초록 ▼

A semiconductor device fabrication system comprises a central hub area and multiple concentric ring sections circumferentially provided around the hub area. Each of the ring sections has a plurality of modular process units (MPUs) each receiving about three in-line semiconductor device processing st

A semiconductor device fabrication system comprises a central hub area and multiple concentric ring sections circumferentially provided around the hub area. Each of the ring sections has a plurality of modular process units (MPUs) each receiving about three in-line semiconductor device processing stations therein and having the size of a standard shipping container for conveniently outgoing heavy repair. The MPUs are successively disposed around the hub area with the walls positioned radially of the hub area. Service facilities and handling piping system are provided under the MPUs. Each of the ring sections has a conveying track provided adjacent to the ring-shaped arranged MPUs for communication with the MPUs. A human maintenance system is provided in the system for carrying service persons to get into and out of the MPUs through the sidewalls thereof for light repair. The central hubs for common services or particular processes is communicated with the innermost ring section by providing multiple crossovers therebetween.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor device fabrication system, comprising:a central hub area;at least one ring section circumferentially provided around the hub area, the ring section including:a plurality of modular process units, each having two opposite sidewalls and two opposite endwalls

[ What is claimed is:] [1.] A semiconductor device fabrication system, comprising:a central hub area;at least one ring section circumferentially provided around the hub area, the ring section including:a plurality of modular process units, each having two opposite sidewalls and two opposite endwalls which define an internal space, the modular process units being successively disposed around the hub area with the sidewalls positioned radially of the hub area, the modular process unit including:at least one semiconductor device processing station disposed in the internal space;an air conditioning system provided at a top of the internal space;at least two through doors formed at one of the sidewalls of the unit;a plurality of service facilities correspondingly provided under the modular process units;a handling piping system provided under the service facilities;a conveying track correspondingly provided adjacent to the modular process units;passages provided for connection between the modular process units and the conveying track through the through doors; andat least one maintenance track which is provided adjacent to the modular process units and opposite to the conveying track, the maintenance track having at least one container thereon which is accessible to the internal space of each of the modular process units.