[특허]Multilayer circuit board with electrically resistive heating element

[미국특허] Multilayer circuit board with electrically resistive heating element 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05B-003/16 H05B-001/00 H05K-001/00 H01C-010/12
출원번호	US-0943948 (1997-10-03)
발명자 / 주소	Baugh Walter Thomas Kusek Stephen Mark Wessling III Francis
출원인 / 주소	McDonnell Douglas Corporation
대리인 / 주소	Alston & Bird LLP
인용정보	피인용 횟수 : 46 인용 특허 : 16

초록 ▼

A multilayer circuit board and an associated heating apparatus is provided for heating electrical components. The multilayer circuit board includes a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board. The multilayer circuit board also includes a heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board. The heating layer includes a first electrically resistive heating element disposed upon an insulating substrate in general alignment with the electrical component mounted upon the multilayer circuit board. The electrically resistive heating element provides heat to maintain the operating temperature of the electrical component within a desired range. By increasing the operating temperature of the electrical component, the multilayer circuit board allows less expensive, commercial grade electronics to be utilized which would otherwise have been susceptible to failure at lower temperatures.

대표청구항 ▼

[ That which is claimed is:] [1.] A multilayer circuit board comprising:a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board; anda heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board, said heating layer comprising an electrically insulating substrate and first and second electrically resistive heating elements disposed in a same predetermined area on said substrate and in general alignment with the electrical component mounted upon the multilayer circuit board, wherein at least one of said heating elements has a defined pattern having at least one fractal curve, and wherein both of said heating elements are intertwined such that either of said heating elements will uniformly heat the electrical component mounted upon the multilayer circuit board.

이 특허에 인용된 특허 (16) 인용/피인용 타임라인 분석

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Alexander John H. (Goleta CA) Turvey Simon P. (Goleta CA), Method of making insulated electrical heating element using LTCC tape.
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Henschen Homer E. (Carlisle PA) McKee Michael J. (New Cumberland PA) Pawlikowski Joseph M. (Lancaster PA), Self regulating temperature heater as an integral part of a printed circuit board.
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O'Rourke, Shawn; Sadler, Daniel J.; Chason, Marc K.; Eliacin, Manes; Gamboa, Claudia V.; Terbrueggen, Robert; Lian, Ke K., Heater for temperature control integrated in circuit board and method of manufacture.
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[미국특허] Multilayer circuit board with electrically resistive heating element 원문보기