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Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-021/06
출원번호 US-0067572 (1998-04-28)
발명자 / 주소
  • Edelstein Daniel C.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Ratner & PrestiaAbate
인용정보 피인용 횟수 : 41  인용 특허 : 27

초록

Process and apparatus controlling the cross-sectional flow distribution within a flowing stream such as a copper flux in an electrolytic copper deposition process. The flow distribution is controlled by a baffle comprised of two plates overlying one another, each having a set of openings, wherein th

대표청구항

[ What is claimed:] [1.] In a method of treating a planar substrate wherein said treatment is effected by causing a material to flow toward said substrate from a location spaced therefrom, the improvement comprising:interposing between said location and said substrate a baffle for modifying the unif

이 특허에 인용된 특허 (27)

  1. Lytle William H. (Chandler AZ) Lee Tien-Yu T. (Scottsdale AZ) Hileman Bennett L. (Tempe AZ), Adjustable plating cell for uniform bump plating of semiconductor wafers.
  2. Sesterhenn Lothar (Dormagen DEX) Tomic Milorad (Cologne DEX), Anode for alkali metal chloride electrolysis.
  3. Kozarek Robert L. (Washington Township ; Fayette County PA) Hornack Thomas R. (Lower Burrell PA) Jarrett Noel (Lower Burrell PA), Apparatus and method for electrolysis and float.
  4. Jones Jeffrey D. (Newark Valley NY) Katyl Robert H. (Vestal NY) Miller Thomas L. (Vestal NY) Moreno Oscar A. (Vestal NY), Apparatus and method for fluid processing of electronic packaging with flow pattern change.
  5. Mori Hiroyuki (Tokyo JPX), Apparatus for electroplating the main surface of a substrate.
  6. Kishi Shuji (Tokyo JPX), Apparatus for forming a metal wiring pattern of semiconductor devices.
  7. Ross John P. (Cupertino CA) Bernardi Carl E. (San Jose CA), Apparatus for plating semiconductor chip headers.
  8. Rothmayer Noel Y. (Madison NJ) Keusch Preston (Paramus NJ) Kattermann Dietrich E. (Morristown NJ), Cell flow distributors.
  9. Okinaka Yutaka (Madison NJ) Smith Craig G. (North Plainfield NJ) Smith Lawrence E. (Plainfield NJ), Copper electroplating process.
  10. Smith Robert (Nashotah WI) Toby Ron E. (Oshkosh WI) Germanson John H. (Eden WI), Electrodeposition system.
  11. Herbert William G. (Williamson NY) Bischoping Patricia (Webster NY) Altavela Robert P. (Farmington NY) Kotowicz Lawrence (Rochester NY) Schmitt Peter J. (Ontario NY) Jansen Ronald E. (Palm City FL 4), Electroforming semi-step carousel, and process for using the same.
  12. Jarrett Noel (Lower Burrell PA), Electrolytic cell and method of electrolysis using supported electrodes.
  13. Murata Satoshi (Tokyo JPX), Gilding apparatus for semiconductor substrate.
  14. Schuster Virgil E. (Scottsdale) Asher ; Sr. Reginald K. (Scottsdale) Patel Bhagubhai D. (Tempe AZ), Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge.
  15. Wray Daniel X. (Canoga Park CA), Method and apparatus for producing electroplated magnetic memory disk, and the like.
  16. Schneider Reinhard,DEX, Method and device for continuous uniform electrolytic metallizing or etching.
  17. Wagner Robert (Scottsdale AZ), Method for selectively controlling plating thicknesses.
  18. Yamakawa Koji (Tokyo JPX) Koiwa Kaoru (Tokyo JPX) Iwase Nobuo (Kamakura JPX), Method of manufacturing semiconductor device and apparatus therefor.
  19. Bacon Duane E. (Lee\s Summit MO) Hecox Spencer S. (Raytown MO), Methods of and apparatus for electroplating preselected surface regions of electrical articles.
  20. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Multi-station semiconductor processor with volatilization.
  21. Negron Scott B. (Forest VA), Nuclear reactor control assembly.
  22. Ishida Hirofumi (Hiratsuka JPX), Plating device for wafer.
  23. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
  24. Gofer Alexander (Jerusalem ILX), Process for supporting and cleaning a mesh anode bag.
  25. Grandia Johannes (San Jose CA) O\Kane Daniel F. (Morgan Hill CA) Santini Hugo A. E. (San Jose CA), Rotary electroplating cell with controlled current distribution.
  26. Smith Gary W. (North Olmsted OH), Selective electroplating apparatus and method of using same.
  27. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor with a frame.

이 특허를 인용한 특허 (41)

  1. He, Zhian, Anisotropic high resistance ionic current source (AHRICS).
  2. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Mayer, Steven T.; Chua, Lee Peng; Berke, Aaron; Fortner, James Isaac; Rash, Robert, Apparatus and method for dynamic control of plated uniformity with the use of remote electric current.
  3. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Chua, Lee Peng; Berke, Aaron; Rash, Robert; Mayer, Steven T., Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity.
  4. Graham, Gabriel Hay; Chua, Lee Peng; Mayer, Steven T.; Rash, Robert; Berke, Aaron, Apparatus and method for modulating azimuthal uniformity in electroplating.
  5. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
  6. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
  7. Basol, Bulent M.; Lindquist, Paul, Apparatus for controlling thickness uniformity of electroplated and electroetched layers.
  8. Coglitore,Giovanni; Gallo,Nikolai; Randall,Jack, Computer rack cooling system.
  9. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  10. He, Zhian; Zhou, Jian; Feng, Jingbin; Reid, Jonathan D.; Ghongadi, Shantinath, Control of electrolyte flow dynamics for uniform electroplating.
  11. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  12. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  13. Mayer, Steven T.; Porter, David W.; Goh, Edwin; Buckalew, Bryan L.; Rash, Robert, Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  14. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
  15. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
  16. He, Zhian; Porter, David W.; Reid, Jonathan D.; Wilmot, Frederick D., Dynamic current distribution control apparatus and method for wafer electroplating.
  17. He, Zhian; Porter, David W.; Reid, Jonathan D.; Wilmot, Frederick D., Dynamic current distribution control apparatus and method for wafer electroplating.
  18. Graham, Gabriel Hay; Hiester, Jacob Lee; Chua, Lee Peng; Buckalew, Bryan L., Dynamic modulation of cross flow manifold during electroplating.
  19. Graham, Gabriel Hay; Buckalew, Bryan L.; Mayer, Steven T.; Rash, Robert; Fortner, James Isaac; Chua, Lee Peng, Edge flow element for electroplating apparatus.
  20. Mayer, Steven T.; Porter, David W.; Buckalew, Bryan L.; Rash, Robert, Electroplating apparatus for tailored uniformity profile.
  21. Mayer, Steven T.; Porter, David W.; Buckalew, Bryan L.; Rash, Robert, Electroplating apparatus for tailored uniformity profile.
  22. Mayer, Steven T.; Porter, David W.; Buckalew, Bryan L.; Rash, Robert, Electroplating apparatus for tailored uniformity profile.
  23. Kuo, Szu-Wei, Enclosure for electrical system.
  24. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  25. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
  26. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  27. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  28. Wang, Po-Wei; Chang, Chun-Lin, High resistance virtual anode for electroplating cell.
  29. He, Zhian, Method and apparatus for dynamic current distribution control during electroplating.
  30. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  31. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  32. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
  33. Reid, Jonathan; Buckalew, Bryan; He, Zhian; Park, Seyang; Varadarajan, Seshasayee; Pennington, Bryan; Ponnuswamy, Thomas; Breling, Patrick; Ibarreta, Glenn; Mayer, Steven, Method and apparatus for electroplating.
  34. Bonkass, Matthias; Preusse, Axel, Method and system for controlling ion distribution during plating of a metal on a workpiece surface.
  35. Basol,Bulent M.; Lindquist,Paul, Method for controlling thickness uniformity of electroplated layers.
  36. Uzoh, Cyprian E.; Deligianni, Hariklia; Dukovic, John O., Method for enhancing the uniformity of electrodeposition or electroetching.
  37. Mayer, Steven T; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
  38. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Berke, Aaron; Fortner, James Isaac; Rash, Robert, Methods and apparatuses for dynamically tunable wafer-edge electroplating.
  39. Mayer, Steven; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
  40. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  41. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
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