초록 ▼

A conductive feedthrough for providing electrical current to semiconductor packages. A conductive wall portion of a semiconductor package contains an insulating material disposed in an aperture in the conductive wall. The insulating material has an axial bore into which an electrical conductor is in

A conductive feedthrough for providing electrical current to semiconductor packages. A conductive wall portion of a semiconductor package contains an insulating material disposed in an aperture in the conductive wall. The insulating material has an axial bore into which an electrical conductor is inserted. The conductor has a reduced diameter in the portion inside the axial bore and enlarged portions on either side of the axial bore.

대표청구항 ▼

[ What is claimed is:] [1.] A feedthrough interconnection assembly comprising:a conductive wall portion forming a substantially planar surface, having at least one aperture extending therethrough;an insulating material disposed in the aperture having an axis and an axial bore extending therethrough,

[ What is claimed is:] [1.] A feedthrough interconnection assembly comprising:a conductive wall portion forming a substantially planar surface, having at least one aperture extending therethrough;an insulating material disposed in the aperture having an axis and an axial bore extending therethrough, the axis of said bore being substantially perpendicular to the planar surface of the wall portion; anda feedthrough conductor having:a first section with a first diameter; anda second section with a second diameter extending through the axial bore, the second diameter being less than the first diameter and a third diameter of the bore being effective to form a close fit with the second section.