초록 ▼

A semiconductor optical sensing device includes an insulating casing containing a semiconductor optical sensor chip fixed in the bottom thereof. Transparent silicone gel fills the interior of the casing and covers the sensor chip. A transparent plate covers both the sensor chip and the silicone gel.

A semiconductor optical sensing device includes an insulating casing containing a semiconductor optical sensor chip fixed in the bottom thereof. Transparent silicone gel fills the interior of the casing and covers the sensor chip. A transparent plate covers both the sensor chip and the silicone gel. Holes in the casing allow expansion and contraction of the silicone gel without disturbing the optical properties of the sensor chip, and without permitting the formation of bubbles in the silicone gel.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor optical sensing device package comprising:an insulating casing;wiring extending from inside to outside of said casing;a semiconductor optical sensor chip fixed inside said casing;a plurality of terminals disposed on said sensor chip;connecting means for co

[ What is claimed is:] [1.] A semiconductor optical sensing device package comprising:an insulating casing;wiring extending from inside to outside of said casing;a semiconductor optical sensor chip fixed inside said casing;a plurality of terminals disposed on said sensor chip;connecting means for connecting said terminals and said wiring;a quantity of transparent filler, said filler filling said casing and covering an upper face of said sensor chip;a transparent plate disposed above said sensor chip, said transparent filler being interposed between said sensor chip and said transparent plate; andat least one hole communicating between said transparent filler and an environment exterior of said casing.