[특허]Printed circuit board and chip-on-board packages using same

[미국특허] Printed circuit board and chip-on-board packages using same 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	A01L-023/28 A01L-023/02 A01L-023/495 A01L-023/48 A01L-023/52
출원번호	US-0087903 (1998-05-01)
우선권정보	KR-0030871 (1997-07-03)
발명자 / 주소	Shin Bo Hyun,KRX An Min Cheol,KRX
출원인 / 주소	Samsung Electronics Co., Ltd., KRX
대리인 / 주소	Jones Volentine, LLP
인용정보	피인용 횟수 : 15 인용 특허 : 3

초록 ▼

A printed circuit board (PCB) for use in chip-on-board (COB) packages reduces failures due to warping of the COB packages. The PCB includes a board body having a upper surface and a lower surface, a chip bonding area on the upper surface for attaching a semiconductor device, and a plurality of conductors in a circuit pattern on the upper surface outside the chip bonding area, for electrical connection to the semiconductor device using a plurality of bonding wires. An encapsulation region encloses the chip bonding area, the bonding wires, a portion of the plurality of conductors, and a portion of the upper surface. The board includes external contacts on the lower surface for electrical connections to an external electrical appliance, and via holes through the board body for electrically connecting the plurality of conductors in the circuit pattern to the external contacts. A plurality of volume-adjusting regions, on the upper surface outside the chip bonding area and inside the encapsulation region, adjust a volume of a molding compound in the final package.

대표청구항 ▼

[ What is claimed is:] [1.] A printed circuit board for use in manufacturing chip-on-board packages, comprising:a board body having an upper surface and a lower surface;a chip bonding area on the upper surface for accommodating a semiconductor chip;a plurality of conductors in a circuit pattern on the upper surface outside the chip bonding area, for electrical connection to the semiconductor chip using a plurality of bonding wires;external contacts on the lower surface for electrical connection to an external electrical appliance;via holes extending through the board body for electrically connecting the plurality of conductors in the circuit pattern to the external contacts; anda plurality of protrusions extending upwardly from the plane of the upper surface of said board body at locations outside said chip bonding area but within an encapsulation region, which is to be covered by an encapsulant molded to the board body, said encapsulating region encircling said chip bonding area, a portion of said upper surface, and only inner end portions of said plurality of conductors, said protrusions being pre-designed to regulate the volume of molding compound used to form the encapsulant to one which will not cause the chip to warp during the molding process of forming the encapsulant.

이 특허에 인용된 특허 (3) 인용/피인용 타임라인 분석

Long Jon (Livermore CA) Schneider Mark (San Jose CA) Patil Sadanand (San Jose CA), Heat sink for semiconductor device assembly.
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Okuaki Hiroshi (Tokyo JPX), Printed circuit devices using thermoplastic resin cover plate.
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Nakamura Yasuharu,JPX ; Nakamura Akiyoshi,JPX, Semiconductor package and device having heads coupled with insulating material.
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이 특허를 인용한 특허 (15) 인용/피인용 타임라인 분석

Wensel, Richard W., Dam structure for center-bonded chip package.
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Yee, Jae Hak; Myung, Junwoo, Integrated circuit package system with molded strip protrusion.
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McCallops, John A.; Ashbaugh, Kurt E.; Souls, Douglas E., Interchangeable pistol grip handles for pneumatic tools and seals therefor.
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Arvin, Charles L.; Erwin, Brian M.; Quinlan, Brian W., Laminate warpage control.
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Koay, Huck Khim; Lim, Seong Choon; Tan, Cheng Why; Singh, Gurbir Singh A/L Balwant; Chong, Chee Keong; Yoganandan, Sundar a/l Natarajan, Light source.
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Upadhyayula, Suresh; Miller, Robert C.; Takiar, Hem; Sprouse, Steven; Yung, Ka Ian, Low profile wire bonded USB device.
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Upadhyayula, Suresh; Miller, Robert C.; Takiar, Hem; Sprouse, Steven; Yung, Ka Ian, Low profile wire bonded USB device.
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Yee, Jae Hak; Myung, Junwoo; Jang, Byoung Wook; Kim, YoungChul, Method for manufacture of inline integrated circuit system.
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Taylor,Craig M.; Kenny,David J., Method of making a surface mountable PCB module.
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Kondo, Kenji; Hidaka, Masahito; Kuyama, Koji; Kamogi, Yutaka, Mounting structure and motor.
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McCallops, John A.; Ashbaugh, Kurt E.; Hamlin, Mark J.; Heinrichs, Kevin; Souls, Douglas E., Pneumatic tool housings having embedded electronic devices.
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Robert F. Wallace, Semiconductor package using terminals formed on a conductive layer of a circuit board.
상세보기
Wallace, Robert F., Semiconductor package using terminals formed on a conductive layer of a circuit board.
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Wallace,Robert F., Semiconductor package using terminals formed on a conductive layer of a circuit board.
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Chai, Ting Ke; Yuan, Po Hauu; Pu, Han Ping, Semiconductor package with flash preventing mechanism and fabrication method thereof.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Printed circuit board and chip-on-board packages using same 원문보기