초록 ▼

In a polishing apparatus, a polishing pad 102 is fixed on top of a circular platen 101. The platen 101 is rotated. A carrier 103 holds either a wafer product or an adjusting wafer. The material of the adjusting wafer is equivalent to the principle component which makes up the surface layer of the wa

In a polishing apparatus, a polishing pad 102 is fixed on top of a circular platen 101. The platen 101 is rotated. A carrier 103 holds either a wafer product or an adjusting wafer. The material of the adjusting wafer is equivalent to the principle component which makes up the surface layer of the wafer product. The carrier 103 is rotated. The carrier 103 is lowered above the rotating platen 101, and a given load is added, thereby polishing the polishing pad 102. A dressing mechanism 106, comprised of a dresser 107, is placed beside the platen 101. The polishing arm 108 is revolvable, so the carrier 103 can be horizontally moved. A loading cup 110 and an unloading cup 111 are both fixed within the path range where the carrier 103 moves. A loader 109 and an unloading unit 112 are both placed near the respective loading cup 110 and unloading cup 111. A cleaning platen 113 is also fixed within the path range where the carrier 103 moves. An adjusting wafer/storage unit 114 is fixed within the path range where the carrier 103 is moved by the rotation of the polishing arm 108. The adjusting wafer 124 is used to adjust the surface of the polishing pad 102.

대표청구항 ▼

[ What is claimed is:] [1.] A polishing apparatus, comprising:a polishing pad for polishing an object;an adjusting tool for adjusting a surface of said polishing pad, said adjusting tool composed entirely of a main ingredient of a surface layer of said object;a first unit for holding said object and

[ What is claimed is:] [1.] A polishing apparatus, comprising:a polishing pad for polishing an object;an adjusting tool for adjusting a surface of said polishing pad, said adjusting tool composed entirely of a main ingredient of a surface layer of said object;a first unit for holding said object and pressing said object against said polishing pad;a second unit for holding said adjusting tool and pressing said adjusting tool against said polishing pad when said object is not pressed against said polishing pad; anda third unit for holding a dresser and pressing said dresser against said polishing pad whereby said dresser scrapes said surface of said polishing pad.