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Integrated hybrid cooling with EMI shielding for a portable computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/00
  • H05K-007/00
  • H05K-007/20
  • H05K-009/00
  • H05K-007/14
출원번호 US-0088814 (1998-06-02)
발명자 / 주소
  • Smith Russell
  • Penniman Mark B.
  • Steigerwald Todd
출원인 / 주소
  • Dell USA, L.P.
대리인 / 주소
    Haynes and Boone, LLP
인용정보 피인용 횟수 : 59  인용 특허 : 8

초록

A computer system includes a motherboard mounted in a chassis. An EMI shield member is mounted on the motherboard. A processor module is connected to the motherboard and has peripheral edge contact with the EMI shield member. A cap member is mounted on the processor module and is engaged with the EM

대표청구항

[ What is claimed is:] [1.] A hybrid cooling system integrated with an EMI shield, comprising:an electrical component;an EMI shield member;a cap member mounted on the electrical component and the EMI shield member;a heat sink mounted adjacent to the cap member;means for transferring heat from the ca

이 특허에 인용된 특허 (8)

  1. Roesner Arlen L. ; Wagner Guy R. ; Babb Samuel M., Electronic device enclosure having electromagnetic energy containment and heat removal characteristics.
  2. Penniman Mark B. (Austin TX) Schlesener Carmen M. (Pflugerville TX) Kizer Jim J. (Austin TX), Heat pipe device and method for attaching same to a computer keyboard.
  3. Murase Takashi (Yokohama JPX) Koizumi Tatsuya (Tokyo JPX), Heat pipe heat sink for semiconductor devices.
  4. McCarthy Michael P. D. (Palatine IL), Integrated EMI filter and thermal heat sink.
  5. Barker ; III Charles R. (Harvard MA) Casabona Richard J. (Stow MA) Fenwick David M. (Chelmsford MA), Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips.
  6. Nakamura Hiroshi,JPX ; Nakajima Yuji,JPX, Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit bo.
  7. Nakajima Yuji,JPX, Portable electronic apparatus having a frame supporting functional components, and method of assembling the portable el.
  8. Korinsky George K. (Houston TX), Thermal packaging for natural convection cooled electronics.

이 특허를 인용한 특허 (59)

  1. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  2. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.
  3. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.
  4. Coish, Robert L.; Ligtenberg, Chris; Hopkinson, Ron; Raff, John, Battery pack and connector.
  5. Reis, Bradley; Candy, William, Board-level EMI shield with enhanced thermal dissipation.
  6. English,Gerald Robert, Combined board level EMI shielding and thermal management.
  7. Robinson,Kenneth M.; Kline,James E., Combined board level shielding and thermal management.
  8. Liu, Baomin; Steigerwald, Todd W., Combined electromagnetic shield and thermal management device.
  9. DiFonzo,John; Zadesky,Stephen; Prichard,Michael, Computer component protection.
  10. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Computer component protection.
  11. Merz,Nick; DiFonzo,John; Prichard,Michael, Computer component protection.
  12. Raff, John; Andre, Bartley K.; DeForest, Laura; DiFonzo, John C.; Gao, Zheng; Goldberg, Michelle; Hamel, Bradley J.; Hibbard, Timothy S.; Hopkinson, Ron; Leggett, William F.; Ligtenberg, Chris; Reid, Gavin J.; Schwalbach, Charles A., Computer housing.
  13. Raff, John; Andre, Bartley K.; DeForest, Laura; DiFonzo, John C.; Gao, Zheng; Goldberg, Michelle; Hamel, Bradley J.; Hibbard, Timothy S.; Hopkinson, Ron; Leggett, William F.; Ligtenberg, Chris; Reid, Gavin J.; Schwalbach, Charles A., Computer housing.
  14. Raff, John; Andre, Bartley K.; DeForest, Laura; DiFonzo, John; Gao, Zheng; Goldberg, Michelle; Hamel, Bradley J.; Hibbard, Timothy S.; Hopkinson, Ron; Leggett, William F.; Ligtenberg, Chris; Reid, Gavin J.; Schwalbach, Charles A., Computer housing.
  15. Raff, John; Andre, Bartley K.; Deforest, Laura; DiFonzo, John C.; Gao, Zheng; Goldberg, Michelle; Hamel, Bradley J.; Hibbard, Timothy S.; Hopkinson, Ron; Leggett, William F.; Ligtenberg, Chris; Reid, Gavin J.; Schwalbach, Charles A., Computer housing.
  16. Tohru Nakanishi JP; Yasuharu Yamada JP; Masanori Kuzuno JP; Toshihiko Nishio JP, Cooling method and device for notebook personal computer.
  17. Wilson, John Alexander; Garrett, Robert Haden, Cooling system for a computer and method for assembling the same.
  18. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  19. Barsun, Stephan K.; Hahn, Steven R.; Wilson, Jeremy I.; Augustin, Thomas J.; Robertus, Todd D., EMI containment device and method.
  20. English, Gerald Robert; Zuehlsdorf, Allan Richard, EMI shielding and thermal management assemblies including frames and covers with multi-position latching.
  21. Sweet, Edward T.; Ortega, Roberto; Davidson, Andrew; Lancaster, Simon; Johannessen, Thomas, Edge break details and processing.
  22. Toh, Tze-Chuen, Electromagnetic interference reduction air duct.
  23. Tachikawa, Hideaki; Matsushita, Shinya, Electronic device.
  24. Garelli, Adam T.; Mathew, Dinesh C.; Wilson, Jr., Thomas W.; Hendren, Keith J.; Augenbergs, Peteris K.; Degner, Brett W.; Hamel, Bradley J.; Damlanakis, Michael A.; Kessler, Patrick, Electronic device display module.
  25. Qi, Jun; Yin, Victor H., Electronic device with illuminated logo structures.
  26. Qi, Jun; Yin, Victor H., Electronic device with illuminated logo structures.
  27. Merz, Nicholas G.; DiFonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  28. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  29. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  30. Lev Jeffrey A. ; Deluga Ronald E., Heat dissipation structure for electronic apparatus component.
  31. Dolci, Dominic E.; Smeenge, James G.; Diep, Vinh H.; Goh, Chiew-Siang, Heat sinking and electromagnetic shielding structures.
  32. Zaderej,Victor; Neumann,Michael J., Hinge for an electronic device.
  33. Lu Yu-Kun,TWX ; Lee Chuan-Yuan,TWX ; Chang Yu-Tsai,TWX ; Wu Chia-Ling,TWX, Insertion cartridge for hard disc of portable computer.
  34. Fumihiko Sagawa JP, LCD having metal shield which separates drive circuit from panel and backlight, with elastic spring fingers connecting shield and outer case.
  35. Morris, Terrel L., Lossy RF shield for integrated circuits.
  36. Hamano, Takeshi; Yamada, Kevin Seichi, Low profile EMI shield with heat spreading plate.
  37. Takeshi Hamano JP; Kevin Seichi Yamada, Low profile EMI shield with heat spreading plate.
  38. Robinson,Kenneth M.; Kline,James E., Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith.
  39. Brown, Brian; Hushek, Stephen G., Magnetic resonance imaging compatible mobile computing device.
  40. Igarashi, Takeshi, Method of cooling system for a personal computer and personal computer.
  41. Campbell, Levi A.; Colbert, John L.; Ellsworth, Jr., Michael J.; Sinha, Arvind K., Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates.
  42. Yan, Longping; Wei, Konggang; Li, Hualin, Mobile terminal.
  43. English,Gerald R., Mounting clips for use with electromagnetic interference shielding and methods of using the same.
  44. Doherty, John; Collins, Mike, Multi-purpose portable computer with integrated devices.
  45. Tanaka,Wataru; Tatsukami,Ikki; Iijima,Takashi; Sato,Yutaka, Notebook type apparatus.
  46. Tanaka, Wataru; Tatsukami, Ikki; Iijima, Takashi; Sato, Yutaka, Notebook type information apparatus having protruding front side portion.
  47. Bergeron, Kathleen A.; DeForest, Laura; Fetterman, Kevin S.; Goldberg, Michelle; Hibbard, Timothy S.; Huang, Chung-Tse; Leggett, William F.; Zeliff, Zachary Joseph, Portable computer display housing.
  48. Bergeron, Kathleen A.; DeForest, Laura; Fetterman, Kevin S.; Goldberg, Michelle; Hibbard, Timothy S.; Huang, Chung-Tse; Leggett, William F.; Zeliff, Zachary Joseph, Portable computer display housing.
  49. Bergeron, Kathleen A.; DeForest, Laura; Fetterman, Kevin S.; Goldberg, Michelle; Hibbard, Timothy S.; Huang, Chung-Tse; Leggett, William F.; Zeliff, Zachary Joseph, Portable computer display housing.
  50. Thomason, Gary; Fetterman, Kevin S.; DeForest, Laura M.; Hopkinson, Ron; Goldberg, Michelle; Goel, Ruchi; Raff, John; Hibbard, Timothy S., Portable computer electrical grounding and audio system architectures.
  51. Thomason, Gary; Fetterman, Kevin S.; DeForest, Laura M.; Hopkinson, Ron; Goldberg, Michelle; Goel, Ruchi; Raff, John; Hibbard, Timothy S., Portable computer electrical grounding and audio system architectures.
  52. Doherty, John; Collins, Mike; Steigerwald, Todd; Bagwell, Phillip, Portable computer with thermal control and power source shield.
  53. Thompson, Peter M.; Adamcyk, Martin; Van Vorhis, Timothy G.; Lucchesi, Arthur J.; Moore, Thomas A.; Morris, Matthew B., Self fixturing assembly techniques.
  54. Lineal, Kara; Born, Joe, Shielded heat-dissipating lap cushion.
  55. Lineal, Kara; Born, Joe, Shielded heat-dissipating lap cushion.
  56. Chang, Cheng-Chung; Li, Yuan-Long, Shielding clip and electronic device.
  57. Chamseddine, Ahmad; Wolfe, Mark, System, apparatus and method for cooling electronic components.
  58. Chamseddine, Amhad; Wolfe, Mark, System, apparatus and method for cooling electronic components.
  59. Worley, Richard; Berry, Chase, Wrapped multiple density gasket.
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