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Two-phase or mono-phase heat exchanger for electronic power component 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0233156 (1999-01-19)
우선권정보 FR-0000744 (1998-01-19)
발명자 / 주소
  • Julien Jean-Noel,FRX
  • Lachise Jacques,FRX
출원인 / 주소
  • Ferraz Date Industries, FRX
대리인 / 주소
    Dowell & Dowell, P.C.
인용정보 피인용 횟수 : 46  인용 특허 : 7

초록

A two-phase or mono-phase heat-exchanger for at least one electronic power component wherein the heat-exchanger supports a plurality of heat exchange tubes, each having a heat exchange fluid therein, and wherein said heat-exchanger includes at least one rigid plate provided with zones for receiving

대표청구항

[ What is claimed is:] [1.] Two-phase or mono-phase heat-exchanger for at least one electronic power component, said exchanger comprising, a unit for heat-exchange with said component and a plurality of heat exchange tubes each containing a heat exchanging fluid, said tubes being mounted in heat exc

이 특허에 인용된 특허 (7)

  1. Morton David M. (Eau Claire WI), Board-mounted thermal path connector and cold plate.
  2. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  3. Murase Takashi (Yokohama JPX) Koizumi Tatsuya (Tokyo JPX), Heat pipe heat sink for semiconductor devices.
  4. Yu Shu-Jen,TWX, Heat-radiating structure for CPU.
  5. Kadowaki Hidejiro (Yokohama JPX) Tsuchii Ken (Tokyo JPX) Wataya Masafumi (Kawasaki JPX) Yanaka Toshiyuki (Tokyo JPX) Takahashi Haruhiko (Yokohama JPX) Takamiya Makoto (Kawasaki JPX) Yamamoto Kosuke (, Ink jet recording apparatus with plural heat pipes for temperature stabilization.
  6. Adams Douglas R., Metered gas control in a substrate processing apparatus.
  7. Ishibashi Chihiro (Aichi JPX) Abe Hiroyuki (Anjyo JPX) Matsuoka Susumu (Nagoya JPX), Power semiconductor device with heat dissipating property.

이 특허를 인용한 특허 (46)

  1. Connors, Matthew Joseph, Bi-level heat sink.
  2. Connors, Matthew Joseph, Bi-level heat sink.
  3. Ru-Ching Wang TW, Compact heat sink module.
  4. Chou, Ming De, Cooling device.
  5. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  6. Dong Gyu Lee KR; Jae Sea Koo KR, Cooling device of linear power amplifier in mobile communication system.
  7. Takahashi, Tetsuya; Toya, Kazuyoshi; Murahashi, Akihiro; Nakayama, Yasushi; Ipposhi, Shigetoshi; Hayashi, Kenichi, Electric power conversion apparatus including cooling units.
  8. Gorbounov, Mikhail B.; Piech, Zbigniew; Blasko, Vladimir; Marvin, Daryl J.; Veronesi, William A.; Fedchenia, Igor I.; Wang, Jinliang, Elevator machine motor and drive and cooling thereof.
  9. Gailus, David W; Clemens, Donald L., Heat collector with mounting plate.
  10. Chang,Hung, Heat dissipating device.
  11. Ying,Guo Liang; Huang,Ai Min; Lin,Shu Ho, Heat dissipating device.
  12. Sheng,Jian Qing; Lee,Meng Tzu; Lin,Shu Ho, Heat dissipating device with heat pipe.
  13. Sheng,Jian Qing; Lee,Meng Tzu; Lin,Shu Ho, Heat dissipating device with heat pipe.
  14. Huang,Tsung Hsien, Heat dissipating module.
  15. Chen, Chun-Chi; Fu, Meng, Heat dissipation device.
  16. Chen, Chun-Chi; Fu, Meng, Heat dissipation device.
  17. Lai,Cheng Tien; Zhou,Zhi Yong; Wen,Jiang Jian, Heat dissipation device.
  18. Feng, Taqing; Li, Zhijian; Hong, Yuping; Chen, Hongliang; Shi, Jian, Heat dissipation device and radio frequency module with the same.
  19. Zhou, Shi-Wen; Liu, Peng; Cao, Jun, Heat dissipation device having a fan for dissipating heat generated by at least two electronic components.
  20. Garner, Scott, Heat dissipation unit with direct contact heat pipe.
  21. Todd, John J.; Longsderff, David R.; Toth, Jerome E., Heat pipe fin stack with extruded base.
  22. Todd,John J.; Longsderff,David R.; Toth,Jerome E., Heat pipe fin stack with extruded base.
  23. Wang,David G.; Muller,P. Keith, Heat sink for enhanced heat dissipation.
  24. Li, Chin-Yuan, Heat sink module.
  25. Malone,Christopher G.; Miyamura,Harold, Heat sink with angled heat pipe.
  26. Malone,Christopher G.; Miyamura,Harold, Heat sink with heat pipe in direct contact with component.
  27. Lai, Cheng-Tien; Zhou, Zhi-Yong; Liu, Yi-San, Heat sink with heat pipes.
  28. Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
  29. Chiang, Tsai Liang, Integrated heat dissipation apparatus.
  30. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  31. Garner, Scott, Method for forming a heat dissipation device.
  32. Lin, Kuo-Len; Liu, Wen-Jung; Cheng, Chih-Hung; Hsu, Ken, Method of flatting evaporating section of heat pipe embedded in heat dissipation device.
  33. Artman, Paul T.; Tunks, Eric, Multiple heat pipe heat sink.
  34. Kevin A. McCullough, Net-shape molded heat exchanger.
  35. Nikfar,Nader, RF power amplifier assembly with heat pipe enhanced pallet.
  36. Sagal, E. Mikhail, Radial fin thermal transfer element and method of manufacturing same.
  37. Lin, Hsin-Cheng, Radiator assembly.
  38. Meyer, IV, George Anthony; Sun, Chien-Hung; Chen, Chieh-Ping, Solar power system with tower type heat dissipating structure.
  39. Zeighami,Roy M.; Belady,Christian L.; Edwards,Glen, System and method for cooling electronic assemblies.
  40. Wilson, James S., Thermal management system and method for thin membrane type antennas.
  41. Wu, Chun-Ming; Yu, Ming-Han, Thermal module structure.
  42. Sagal, E. Mikhail, Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit.
  43. Shiaw-Jong S. Chen ; Roger J. Hooey, Top mounted cooling device using heat pipes.
  44. Mochizuki,Masataka; Mashiko,Koichi, Tower type heat sink.
  45. Chen, Kuo Jui, Tube-style radiator structure for computer.
  46. Machiroutu, Sridhar V.; Walters, Joseph D., Using micro heat pipes as heat exchanger unit for notebook applications.
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