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Electronic structure having an embedded pyrolytic graphite heat sink material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0312460 (1999-05-14)
발명자 / 주소
  • Ali M. Akbar
  • Peterson Carl W.
  • McNab Kevin M.
출원인 / 주소
  • Hughes Electronics Corporation
대리인 / 주소
    Gumestad
인용정보 피인용 횟수 : 78  인용 특허 : 22

초록 ▼

An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an interior wall of the metallic casing. The he

대표청구항

[ What is claimed is:] [1.] An electronic structure, comprising:an electronic device; anda heat sink assembly in thermal contact with the electronic device, the heat sink assembly comprising a piece of pyrolytic graphite embedded within a casing and bonded to an interior wall of the casing.

이 특허에 인용된 특허 (22)

  1. Giannetti William B. (Fall River MA) Hess David G. (Atkinson NH) McCord Stuart J. (Westford MA) Rudd ; III Robert E. (Vergennes VT) Shih Wei-Tei (Yorba Linda CA), Composite enclosure for electronic hardware.
    상세보기
  2. Eerkes Thijs (Oakville CAX) Diaz Carlos M. (Mississauga CAX) Bell James A. E. (Oakville CAX), Composite structure.
    상세보기
  3. Iida Tamaki (Tokyo JPX), Copper-foiled laminate for base plate.
    상세보기
  4. Webster Harold F. (Scotia NY) Neugebauer Constantine A. (Schenectady NY) Burgess James F. (Schenectady NY), Enhanced direct bond structure.
    상세보기
  5. Kundinger Ernst F. (Neustadt DEX) Klimesch Erich (Erlenbach DEX) Zengel Hans G. (Kleinwallstadt CT DEX) Lasher Jeffrey D. (Tolland CT), Flexible multilayer polyimide laminates.
    상세보기
  6. Kibler John J. (Lansdale PA) Cassin Thomas G. (Prospectville PA), High conductivity hydrid material for thermal management.
    상세보기
  7. Lutz Robert G. (Houston TX) Gergen William P. (Houston TX), High heat metal-polymer laminate.
    상세보기
  8. Rawal Suraj Prakash, High thermal conductivity plugs for structural panels.
    상세보기
  9. Knoell Albert C. (La Crescenta CA) Loftin Timothy A. (Semi Valley CA), Hybrid metal matrix composite chassis structure for electronic circuits.
    상세보기
  10. Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
    상세보기
  11. Schijve Jacobus (Pijnacker NLX) Vogelesang Laurens B. (Nieuwkoop NLX) Marissen Roelof (Cologne DEX), Laminate of aluminum sheet material and aramid fibers.
    상세보기
  12. Hani Kiyoshi (Sagamihara JPX) Takei Takako (Tokyo JPX) Kodama Minekazu (Takatsuki JPX) Sugano Toshiyuki (Atsugi JPX), Laminated board lined with thermally and electrically conductive material.
    상세보기
  13. Zweben Carl H. (Devon PA) Mogle Rodman A. (Clinton NY) Rodini ; Jr. Benjamin T. (Wayne PA) Thaw Charles L. (Phoenixville PA), Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite.
    상세보기
  14. Hanabusa Takayoshi (Nagano JPX) Yamamoto Kenji (Nagano JPX) Umemoto Shinzi (Suzaka JPX) Kurosawa Keiji (Nagano JPX) Yamashita Mitsuo (Nagano JPX), Method for making multilayer printed wiring board.
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  15. Browne James M., Method of making and using thermally conductive joining film.
    상세보기
  16. Sauzade Jean-Denis (Juan Les Pins FRX) L\Hote Manuel (Vence FRX), Mounting for printed circuits forming a heat sink with controlled expansion.
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  17. Utsumi, Kazuaki; Shimada, Yuzo; Suzuki, Masanori; Takamizawa, Hideo, Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material.
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  18. Kneringer Gunther (Reutte ATX) Reheis Nikolaus (Jerzens ATX) Thalman Walter (Breitenwang ATX), Process for the manufacture of a soldered joint.
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  19. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Semiconductor cooling apparatus.
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  20. Chiba Akio (Hitachi JPX) Shimizu Seiki (Hitachi JPX) Kuniya Keiichi (Hitachi JPX) Onuki Jin (Hitachi JPX), Stacked structure having matrix-fibered composite layers and a metal layer.
    상세보기
  21. Harris Ronald R. (Newark OH) Ault Russell L. (Newark OH), Structural member.
    상세보기
  22. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523), Thermally conductive joining film.
    상세보기

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