[특허]Structure and method for mounting a saw device

[미국특허] Structure and method for mounting a saw device 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-041/08
출원번호	US-0129539 (1998-08-05)
우선권정보	JP-0214332 (1997-08-08)
발명자 / 주소	Tanaka Kei,JPX Fukiharu Eiichi,JPX Tanaka Yasunori,JPX Tanioka Michinobu,JPX Otake Kenichi,JPX Funaya Takuo,JPX
출원인 / 주소	NEC Corporation, JPX
대리인 / 주소	Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
인용정보	피인용 횟수 : 25 인용 특허 : 4

초록 ▼

A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.

대표청구항 ▼

[ What is claimed is:] [1.] A structure for mounting an electronic device, said structure comprising:a substrate including substrate pads for connection;a SAW (Surface Acoustic Wave) device including a function surface on which surface pads for connection are positioned, said SAW device being mounted to said substrate with said function surface facing said substrate and with said surface pads being connected to said substrate pads of said substrate; anda photosensitive resin filling a gap between said SAW device and said substrate in a peripheral portion of said SAW device, for sealing a space adjacent an oscillation propagation section formed on said function surface of said SAW device,wherein said gap is filled by said photosensitive resin so that said photosensitive resin secures said SAW device to said mounting substrate.

이 특허에 인용된 특허 (4) 인용/피인용 타임라인 분석

Yoshinaga Takashi (Kyoto JPX) Yonemura Motohide (Kyoto JPX), Chip-type piezoelectric-resonator and method of manufacturing the same.
상세보기
Takoshima Takehiro (Furukawa JPX), Elastic surface wave element.
상세보기
Ishiyama Hideki (Nagaokakyo JA), Elastic surface wave filter.
상세보기
Onishi Keiji,JPX ; Iwaki Hideki,JPX ; Seki Shun-ichi,JPX ; Taguchi Yutaka,JPX ; Shiraishi Tsukasa,JPX ; Bessho Yoshihiro,JPX ; Kawasaki Osamu,JPX ; Eda Kazuo,JPX, Electronic part and a method of production thereof.
상세보기

이 특허를 인용한 특허 (25) 인용/피인용 타임라인 분석

Ishino, Satoshi; Kubota, Kenji; Saito, Tsuyoshi; Maesaka, Michinobu; Ogawa, Mamoru; Inoue, Jiro; Kaida, Hiroaki, Apparatus having an electronic component located on a surface of a package member with a space therebetween.
상세보기
Bauer, Christian; Krueger, Hans; Portmann, Juergen; Stelzl, Alois, Component and method for producing a component.
상세보기
Troianello Anthony E., Electro-pyrotechnic initiator.
상세보기
Takemura, Tadaji, Electronic component, method of manufacturing same, composite module including electronic component, and method of manufacturing same.
상세보기
Kamakura, Tomoyuki, Electronic device, electronic apparatus, and method of manufacturing electronic device.
상세보기
Bidard, Agn?s; Bureau, Jean-Marc, Encapsulated surface acoustic wave component and method of collective fabrication.
상세보기
Namba,Akihiko; Onishi,Keiji; Sugaya,Yasuhiro; Moritoki,Katsunori, Method for manufacturing surface acoustic wave device.
상세보기
Fukiharu Eiichi,JPX, Multichip module.
상세보기
Matsuda, Shinji, Multileveled printed circuit board unit including substrate interposed between stacked bumps.
상세보기
Matsuda, Shinji, Multileveled printed circuit board unit including substrate interposed between stacked bumps.
상세보기
Matsuda,Shinji, Multileveled printed circuit board unit including substrate interposed between stacked bumps.
상세보기
Iwamoto, Takashi; Kando, Hajime, Piezoelectric device.
상세보기
Inoue,Takashi; Matsuo,Satoshi; Namba,Akihiko, Surface acoustic wave (SAW) device.
상세보기
Jang,Ho Cheol; Lee,Choon Heung; Seo,Seong Min, Surface acoustic wave (SAW) device package and method for packaging a SAW device.
상세보기
Baba, Toshiyuki; Omura, Masashi, Surface acoustic wave device.
상세보기
Miyaji, Naomi, Surface acoustic wave device.
상세보기
Morishima Koji,JPX, Surface acoustic wave device and method for fabricating the same.
상세보기
Taga, Shigeto, Surface acoustic wave device, method for making the same, and communication apparatus including the same.
상세보기
Namba, Akihiko; Onishi, Keiji; Sugaya, Yasuhiro; Moritoki, Katsunori, Surface acoustic wave device, method for manufacturing, and electronic circuit device.
상세보기
Onishi, Keiji; Nanba, Akihiro; Sato, Hiroki; Moritoki, Katsunori; Bessho, Yoshihiro; Fujii, Kunihiro; Murakami, Kouzou, Surface acoustic wave device, method for producing the same, and circuit module using the same.
상세보기
Masuko,Shingo; Mishima,Naoyuki; Irikura,Masao, Surface acoustic wave device, package for the device, and method of fabricating the device.
상세보기
Masuko,Shingo; Mishima,Naoyuki; Irikura,Masao, Surface acoustic wave device, package for the device, and method of fabricating the device.
상세보기
Chikashi Kondo JP; Seigo Hayashi JP; Haruo Morii JP, Surface acoustic wave filter with terminal electrode coating film.
상세보기
McClure, Michael T.; Chocola, Jack; Lin, Kevin K.; Grama, George, Wafer level packaging of materials with different coefficients of thermal expansion.
상세보기
McClure,Michael T.; Chocola,Jack; Lin,Kevin K.; Grama,George, Wafer level packaging of materials with different coefficients of thermal expansion.
상세보기

활용도 분석정보

상세보기

다운로드

내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

내보내기 메뉴

내보내기 구분

파일저장
인쇄
메일전송

구성항목

기본정보
상세정보

관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC

저장형식

Text(ASCII format)
Excel format
PIAS분석(.xls)

메일정보

받는사람 (필수): @
보내는사람 (선택): @
제목
내용: KISTI 검색결과 이메일 서비스

안내

총 건의 자료가 검색되었습니다.

다운받으실 자료의 인덱스를 입력하세요. (1-10,000)

검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다.

데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요)

다운로드 파일은 UTF-8 형태로 저장됩니다.
파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오.

Text(ASCII format)
Excel format

AI-Helper ※ AI-Helper는 을 사용합니다.

AI-Helper

안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

[미국특허] Structure and method for mounting a saw device 원문보기