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System for processing substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0502860 (1995-07-14)
발명자 / 주소
  • Maher Joseph A.
  • Vowles E. John
  • Napoli Joseph D.
  • Zafiropoulo Arthur W.
  • Miller Mark W.
출원인 / 주소
  • Applied Materials, Inc.
인용정보 피인용 횟수 : 21  인용 특허 : 55

초록

A substrate processing system is provided that includes substrate processing vessels, a substrate queuing station, a substrate transfer device, and a processor. The processor, in communication with the processing vessels, the queuing station, and the transfer device, provides selectable single and m

대표청구항

[ What is claimed is:] [1.] A substrate surface processing system, comprising:a plurality of surface processing vessels each having an ingress and egress defining port that are arrayed about a spacial locus in such a way that the several ports thereof are accessible from a single location spaced fro

이 특허에 인용된 특허 (55)

  1. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  2. Foster Robert (San Francisco CA) Wang David N. (Cupertino CA) Somekh Sasson (Redwood City CA) Maydan Dan (Los Altos Hills CA), Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition.
  3. Mintz Donald M. (Sunnyvale CA), Apparatus and method for manufacturing planarized aluminum films.
  4. Radford, Kenneth C.; Keller, Herbert W.; Parks, Beryl H.; Fuller, Robert R., Apparatus for coating nuclear fuel pellets with a burnable absorber.
  5. Richards Edmond A. (Marlton NJ), Apparatus for conveying a semiconductor wafer.
  6. Bok Edward (Burg. Amersfoordtlaan 82 1171 DR Badhoevedorp NLX), Apparatus for floating transport and processing of substrate or tape.
  7. Kamohara Hideaki (Ibaraki JPX) Fujioka Kazumasa (Ibaraki JPX) Kobari Toshiaki (Ibaraki JPX) Takahashi Kunihiro (Ibaraki JPX) Ueda Shinjiro (Abiko JPX), Apparatus for manufacturing semiconductors.
  8. Sato, Kazuo; Yamaguchi, Sumio; Kato, Shigeo; Matsumura, Yasuhide; Mizumoto, Muneo; Okuno, Sumio; Tamura, Naoyuki, Apparatus for molecular beam epitaxy.
  9. Tateishi Hideki (Yokohama JPX) Kamei Tsuneaki (Kanagawa JPX) Abe Katsuo (Yokosuka JPX) Kobayashi Shigeru (Kawasaki JPX) Aiuchi Susumu (Yokohama JPX) Nakatsukasa Masashi (Tama JPX) Takahashi Nobuyuki , Apparatus for performing continuous treatment in vacuum.
  10. Gallego JosM. (Ormskirk GB2), Apparatus for the deposition of multi-layer coatings.
  11. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of a wafer by plasma reaction.
  12. Hijikata Isamu (Tokyo JPX) Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of semiconductor wafers by plasma reaction.
  13. Uehara Akira (Yokohama JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for the treatment of wafer materials by plasma reaction.
  14. Giammanco Rosario P. (Gloucester MA), Article delivery and transport apparatus for evacuated processing equipment.
  15. Nakane Hisashi (Kawasaki JPX) Uehara Akira (Yokohama JPX) Miyazaki Shigekazu (Sagamihara JPX) Kiyota Hiroyuki (Hiratsuka JPX) Hijikata Isamu (Tokyo JPX), Automatic apparatus for continuous treatment of leaf materials with gas plasma.
  16. Uehara, Akira; Hijikata, Isamu; Nakane, Hisashi; Nakayama, Muneo, Automatic plasma processing device and heat treatment device.
  17. Tateishi Hideki (Yokohama JPX) Shimizu Tamotsu (Yokohama JPX) Aiuchi Susumu (Yokohama JPX) Iwashita Katsuhiro (Yokohama JPX) Nakamura Hiroshi (Fuchu JPX), Continuous sputtering apparatus.
  18. Sutton Richard C. (Rochester NY) Martin Thomas W. (Rochester NY), Dichromated hydrophilic colloid-latex copolymer compositions.
  19. Kurasaki Howard S. (San Jose CA) Westlund Barbara F. (Saratoga CA) Nulty James E. (San Jose CA) Vowles E. John (Deering NH), Dry etch process for forming champagne profiles, and dry etch apparatus.
  20. Yamamoto ; Shinichi ; Sumitomo ; Yasusuke ; Horiike ; Yasuhiro ; Shibag aki ; Masahiro, Etching apparatus using a plasma.
  21. Hutchinson Martin A. (Santa Clara CA), Gate valve for wafer processing system.
  22. Bouchaib Pierre (L\Etang la Ville FRX), Installation for treatment of materials for the production of semi-conductors.
  23. Ackley James W. (Los Altos CA), Load lock pumping mechanism.
  24. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Cheng Mei (San Jose CA) Cheng David (San Jose CA), Magnetron-enhanced plasma etching process.
  25. Hurwitt Steven D. (Park Ridge NJ) Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
  26. Shibata Fumio (Kudamatsu JPX) Nagatomo Katsuaki (Kudamatsu JPX) Fukuhara Hidetomo (Kudamatsu JPX) Marumoto Gen (Kudamatsu JPX) Okudaira Sadayuki (Oume JPX), Method and apparatus for plasma process.
  27. Hugues Jean B. (Tempe AZ) Weber Lynn (Saratoga CA) Herlinger James E. (Palo Alto CA) Nishikawa Katsuhito (San Jose CA) Schuman Donald L. (Saratoga CA) Yee Gary W. (Santa Clara CA), Method and apparatus for transferring wafers between cassettes and a boat.
  28. Rubin Richard H. (Fairfield NJ) Petrone Benjamin J. (Netcong NJ) Heim Richard C. (Mountain View CA) Pawenski Scott M. (Wappingers Falls NY), Modular processing apparatus for processing semiconductor wafers.
  29. Vowles E. John (Deering NH) Maher Joseph A. (Wenham MA) Napoli Joseph D. (Windham NH), Modular vapor processor system.
  30. Bok Edward (Badhoevedorp NLX), Module for high vacuum processing.
  31. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  32. Maher, Jr., Joseph A.; Zafiropoulo, Arthur W., Multi-planar electrode plasma etching.
  33. Maher ; Jr. Joseph A. (Hamilton MA) Zafiropoulo Arthur W. (Manchester MA), Plasma cassette etcher.
  34. Hockersmith Dan T. (Garland TX) Gilbert Joe W. (Leonard TX), Plasma etch movable substrate.
  35. Zafiropoulo Arthur W. (Manchester MA) Mayer ; Jr. Joseph A. (Hamilton MA), Plasma etchant mixture.
  36. Otsubo Toru (Fujisawa JPX) Yamaguchi Yasuhiro (Chigasaki JPX) Takeuchi ; deceased Takahiko (late of Tokyo JPX by Kinichi Takeuchi ; legal representative), Plasma processing apparatus.
  37. Warenback, Douglas H.; Rathmann, Thomas M.; Mirkovich, Ninko T., Plasma reactor chuck assembly.
  38. Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Jones John I. (Plano TX) Jaspersen William S. (Dallas TX), Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate.
  39. Mimura Takashi (Machida JPX) Hikosaka Kohki (Yokohama JPX) Odani Kouichiro (Sagamihara JPX), Process and apparatus for fabricating a semiconductor device.
  40. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  41. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  42. Hutchinson Martin A. (Santa Clara CA), Sputter module for modular wafer processing machine.
  43. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA), Sputter module for modular wafer processing system.
  44. Takahashi Nobuyuki (Fuchu JPX) Kitahara Hiroaki (Fuchu JPX), Substrate processing apparatus.
  45. Takahashi Nobuyuki (Tokyo JPX), Substrate processing apparatus.
  46. Slabaugh Edward J. (San Jose CA), Substrate rotation method and apparatus.
  47. Strahl Thomas L. (Fremont CA) Lamont ; Jr. Lawrence T. (San Jose CA) Peterson Carl T. (Fremont CA) Brown Hobart A. (Santa Cruz CA) McCormick Lonnie W. (Cupertino CA) Mosely Roderick C. (Mountain View, System and method for processing workpieces.
  48. Layman Frederick P. (Fremont CA) Kuhlman Michael J. (Fremont CA), System for measuring the position of a wafer in a cassette.
  49. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), System providing multiple processing of substrates.
  50. Madan Arun (Golden CO) Von Roedern Bolko (Wheat Ridge CO), Thin film deposition apparatus including a vacuum transport mechanism.
  51. Hutchinson, Martin A.; Shaw, R. Howard; Coad, George, Transfer plate rotation system.
  52. Turner Frederick T. (Sunnyvale CA) Hutchinson Martin A. (Santa Clara CA) Shaw R. Howard (Palo Alto CA) Lamont ; Jr. Lawrence T. (Mountain View CA), Wafer coating system.
  53. Hobson Phillip M. (Los Altos CA) Dick Paul H. (San Jose CA), Wafer processing chuck using slanted clamping pins.
  54. Layman Frederick P. (Fremont CA) Huntley David A. (Mountain View CA) Dick Paul H. (San Jose CA) Coad George L. (Lafayette CA) Kuhlman Michael J. (Fremont CA) Vecta Roger M. (San Jose CA) Hobson Phill, Wafer processing system.
  55. Coad George L. (Lafayette CA) Shaw R. Howard (Palo Alto CA) Hutchinson Martin A. (Santa Clara CA), Wafer transfer system.

이 특허를 인용한 특허 (21)

  1. Lee, Young Jong; Choi, Jun Young; Jo, Saeng Hyun; Yoon, Byung-Oh; Kim, Gyeong-Hoon; Jeong, Hong-Gi, Apparatus for manufacturing flat-panel display.
  2. Peng, Chiang Jen; Chen, Dian Hau, In-situ photoresist removal by an attachable chamber with light source.
  3. Meulen, Peter van der, Linear semiconductor processing facilities.
  4. van der Meulen, Peter, Linear semiconductor processing facilities.
  5. Price, J. B.; Keller, Jed; Dulmage, Laurence; Adams, David; Winger, Eric; Wise, Lawrence, Linear wafer drive for handling wafers during semiconductor fabrication.
  6. Kim, Jaeyoung; Hoffman, James; Kitani, Atsushi; Kwon, Young Taek, Method and apparatus for handling substrates in a processing system having a buffer chamber.
  7. Bachrach, Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  8. Bachrach,Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  9. Ko, Yong Deuk; Oh, Se Jin; Jung, Chan Ouk; Hwang, Jeng H., Method of reducing particulates in a plasma etch chamber during a metal etch process.
  10. van der Meulen, Peter, Mid-entry load lock for semiconductor handling system.
  11. van der Meulen, Peter, Semiconductor manufacturing systems.
  12. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  13. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  14. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  15. Hur, Gwang Ho; Choi, Jun Young; Lee, Sang Baek; Lee, Cheol Won, Transfer chamber for flat display device manufacturing apparatus.
  16. Hur, Gwang Ho; Choi, Jun Young; Lee, Sang Baek; Lee, Cheol Won, Transfer chamber for flat display device manufacturing apparatus.
  17. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  18. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  19. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  20. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  21. Ohashi, Tomohiro; Makino, Akitaka; Kitada, Hiroho; Kihara, Hideki, Wafer processing based on sensor detection and system learning.
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