초록 ▼

A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disp

A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

대표청구항 ▼

[ What is claimed is:] [1.] A method of curing a combination of a top and a bottom substrate with a resin disposed in-between, comprising:performing a single curing operation that inherently warps the combination in one direction and fully cures the resin;inducing a temperature gradient between the

[ What is claimed is:] [1.] A method of curing a combination of a top and a bottom substrate with a resin disposed in-between, comprising:performing a single curing operation that inherently warps the combination in one direction and fully cures the resin;inducing a temperature gradient between the top and bottom substrate to manipulate the combination in a direction opposite to the one direction wherein the temperature gradient inducing operation is performed before the curing operation. [5.] A system for curing a combination of a top and a bottom substrate with a resin disposed in-between, comprising:a single cure device that inherently warps the combination in one direction and fully cures the resin as a result of a single curing operation that the cure device performs on the combination;a temperature gradient inducing device disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby manipulate the combination in a direction opposite to the one direction wherein the temperature gradient inducing device is arranged to operate before the cure device is to operate so as to thermally manipulate the combination before curing.