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[미국특허] Polishing pad for a semiconductor substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/00
출원번호 US-0113248 (1998-07-10)
발명자 / 주소
  • Anjur Sriram P.
  • Downing William C.
출원인 / 주소
  • Cabot Corporation
인용정보 피인용 횟수 : 46  인용 특허 : 35

초록 ▼

A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanic

대표청구항 ▼

[ What is claimed is:] [1.] A polishing pad comprising;a. a polishing pad substrate further comprising sintered particles of thermoplastic resin, wherein said polishing pad substrate has a buffed top surface and a buffed bottom surface wherein the buffed bottom surface has a surface porosity less th

이 특허에 인용된 특허 (35) 인용/피인용 타임라인 분석

  1. Hyde Thomas C. (Chandler AZ) Roberts John V. H. (Newark DE), Apparatus for interlayer planarization of semiconductor material.
    상세보기
  2. Zimmer Jerry W., CVD diamond coated substrate for polishing pad conditioning head and method for making same.
    상세보기
  3. Shamouilian Shamouil (San Jose CA) Clark Daniel O. (Pleasanton CA), Chemical-mechanical polishing pad providing polishing unformity.
    상세보기
  4. Breivogel Joseph R. (Beaverton OR) Louke Sam F. (Portland OR) Oliver Michael R. (Tigard OR) Yau Leo D. (Portland OR), Composite polishing pad for semiconductor process.
    상세보기
  5. Stein Harvey L. (Seabrook TX), Composition and process for making porous articles from ultra high molecular weight polyethylene.
    상세보기
  6. Smith Michael W. (Fairburn GA) Pierce Robert S. (Smyrna GA), Diagnostic system employing a unitary substrate to immobilize microspheres.
    상세보기
  7. Hoffstein Mark F. (Newark DE) Shinagawa Takehisa (Sakai JPX), Inverted cell pad material for grinding, lapping, shaping and polishing.
    상세보기
  8. Cadien Kenneth C. (Portland OR) Yau Leopoldo D. (Portland OR), Method and apparatus for conditioning of chemical-mechanical polishing pads.
    상세보기
  9. Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID) Fox Angus C. (Boise ID) Sandhu Gurtej S. (Boise ID) Stroupe Hugh E. (Boise ID), Method and apparatus for improving planarity of chemical-mechanical planarization operations.
    상세보기
  10. Hempel Eugene O. (Garland TX), Method for performing chemical mechanical polish (CMP) of a wafer.
    상세보기
  11. Lindholm Gene O. (River Falls WI) Follensbee Robert A. (Cottage Grove MN), Method for the polishing and finishing of optical lenses.
    상세보기
  12. Bellet Richard J. (Boonton Township ; Morris County NJ) Broyer Ephraim (Murray Hill NJ) Bekker Alex Y. (Hackensack NJ) Lace Melvin A. (Prospect Heights IL), Method of compressively molding articles from resin coated filler materials.
    상세보기
  13. Castro Anthony J. (Oak Park IL), Methods for making microporous products.
    상세보기
  14. Lopatin George (Newton Centre MA) Yen Larry Y. (Tewksbury MA), Microporous membranes of ultrahigh molecular weight polyethylene.
    상세보기
  15. Aubert James H. (Albuquerque NM), Microporous polymer films and methods of their production.
    상세보기
  16. Castro Anthony J. (Oak Park IL), Microporous products.
    상세보기
  17. Breivogel Joseph R. (Aloha OR) Louke Samuel F. (Beaverton OR) Oliver Michael R. (Tigard OR) Yau Leopoldo D. (Portland OR) Barns Christopher E. (Portland OR), Orbital motion chemical-mechanical polishing apparatus and method of fabrication.
    상세보기
  18. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
    상세보기
  19. Breivogel Joseph R. (Aloha OR) Blanchard Loren R. (Hillsboro OR) Prince Matthew J. (Portland OR), Polishing pad conditioning apparatus for wafer planarization process.
    상세보기
  20. Thomas Michael E. (Milpitas CA), Polishing pad for planarization.
    상세보기
  21. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
    상세보기
  22. Tuttle Mark E. (Boise ID), Polishing pad with controlled abrasion rate.
    상세보기
  23. Tuttle Mark E. (Boise ID), Polishing pad with uniform abrasion.
    상세보기
  24. Roberts John V. H. (Newark DE), Polishing pads.
    상세보기
  25. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
    상세보기
  26. Yu Chris C. (Austin TX), Polishing pads used to chemical-mechanical polish a semiconductor substrate.
    상세보기
  27. Reinhardt Heinz F. (Chadds Ford PA) Roberts John V. H. (Newark DE) McClain Harry G. (Middletown DE) Budinger William D. (Newark DE) Jensen Elmer W. (New Castle DE), Polymeric polishing pad containing hollow polymeric microelements.
    상세보기
  28. Klawson Rennold L. (Middletown NJ) Franta Terence J. (Hamilton Square NJ), Porous dome applicator with push/pull cap.
    상세보기
  29. Morris Harold B. (Newnan GA) Bright Donald G. (College Park GA), Porous sheets and method of manufacture.
    상세보기
  30. Koslow Evan E. (Westport CT), Process for the production of materials characterized by a continuous web matrix or force point bonding.
    상세보기
  31. Runnels Scott (Austin TX) Eyman L. Michael (San Antonio TX), Pulsed-force chemical mechanical polishing.
    상세보기
  32. Degen Peter J. (Huntington NY) Gsell Thomas C. (Glen Cove NY), Self-supporting structures containing immobilized carbon particles and method for forming same.
    상세보기
  33. Allen Franklin L. (Sherman TX) Smith William L. (Howe TX) Debner Thomas G. (Howe TX) Olmstead Dennis L. (Sherman TX), Semiconductor polishing pad.
    상세보기
  34. Jensen ; Jr. Elmer W. (Norwalk CT), Substrate containing fibers of predetermined orientation and process of making the same.
    상세보기
  35. Dickey Clarence A. (Atlanta GA) McDaniel John E. (Fairburn GA), Unitary porous themoplastic writing nib.
    상세보기

이 특허를 인용한 특허 (46) 인용/피인용 타임라인 분석

  1. Kawamura,Koichi; Yagihara,Morio, Abrasive pad.
    상세보기
  2. Sun, Tao, CMP compositions containing iodine and an iodine vapor-trapping agent.
    상세보기
  3. Sun, Tao, CMP compositions containing silver salts.
    상세보기
  4. Moeggenborg, Kevin J.; Chou, Homer; Hawkins, Joseph D.; Chamberlain, Jeffrey P., CMP compositions for low-k dielectric materials.
    상세보기
  5. Reiss, Brian; Whitener, Glenn, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
    상세보기
  6. Reiss, Brian; Willhoff, Michael; Mateja, Daniel, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
    상세보기
  7. Schroeder, David J.; Moeggenborg, Kevin J.; Chou, Homer; Chamberlain, Jeffrey P.; Hawkins, Joseph D.; Carter, Phillip, CMP method utilizing amphiphilic nonionic surfactants.
    상세보기
  8. Shiho,Hiroshi; Hosaka,Yukio; Hasegawa,Kou; Kawahashi,Nobuo, Chemical mechanical polishing pad and chemical mechanical polishing method.
    상세보기
  9. Kamboj, Sumant, Homogeneous fixed abrasive polishing pad.
    상세보기
  10. Vacassy, Robert, Methanol-containing silica-based CMP compositions.
    상세보기
  11. Masumura, Hisashi; Tomii, Kazuya; Ito, Shigenao; Anzai, Kenichi; Inoue, Kenichi, Method and pad for polishing wafer.
    상세보기
  12. Nunley, Jr., John Henry; Geiger, Andrew M; Benedict, Jeffrey, Method for chemical mechanical polishing layer pretexturing.
    상세보기
  13. Prasad,Abaneshwar, Method for manufacturing microporous CMP materials having controlled pore size.
    상세보기
  14. Carter, Phillip W.; Johns, Timothy P., Method of polishing a silicon-containing dielectric.
    상세보기
  15. Zhang,Jian; Sun,Fred; Wang,Shumin; Cherian,Isaac K.; Klingenberg,Eric H., Method of polishing a substrate with a polishing system containing conducting polymer.
    상세보기
  16. Matsui, Harunobu; Harada, Daijitsu; Watabe, Atsushi; Ueda, Shuhei; Takeuchi, Masaki, Method of preparing substrate.
    상세보기
  17. Feng, Chung-Chih; Yao, I-Peng; Hung, Yung-Chang, Method of producing polishing pad.
    상세보기
  18. Chen, Jian; Cruden, Karen Chu; Duan, Xiangfeng; Liu, Chao; Parce, J. Wallace, Methods and devices for forming nanostructure monolayers and devices including such monolayers.
    상세보기
  19. Chen, Jian; Cruden, Karen Chu; Duan, Xiangfeng; Liu, Chao; Parce, J. Wallace, Methods and devices for forming nanostructure monolayers and devices including such monolayers.
    상세보기
  20. Chen, Jian; Cruden, Karen Chu; Duan, Xiangfeng; Liu, Chao; Parce, J. Wallace, Methods and devices for forming nanostructure monolayers and devices including such monolayers.
    상세보기
  21. Chen, Jian; Duan, Xiangfeng; Liu, Chao; Nallabolu, Madhuri; Parce, J. Wallace; Ranganathan, Srikanth, Methods and devices for forming nanostructure monolayers and devices including such monolayers.
    상세보기
  22. Chen, Jian; Duan, Xiangfeng; Liu, Chao; Nallabolu, Madhuri; Parce, J. Wallace; Ranganathan, Srikanth, Methods and devices for forming nanostructure monolayers and devices including such monolayers.
    상세보기
  23. Kihara, Katushi; Mochizuki, Yoshimi, Methods for making urethane molded products for polishing pads.
    상세보기
  24. Prasad, Abaneshwar, Microporous polishing pads.
    상세보기
  25. Prasad, Abaneshwar, Microporous polishing pads.
    상세보기
  26. Prasad, Abaneshwar, Microporous polishing pads.
    상세보기
  27. Prasad, Abaneshwar, Microporous polishing pads.
    상세보기
  28. Bunyan,Michael H.; Clement,Thomas A.; Hannafin,John J.; LaRosee,Marc E.; Young,Kent M., Polishing article for electro-chemical mechanical polishing.
    상세보기
  29. Carter, Phillip W.; Johns, Timothy, Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  30. Carter,Phillip W.; Johns,Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  31. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  32. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  33. Dysard, Jeffrey; Anjur, Sriram; Grumbine, Steven; White, Daniela; Ward, William, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  34. Grumbine, Steven; Li, Shoutian; Ward, William; Singh, Pankaj; Dysard, Jeffrey, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  35. Cherian, Isaac K.; Zhang, Jian; Sun, Fred; Wang, Shumin; Klingenberg, Eric H., Polishing composition containing conducting polymer.
    상세보기
  36. Robert G. Swisher ; Alan E. Wang, Polishing pad.
    상세보기
  37. Cherian, Isaac K.; Anjur, Sriram P.; Grumbine, Steven K., Polishing pad comprising particles with a solid core and polymeric shell.
    상세보기
  38. Prasad, Abaneshwar, Polishing pad with microporous regions.
    상세보기
  39. Prasad,Abaneshwar, Polishing pad with oriented pore structure.
    상세보기
  40. Lombardo, Brian; Bajaj, Rajeev, Polishing pad with reduced moisture absorption.
    상세보기
  41. Nakano,Hiromi; Tajima,Hirokazu, Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method.
    상세보기
  42. Chen,Shyng Tsong; Rodbell,Kenneth P.; Chi Hsu,Oscar Kai; Vangsness,Jean; Gilbride,David S.; Billings,Scott Clayton; Davis,Kenneth, Polishing pads with polymer filled fibrous web, and methods for fabricating and using same.
    상세보기
  43. Swisher,Robert G.; Wang,Alan E.; Allison,William C., Polyurethane urea polishing pad.
    상세보기
  44. Fawcett, Clyde A.; Crkvenac, T. Todd; Prygon, Kenneth A.; Foster, Bernard, Porous polyurethane polishing pads.
    상세보기
  45. Obeng, Yaw S.; Yokley, Edward M., Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor.
    상세보기
  46. Wank, Andrew R.; Alden, Donna M.; So, Joseph K.; Gargione, Robert; Gazze, Mark E.; Drop, David; Cameron, Jr., Colin F.; Banh, Mai Tieu; Riley, Shawn, Silicate composite polishing pad.
    상세보기

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