초록 ▼

An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosur

An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.

대표청구항 ▼

[ Thus, having described the invention, what is claimed is:] [21.] An electronic module comprisinga substrate;at least one semiconductor chip mounted on said substrate, said chip having a metal wick disposed on a surface of said chip opposite said substrate;a liquid filled cooling device mounted ove

[ Thus, having described the invention, what is claimed is:] [21.] An electronic module comprisinga substrate;at least one semiconductor chip mounted on said substrate, said chip having a metal wick disposed on a surface of said chip opposite said substrate;a liquid filled cooling device mounted over said at least one chip, said cooling device comprising a heat sink enclosure having a plurality of cooling fins extending within said heat sink enclosure; anda liquid tight seal between said cooling device and said chip, rein said chip is adapted to be cooled by the vaporization and condensation of the liquid within said cooling device as heat from said chip travels through the metal wick vaporizing the liquid which rises to condense on the cooling fins, the heat being absorbed by said heat sink enclosure and conducted to an outside surface of said heat sink enclosure.