초록 ▼

One aspect of the invention relates to a semiconductor substrate. In one version of the invention, a semiconductor substrate includes a package substrate having first and second surfaces with conductive traces formed thereon and structures for providing electrical connection between selected conduct

One aspect of the invention relates to a semiconductor substrate. In one version of the invention, a semiconductor substrate includes a package substrate having first and second surfaces with conductive traces formed thereon and structures for providing electrical connection between selected conductive traces, a die attach area on the first surface of the package substrate adapted to provide physical connection to a semiconductor die, the die attach area having conductive contacts for providing electrical connection between the die and conductive traces on the first surface, a package frame, at least one substrate strap which connects the package substrate to the package frame, the substrate strap being formed integrally with the package substrate and the package frame.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor substrate comprising:a package substrate having first and second surfaces with conductive traces formed thereon and structures for providing electrical connection between selected conductive traces;a die attach area on the first surface of the package subs

[ What is claimed is:] [1.] A semiconductor substrate comprising:a package substrate having first and second surfaces with conductive traces formed thereon and structures for providing electrical connection between selected conductive traces;a die attach area on the first surface of the package substrate adapted to provide physical connection to a semiconductor die, the die attach area having conductive contacts for providing electrical connection between the die and conductive traces on the first surface;a package frame;at least one substrate strap which connects the package substrate to the package frame, the substrate strap being formed integrally with the package substrate and the package frame.