초록 ▼

A passive method and packaging system for thermally controlling the temperature of electronic equipment within a housing are disclosed. The packaging system provides for two cooling steps, each of which uses a different passive cooling technology. Cooling by changing the phase of Phase Change Materi

A passive method and packaging system for thermally controlling the temperature of electronic equipment within a housing are disclosed. The packaging system provides for two cooling steps, each of which uses a different passive cooling technology. Cooling by changing the phase of Phase Change Material, assists in controlling internal ambient temperatures by limiting the effects of short term localized thermal phenomena which would otherwise further increase internal temperatures. Cooling is also provided for by switching on a second passive cooling means, preferably a heat pipe, as the internal temperature of the housing increases above a predetermined temperature and to switch it off as the internal temperature drops below the predetermined temperature. Turning the second passive cooling means on and off provides respectively, a low or high thermal resistance path between the interior and exterior of the housing. The second passive cooling means allows for cooling of the housing above the predetermined temperature as well as heating of the housing below the predetermined temperature by preserving heat generated by the equipment. The two cooling steps in combination, co-operate to limit both maximum and minimum temperatures within the housing and of components. The combination of cooling steps also allows control over the temperature delta between the maximum and minimum temperatures during internal temperature swings.

대표청구항 ▼

[ What is claimed is:] [1.] A packaging system, comprising:a substantially sealed and insulated housing;support means disposed internally of the housing for supporting equipment;first passive cooling means comprising phase change material disposed internal of the housing for absorbing heat above a f

[ What is claimed is:] [1.] A packaging system, comprising:a substantially sealed and insulated housing;support means disposed internally of the housing for supporting equipment;first passive cooling means comprising phase change material disposed internal of the housing for absorbing heat above a first predetermined temperature thereby limiting further increases in temperature internal of the housing;second passive cooling means comprising:heat sink means disposed externally of the housing; andpassive switch means for providing a low thermal resistance path between the interior of the housing and the heat sink means above a second predetermined temperature to effect cooling of the equipment and for providing a high thermal resistance between the interior of the housing and the heat sink means below the second predetermined temperature to thereby preserve heat internal of the housing;an electronic equipment supported by the support means, the electronic equipment having electrical components thermally conductively attached to a substrate, the substrate being thermally conductively attached to a thermally conductive member to form a module and wherein the module is removably thermally conductively attached to the switch means.