (Walden NY), Plasma etch cleaning in low pressure chemical vapor deposition systems.
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Davis Cecil J. (Greenville TX) Abernathy Joseph V. (Wylie TX) Matthews Robert T. (Plano TX) Hildenbrand Randall C. (Richardson TX) Simpson Bruce (Dallas TX) Bohlman James G. (Forney TX) Loewenstein L, Processing apparatus.
상세보기
Iwabuchi Katsuhiko (Sagamihara JPX), Processing apparatus.
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Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
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Hutchinson Martin A. (Santa Clara CA), Sputter module for modular wafer processing machine.
상세보기
Graves ; Jr. Walter E. (San Jose CA) Boys Donald (Cupertino CA) Turner Frederick T. (Sunnyvale CA), Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor.
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Aylwin Pedro A. (Santa Barbara CA) Corb Brinton W. (Goleta CA), Thin film magnetic recording head for minimizing undershoots.
상세보기
Aylwin Pedro A. (Santa Barbara CA) Corb Brinton W. (Goleta CA), Thin film magnetic recording head for minimizing undershoots and a method for manufacturing the same.
상세보기
Hiroki Tutomu (Yamanashi JPX), Vacuum processing apparatus.
상세보기
Kato Shigekazu (Kudamatsu JPX) Tamura Naoyuki (Kudamatsu JPX) Nishihata Kouji (Tokuyama JPX) Tsubone Tsunehiko (Hikari JPX) Itou Atsushi (Kudamatsu JPX) Nakata Kenji (Hikari JPX) Ogawa Yoshifumi (Hik, Vacuum processing system.
상세보기
Kakehi Yutaka (Hikari JPX) Nakazato Norio (Kudamatsu JPX) Fukushima Yoshimasa (Hikari JPX) Shibata Fumio (Kudamatsu JPX) Tsubone Tsunehiko (Kudamatsu JPX) Kanai Norio (Kudamatsu JPX), Vacuum processing unit and apparatus.
상세보기
Rosvold Warren C. (Sunnyvale CA), Vacuum sputtering apparatus.
상세보기
Flint Alan G. (Los Gatos CA) Jacobs William G. (San Jose CA), Wafer loading apparatus.
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Layman Frederick P. (Fremont CA) Huntley David A. (Mountain View CA) Dick Paul H. (San Jose CA) Coad George L. (Lafayette CA) Kuhlman Michael J. (Fremont CA) Vecta Roger M. (San Jose CA) Hobson Phill, Wafer processing system.
상세보기
Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.
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Hertel Richard J. (Bradford MA), Wafer transfer system.
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Hertel Richard J. (Bradford MA) Delforge Adrian C. (Rockport MA) Mears Eric L. (Rockport MA) MacIntosh Edward D. (Gloucester MA) Jennings Robert E. (Nethuen MA) Bhargava Akhil (Reading MA), Wafer transfer system.
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Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA), Wafer transfer system.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Vacuum processing and operating method with wafers, substrates and/or semiconductors 원문보기