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[미국특허] Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/06
  • B24B-049/00
출원번호 US-0865028 (1997-05-28)
발명자 / 주소
  • Pecen Jiri
  • Chadda Saket
  • Jairath Rahul
  • Krusell Wilbur C.
출원인 / 주소
  • Lam Research Corporation
대리인 / 주소
    Brinks Hofer Gilson & Lione
인용정보 피인용 횟수 : 53  인용 특허 : 56

초록 ▼

An apparatus and method for in-situ monitoring of thickness during chemical-mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring channel. A fi

대표청구항 ▼

[ What is claimed is:] [1.] In a chemical mechanical polishing device of the type comprising: least two rollers, a belt comprising a layer of polishing material and mounted to extend between the rollers such that rotation of the rollers drives the belt, and a substrate carrier positioned adjacent th

이 특허에 인용된 특허 (56) 인용/피인용 타임라인 분석

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  24. Korth Hans E. (Stuttgart DEX), Method and apparatus for determining the polarization state of a light wave field.
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  46. Kobayashi Thomas S. (Austin TX), Process for polishing and analyzing a layer over a patterned semiconductor substrate.
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  52. Sandhu Gurtej S. (Boise ID) Doan Trung Tri (Boise ID), System for real-time control of semiconductor wafer polishing including optical monitoring.
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  54. Schoenborn Philippe (San Jose CA) Pasch Nicholas F. (Pacifica CA), Trench planarization techniques.
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  56. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa JPX), Wafer polishing method and apparatus.
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이 특허를 인용한 특허 (53) 인용/피인용 타임라인 분석

  1. Elledge, Jason B., APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT PLANARIZING MACHINES IN MECHANICAL OR CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES AND METHODS FOR MAKING A.
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  2. Elledge, Jason B., APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT PLANARIZING MACHINES IN MECHANICAL OR CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES AND METHODS FOR MAKING A.
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  3. Saldana, Miguel A.; Owczarz, Aleksander A., Adjustable force applying air platen and spindle system, and methods for using the same.
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  6. Agarwal, Vishnu K., Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
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  10. Wu, Ken; Jiang, Yuntao; Yang, Jun, Chemical mechanical polishing (CMP) apparatus and method.
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  17. Stanke, Fred E.; Hasan, Talat F.; Weber, Michael, Integrated surface metrology.
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  20. Smith, Donald K., Laser-driven light source for generating light from a plasma in an pressurized chamber.
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