초록 ▼

In a chip-type light emitting device in which first and second terminal electrodes are formed on both ends of an insulating substrate with a light emitting device chip being mounted on the surface side, the LED chip is directly formed on the insulating substrate, and at least a portion of the insula

In a chip-type light emitting device in which first and second terminal electrodes are formed on both ends of an insulating substrate with a light emitting device chip being mounted on the surface side, the LED chip is directly formed on the insulating substrate, and at least a portion of the insulating substrate on which the LED chip is mounted is formed by a whitish material. Alternatively, in a lamp-type semiconductor light emitting device in which the LED chip is mounted on the top of a lead, and is covered with a dome-shaped package, or in a chip-type semiconductor light emitting device, a bonding material used for bonding the LED chip is made of a whitish material. Therefore, it becomes possible to reflect light that proceeds toward the back surface side of the LED chip efficiently, and consequently to increase the necessary luminosity even if the light-emitting efficiency inside the LED chip remains the same.

대표청구항 ▼

[ What is claimed is:] [1.] A chip-type semiconductor light emitting device comprising:an insulating substrate;first and second terminal electrodes that are placed at both ends of a surface of said insulating substrate, with at least a portion of said surface of said insulating substrate located bet

[ What is claimed is:] [1.] A chip-type semiconductor light emitting device comprising:an insulating substrate;first and second terminal electrodes that are placed at both ends of a surface of said insulating substrate, with at least a portion of said surface of said insulating substrate located between said first and second terminal electrodes being formed to have a whitish color;a light emitting chip that is directly mounted with a bonding material on said portion of said surface of said insulating substrate, said light emitting chip having a p-side electrode and an n-side electrode electrically connected to said first and second terminal electrodes respectively, and said light emitting chip having a transparent substrate which is transparent to the light emitted, and said p-side electrode and n-side electrode are both provided on a semiconductor layer side which is laminated on said transparent substrate; anda package for covering said light emitting chip and a periphery of said light emitting chip.