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Reverse linear polisher with loadable housing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0201928 (1998-12-01)
발명자 / 주소
  • Talieh Homayoun
출원인 / 주소
  • Nutool, Inc.
대리인 / 주소
    Pillsbury Madison & Sutro LLP
인용정보 피인용 횟수 : 64  인용 특허 : 10

초록 ▼

The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse

대표청구항

[ I claim:] [11.] A method of polishing a surface of a semiconductor wafer, the method comprising the steps of:supporting the wafer such that the surface of the wafer is exposed to a polishing pad; andpolishing the surface of the wafer by moving the polishing pad bidirectional linearly.

이 특허에 인용된 특허 (10)

  1. Pollock John J., Anti-shear method and system for semiconductor wafer removal.
    상세보기
  2. Talieh Homayoun (San Jose CA), Chemical mechanical polishing apparatus with improved slurry distribution.
    상세보기
  3. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
    상세보기
  4. Heynacher Erich (Heidenheim DEX), Method and apparatus for lapping and polishing optical surfaces.
    상세보기
  5. Kato Tadahiro (Fukushima-ken JPX) Kudo Hideo (Fukushima-ken JPX), Method for production of silicon wafer and apparatus therefor.
    상세보기
  6. Uzoh Cyprian Emeka ; Harper James McKell Edwin, Method of electrochemical mechanical planarization.
    상세보기
  7. Baldy Andr (Seyssins FRX) Barrois Grard (Le Fontanil FRX) Blanc Henri (Saint Julien de Ratz FRX) Dominiak Marcel (Grenoble FRX), Polishing machine having a taut microabrasive strip and an improved wafer support head.
    상세보기
  8. Bleck Martin C. ; Reardon Timothy J. ; Bergman Eric J., Semiconductor processor with wafer face protection.
    상세보기
  9. Miller Gabriel L. (Westfield NJ) Wagner Eric R. (South Plainfield NJ), Slurry polisher using ultrasonic agitation.
    상세보기
  10. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA), Wafer polishing machine with fluid bearings.
    상세보기

이 특허를 인용한 특허 (64)

  1. Lugg, Paul S., Abrasive article for the deposition and polishing of a conductive material.
    상세보기
  2. Talieh, Homayoun; Basol, Bulent M., Advanced chemical mechanical polishing system with smart endpoint detection.
    상세보기
  3. Talieh,Homayoun; Basol,Bulent M., Advanced chemical mechanical polishing system with smart endpoint detection.
    상세보기
  4. Talieh, Homayoun; Volodarsky, Konstantin; Ashjaee, Jalal; Young, Douglas W., Apparatus and method for loading a wafer in polishing system.
    상세보기
  5. Manoocher Birang ; Lawrence M. Rosenberg ; Sasson Somekh ; John M. White, Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet.
    상세보기
  6. Birang, Manoocher; Rosenberg, Lawrence M; Sandra L. Rosenberg,; Somekh, Sasson R; White, John M, Chemical mechanical polishing apparatus with rotating belt.
    상세보기
  7. Birang,Manoocher; Rosenberg, legal representative,Sandra L.; Somekh,Sasson; White,John M; Rosenberg, deceased,Lawrence M., Chemical mechanical polishing apparatus with rotating belt.
    상세보기
  8. Birang,Manoocher; Rosenberg,Lawrence M.; Somekh,Sasson; White,John M., Chemical mechanical polishing apparatus with rotating belt.
    상세보기
  9. Farrar,Paul A., Chemical mechanical polishing system and process.
    상세보기
  10. John M. White, Chemical mechanical polishing with a moving polishing sheet.
    상세보기
  11. Kovarsky,Nicolay; Yang,Michael; Lubomirsky,Dmitry, Contact plating apparatus.
    상세보기
  12. Herchen,Harald, Contact ring with embedded flexible contacts.
    상세보기
  13. Herchen,Harald; Lubomirsky,Dmitry; Zheng,Bo; Pang,Lily L., Electric field reducing thrust plate.
    상세보기
  14. Lee, Whonchee; Meikle, Scott, Electro-mechanically polished structure.
    상세보기
  15. Basol,Bulent M.; Talieh,Homayoun, Electrochemical mechanical processing apparatus.
    상세보기
  16. Burkhart,Vincent E.; Herchen,Harald; Yahalom,Joseph, Liquid isolation of contact rings.
    상세보기
  17. Lee,Whonchee; Meikle,Scott G., Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates.
    상세보기
  18. Duboust, Alain; Chang, Shou-Sung; Chen, Liang-Yuh; Wang, Yan; Neo, Siew; Sun, Lizhong; Liu, Feng Q., Method and apparatus for face-up substrate polishing.
    상세보기
  19. Lee,Whonchee; Meikle,Scott G.; Blalock,Guy, Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate.
    상세보기
  20. Chopra, Dinesh, Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates.
    상세보기
  21. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
    상세보기
  22. Lee, Whonchee; Meikle, Scott G.; Blalock, Guy T., Method for forming a microelectronic structure having a conductive material and a fill material with a hardness of 0.04 GPA or higher within an aperture.
    상세보기
  23. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
    상세보기
  24. Lee, Whonchee; Meikle, Scott G.; Blalock, Guy T., Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing.
    상세보기
  25. Lee, Whonchee; Moore, Scott E.; Meikle, Scott G., Method for selectively removing conductive material from a microelectronic substrate.
    상세보기
  26. Chopra,Dinesh, Method for simultaneously removing multiple conductive materials from microelectronic substrates.
    상세보기
  27. Anderson, II, Robert L.; Charatan, Robert, Method of and platen for controlling removal rate characteristics in chemical mechanical planarization.
    상세보기
  28. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  29. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
    상세보기
  30. Lee, Whonchee; Meikle, Scott G.; Moore, Scott E.; Doan, Trung T., Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate.
    상세보기
  31. Lee,Whonchee; Meikle,Scott G.; Moore,Scott E.; Doan,Trung T., Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate.
    상세보기
  32. Lee,Whonchee; Meikle,Scott G.; Moore,Scott E., Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate.
    상세보기
  33. Lee, Whonchee; Moore, Scott E.; Meikle, Scott G., Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium.
    상세보기
  34. Lee,Whonchee; Moore,Scott E.; Meikle,Scott G., Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium.
    상세보기
  35. Moore,Scott E.; Lee,Whonchee; Meikle,Scott G.; Doan,Trung T., Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces.
    상세보기
  36. Lee, Whonchee; Moore, Scott E.; Meikle, Scott G., Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate.
    상세보기
  37. Lee, Whonchee; Moore, Scott E.; Meikle, Scott G., Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate.
    상세보기
  38. Lee,Whonchee; Moore,Scott E.; Meikle,Scott G., Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate.
    상세보기
  39. Lee, Whonchee; Moore, Scott E.; Vaartstra, Brian A., Methods and apparatus for removing conductive material from a microelectronic substrate.
    상세보기
  40. Lee,Whonchee; Moore,Scott E.; Vaartstra,Brian A., Methods and apparatus for removing conductive material from a microelectronic substrate.
    상세보기
  41. Moore,Scott E., Methods and apparatus for removing conductive material from a microelectronic substrate.
    상세보기
  42. Lee, Whonchee; Moore, Scott E.; Meikle, Scott G., Methods and apparatus for selectively removing conductive material from a microelectronic substrate.
    상세보기
  43. Lee,Whonchee; Moore,Scott E.; Meikle,Scott G., Methods and apparatus for selectively removing conductive material from a microelectronic substrate.
    상세보기
  44. Lee, Whonchee, Methods and apparatuses for electrochemical-mechanical polishing.
    상세보기
  45. Lee, Whonchee, Methods and apparatuses for electrochemical-mechanical polishing.
    상세보기
  46. Lee,Whonchee, Methods and apparatuses for electrochemical-mechanical polishing.
    상세보기
  47. Lee, Whonchee; Sabde, Gundu M., Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media.
    상세보기
  48. Lee, Whonchee; Sabde, Gundu M., Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media.
    상세보기
  49. Owczarz, Alek; Boyd, John; Kistler, Rod, Methods using active retainer rings for improving edge performance in CMP applications.
    상세보기
  50. Lee,Whonchee; Meikle,Scott G.; Moore,Scott E., Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material.
    상세보기
  51. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.
    상세보기
  52. Saldana, Miguel A.; Owczarz, Aleksander A., Oscillating fixed abrasive CMP system and methods for implementing the same.
    상세보기
  53. White, John M.; Sommer, Phillip R.; Fisher, Stephen, Planarization system with multiple polishing pads.
    상세보기
  54. Owczarz, Alek; Boyd, John; Kistler, Rod, Platen design for improving edge performance in CMP applications.
    상세보기
  55. Kiermasz,Adrian; Saldana,Miguel A., Platen with diaphragm and method for optimizing wafer polishing.
    상세보기
  56. Kistler, Rod; Boyd, John; Owczarz, Alek, Pressurized membrane platen design for improving performance in CMP applications.
    상세보기
  57. Mayer, Steven T.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  58. Mayer, Steven T.; Drewery, John; Hill, Richard S.; Archer, Timothy; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  59. Mayer, Steven T.; Stowell, Marshall R.; Drewery, John S.; Hill, Richard S.; Archer, Timothy M.; Kepten, Avishai, Selective electrochemical accelerator removal.
    상세보기
  60. Wu,Li; Mishra,Sourabh; Paik,Young J.; Kumaraswamy,Satyasrayan; Lum,Robert; Chan,Chiu; Groechel,David, System and method for chemical mechanical planarization.
    상세보기
  61. Basol, Bulent M.; Talieh, Homayoun, System and method for electrochemical mechanical polishing.
    상세보기
  62. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  63. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
    상세보기
  64. Klein,Martin P.; Keigler,Arthur; Felsenthal,David, Ultra-thin wafer handling system.
    상세보기

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