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Linear developer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03D-005/04
  • B65D-003/00
출원번호 US-0227362 (1999-01-08)
발명자 / 주소
  • Snodgrass Ocie T.
  • Gibson Gregory M.
  • Newquist Carl W.
출원인 / 주소
  • FAStar, Ltd.
대리인 / 주소
    Fulbright & Jaworski L.L.P.
인용정보 피인용 횟수 : 50  인용 특허 : 12

초록

The inventive dispenser mechanism uniformly develops a photosensitive layer on a substrate. The mechanism uses a developer head that moves in a substantially linear relative motion with respect to the substrate and dispenses a developer at a controlled rate. Contact of the developer material with th

대표청구항

[ What is claimed is:] [1.] A method for uniformly developing a photosensitive layer on a substrate, the method comprising the steps of:moving a developer head in a substantially linear relative motion with respect to the photosensitive layer on the substrate, wherein the step of moving the develope

이 특허에 인용된 특허 (12)

  1. Chiu Wei-Kay,TWX, Acoustic wave enhanced spin coating method.
  2. Inada Hiroichi (Kumamoto JPX) Tsunematsu Kunie (Kumamoto JPX), Apparatus and method for developing resist coated on a substrate.
  3. Tanaka Hideya (Kumamoto JPX) Morioka Norimitsu (Kumamoto JPX) Yoshihara Kosuke (Kumamoto JPX), Apparatus for developing a resist-coated substrate.
  4. Mimasaka Masahiro,JPX ; Matsunaga Minobu,JPX ; Tanaka Akiko,JPX ; Uchitani Koji,JPX, Developing apparatus and developing method.
  5. Ogata Kunie,JPX, Developing method.
  6. Vijan Meera (Troy MI), Method of forming a large surface area integrated circuit.
  7. Sakai Mitsuhiro,JPX ; Nomura Masafumi,JPX ; Tsunoda Kazuaki,JPX, Processing apparatus and processing method.
  8. Bartell Roger E. (Rochester NY) Patton David L. (Webster NY) Rosenburgh John H. (Hilton NY) Piccinino ; Jr. Ralph L. (Rush NY), Recirculation, replenishment, refresh, recharge and backflush for a photographic processing apparatus.
  9. Tomoeda Takayuki (Kumamoto-ken JPX) Murakami Masaaki (Kumamoto-ken JPX) Nishioka Kenichi (Kumamoto-ken JPX), Resist processing method and apparatus.
  10. Arii Katsuyuki (Tama JPX), Spinner and method for processing a substrate.
  11. Hirose Osamu,JPX, Substrate processing apparatus.
  12. Fujimoto Akihiro,JPX, Substrate treatment apparatus.

이 특허를 인용한 특허 (50)

  1. Sayka, Anthony; Sardar, Dhiraj K.; Barrera, Frederick J.; Yow, Raylon M., Apparatus and method for cleaning a wafer.
  2. Ravkin,Mike; Boyd,John; Dordi,Yezdi N.; Redeker,Fred C.; de Larios,John M., Apparatus and method for depositing and planarizing thin films of semiconductor wafers.
  3. Sanada, Masakazu; Harumoto, Masahiko, Apparatus for developing substrate.
  4. John Martin de Larios ; Mike Ravkin ; Glen Travis ; Jim Keller ; Wilbur Krusell, Capillary proximity heads for single wafer cleaning and drying.
  5. Park, Jeong Kweon; Lee, Seung Bum; Jin, Sang Hyoung, Coating apparatus and operating method thereof.
  6. Park, Jeong Kweon; Lee, Seung Bum; Jin, Sang Hyoung, Coating apparatus and operating method thereof.
  7. Hideyuki Takamori JP, Coating film forming method and coating apparatus.
  8. Yogev, David; Uzeil, Yoram; Frisman, Lev; Wachs, Amir, Condensation-based enhancement of particle removal by suction.
  9. Korolik, Mikhail; de Larios, John M.; Ravkin, Mike; Farber, Jeffrey, Controls of ambient environment during wafer drying using proximity head.
  10. Sanada, Masakazu; Harumoto, Masahiko; Kobayashi, Hiroshi; Matsunaga, Minobu, Developing apparatus and developing method.
  11. Sanada, Masakazu; Harumoto, Masahiko; Kobayashi, Hiroshi; Matsunaga, Minobu; Morita, Akihiko, Developing apparatus and developing method.
  12. Itoh,Masamitsu; Yoneda,Ikuo; Sakurai,Hideaki, Developing method, substrate treating method, and substrate treating apparatus.
  13. Ito, Shinichi; Ema, Tatsuhiko; Hayasaki, Kei; Nakata, Rempei; Yamada, Nobuhide; Okumura, Katsuya, Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus.
  14. Ito, Shinichi; Ema, Tatsuhiko; Hayasaki, Kei; Nakata, Rempei; Yamada, Nobuhide; Okumura, Katsuya, Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus.
  15. Ito, Shinichi; Ema, Tatsuhiko; Hayasaki, Kei; Nakata, Rempei; Yamada, Nobuhide; Okumura, Katsuya, Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus.
  16. Ito,Shinichi; Ema,Tatsuhiko; Hayasaki,Kei; Nakata,Rempei; Yamada,Nobuhide; Okumura,Katsuya, Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus.
  17. Ema, Tatsuhiko; Ito, Shinichi; Okumura, Katsuya, Film-forming method, film-forming apparatus and liquid film drying apparatus.
  18. Hiranaga,Hajime; Hoshino,Tatsuya, Filters.
  19. Hiranga,Hajime; Hoshino,Tatauya; Hiromichi,Itoh, Filtration systems and fitting arrangements for filtration systems.
  20. Cheng, Wing Lau; Cheng, legal representative, Helen; Kholodenko, Arnold, Hybrid composite wafer carrier for wet clean equipment.
  21. Boehme, Dale R.; Bankert, Michelle A.; Christenson, Todd R., Liga developer apparatus system.
  22. Woods,Carl; Garcia,James P.; de Larios,John, Meniscus, vacuum, IPA vapor, drying manifold.
  23. Ravkin, Mike; Korolik, Mikhail; Wilcoxson, Mark, Method and apparatus for atomic layer deposition (ALD) in a proximity system.
  24. Boyd,John M.; Ravkin,Mike; Redeker,Fred C.; de Larios,John, Method and apparatus for cleaning a substrate using megasonic power.
  25. de Larios,John M.; Ravkin,Mike; Woods,Carl; Redeker,Fritz; Garcia,James P.; Nickhou,Afshin, Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces.
  26. Magni, Enrico; Lenz, Eric, Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer.
  27. Ravkin,Michael; Smith,Michael G. R.; de Larios,John M.; Redeker,Fritz; Korolik,Mikhail; DiPietro,Christian, Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer.
  28. Arao, Tatsuya; Yamazaki, Shunpei, Method for fabricating semiconductor film and semiconductor device and laser processing apparatus.
  29. de Larios, John Martin; Ravkin, Mike; Travis, Glen; Keller, Jim; Krusell, Wilbur, Methods for wafer proximity cleaning and drying.
  30. Mikhaylichenko, Katrina; deLarios, John, Proximity head heating method and apparatus.
  31. Ravkin, Michael; de Larios, John M.; Redeker, Fred C.; Korolik, Mikhail; Freer, Erik M., Proximity head with angled vacuum conduit system, apparatus and method.
  32. Woods,Carl; Smith,Michael G. R.; Parks,John; Garcia,James P.; de Larios,John M., Proximity meniscus manifold.
  33. Ravkin, Michael; de Larios, John M.; Korolik, Mikhail; Smith, Michael G. R.; Woods, Carl, Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same.
  34. Lenz, Eric, Reclaim chemistry.
  35. Ravkin, Mike; Kabansky, Alex; de Larios, John, Single phase proximity head having a controlled meniscus for treating a substrate.
  36. Ravkin,Michael; de Larios,John M., Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same.
  37. Woods, Carl, Substrate meniscus interface and methods for operation.
  38. Tanaka, Akiko; Sanada, Masakazu; Tamada, Osamu; Harumoto, Masahiko; Nakano, Kayoko, Substrate processing apparatus.
  39. Sakurai, Hideaki; Itoh, Masamitsu; Ito, Shinichi, Substrate processing apparatus and processing method by use of the apparatus.
  40. Orii, Takehiko; Sekiguchi, Kenji; Uchida, Noritaka; Tanaka, Satoru; Ohno, Hiroki, Substrate processing method and substrate processing apparatus.
  41. Orii, Takehiko; Sekiguchi, Kenji; Uchida, Noritaka; Tanaka, Satoru; Ohno, Hiroki, Substrate processing method and substrate processing apparatus.
  42. Sekiguchi, Kenji; Uchida, Noritaka; Tanaka, Satoru; Ohno, Hiroki, Substrate processing method and substrate processing apparatus.
  43. Sekiguchi, Kenji; Uchida, Noritaka; Tanaka, Satoru; Ohno, Hiroki, Substrate processing method and substrate processing apparatus.
  44. Nakamori, Mitsunori; Saito, Yusuke; Ishihara, Akira; Tanaka, Satoru; Murakami, Yuji, Substrate processing method, substrate processing apparatus, and storage medium.
  45. Woods,Carl; Smith,Michael G. R.; Parks,John, Substrate proximity processing housing and insert for generating a fluid meniscus.
  46. Woods,Carl; de Larios,John, System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold.
  47. Boyd, John M.; Redeker, Fred C., System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology.
  48. O'Donnell, Robert; Lin, Cheng-Yu (Sean); Kholodenko, Arnold, System, method and apparatus for maintaining separation of liquids in a controlled meniscus.
  49. Kazuki Kobayashi JP; Toshiaki Muratani JP; Hiroto Yoshioka JP, Ultrasound cleaning device and resist-stripping device.
  50. Yun, Seokmin; Boyd, John M.; de Larios, John M.; Redeker, Fritz, Wafer edge surface treatment with liquid meniscus.
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