초록 ▼

Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device formed using such component, and method for forming the package component and packaged microelectronic device. The component (which can be, e.g., a lid or conta

Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device formed using such component, and method for forming the package component and packaged microelectronic device. The component (which can be, e.g., a lid or container 21 of the package) has sequentially deposited layers of metal layers (37, 50), to be located within the package, attached to a housing member, to act as a hydrogen getter in the package. The sequentially deposited layers of metal layers includes at least a first layer (3) of Ni adjacent the housing member surface, to improve adherence of the sequentially deposited layers and interstitially trap hydrogen; an outermost layer (11) of palladium to convert molecular hydrogen to hydrogen atoms and as the primary absorber of the hydrogen; and a layer (9) of Ti or Zr adjacent this outermost layer and acting as a secondary absorber of the hydrogen. Additional layers (5, 7) of nickel and of titanium or zirconium can be provided between the first layer and the layer adjacent the outermost layer. These layers of the sequentially deposited layers of metal layers can be deposited by, e.g., vacuum evaporation or sputtering. Desirably, where sequentially deposited layers is provided directly on the housing member, the surface of the housing member is roughened prior to depositing the first layer thereon, in order to improve hydrogen absorption efficiency of the sequentially deposited layers of metal layers.

대표청구항 ▼

[ What is claimed is:] [1.] A method of fabricating a package component, of a package for packaging a microelectronic device, comprising the steps of:providing a housing member of said package;depositing a first metal layer, of a metal for absorbing hydrogen, overlying a surface of said housing memb

[ What is claimed is:] [1.] A method of fabricating a package component, of a package for packaging a microelectronic device, comprising the steps of:providing a housing member of said package;depositing a first metal layer, of a metal for absorbing hydrogen, overlying a surface of said housing member which will be an inside surface of said package;depositing a second metal layer, which is an outermost layer of metal layers overlying said surface of said housing member, of a metal that converts hydrogen molecules into hydrogen atoms and absorbs hydrogen, said second metal layer being deposited adjacent the first metal layer,said method further comprising the steps of:prior to depositing the first metal layer, depositing on the housing member a third metal layer, of a metal which trans hydrogen and has a greater adherence to the housing member than does metal of the first metal layer, the first metal layer being deposited on the third metal layer,prior to depositing the third metal layer on the housing member, of roughening a surface of the housing member upon which the third metal layer is to be deposited; anddepositing at least one further first layer, of metal of the first layer, and at least one further third layer, of metal of the third layer, after depositing the third metal layer and prior to depositing the first metal layer.