초록 ▼

The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal i

The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C. constrains the expansion of the functional insert which has a thermal conductivity that ranges from about 200 W/mK to about 400 W/mK.

대표청구항 ▼

[ What is claimed is:] [1.] A functionally-graded metal substrate comprising:a functional insert;a surrounding body that surrounds the functional insert; rein the functional insert and the surrounding body are two different metal compositions in the x-y plane of the substrate; and, rein the function

[ What is claimed is:] [1.] A functionally-graded metal substrate comprising:a functional insert;a surrounding body that surrounds the functional insert; rein the functional insert and the surrounding body are two different metal compositions in the x-y plane of the substrate; and, rein the functional insert has a higher thermal conductivity than the surrounding body and the surrounding body has a lower coefficient of thermal expansion than the functional insert.