[특허]Method of manufacturing an encapsulated transducer with an integrally formed full length sleeve and a component alignment preform

[미국특허] Method of manufacturing an encapsulated transducer with an integrally formed full length sleeve and a component alignment preform 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01F-041/00
출원번호	US-0166331 (1998-10-05)
발명자 / 주소	Van Den Berg Dave
출원인 / 주소	Bently Nevada Corporation
대리인 / 주소	DeBoo
인용정보	피인용 횟수 : 10 인용 특허 : 31

초록 ▼

An encapsulated transducer (10) includes an injection molded encapsulation (20) having front end (22) and back end (24). The encapsulation (20) is a monolith of cured moldable material ensconcing a sensing element or coil (90) proximate front end (22) and a portion of an information transmitting medium (120) emanating from back end (24). A component alignment preform (40) operatively couples sensing element (90) with information transmitting medium (120). A protective sleeve (150) is transfer molded over coil (90) and interlocked with preform (40) thereby forming a sleeved coil and cable assembly (170). This sleeved coil and cable assembly (170) is encapsulated by an injection molding process which provides the durable encapsulation (20). The sleeved coil and cable assembly (170) is symmetrically disposed within the encapsulation (20) and the encapsulation (20) includes an integrally formed protective wall having a uniform thickness "T" along a forwardmost portion of sensing element (90) and integrally transitioning into an uninterrupted side wall circumscribing the sensing element and a portion of the cable.

대표청구항 ▼

[ I claim:] [1.] A process for making a transducer, comprising the steps of:providing a sensing coil having a center void, a front face, a rear face, a body having an exterior side surface and at least a first lead and a second lead extending from said sensing coil;providing a cable having at least one outer conductor surrounding at least one insulator carrying at least one center conductor;stripping an end of the cable in a step-like fashion to expose a portion of said center conductor, said insulator and said outer conductor;forming a front and rear pair of ferrules with said front ferrule having a bore with a diameter substantially matching the diameter of said center conductor and said rear ferrule having a bore with a diameter substantially matching the diameter of said outer conductor;molding together in linearly spaced proximity with a self-bonding moldable material said front and rear ferrules and providing in such molding step an annular recess near said front ferrule and linearly aligned therewith and a chamber interposed between and in open communication with said front and rear ferrules, thereby forming a component alignment preform;inserting said coil in said annular recess and electrically connecting said first lead to said front ferrule and said second lead to said rear ferrule;inserting said stripped cable end into said bores of said molded together front and rear ferrules and mechanically and electrically connecting said outer conductor to said rear ferrule and said center conductor to said front ferrule, thereby forming a sensing coil and cable assembly;molding a full length sleeve flush with said front face of said sensing coil and over said exterior side surface of said body of said sensing coil and over a portion of said component alignment preform wherein said full length sleeve contours to said preform and said exterior side surface of said body of said sensing coil and substantially uniformly radially extends therefrom to an outer surface thereby substantially eliminating any gaps between said sleeve and both said preform and said body of said coil thereby forming a sleeved coil and cable assembly;interlocking said full length sleeve into said preform by integrally molding moldable material with said full length sleeve which extends away from an interior surface of said sleeve and into at least one passage disposed within said preform for mechanically interlocking said sleeve into said preform;supporting and centering said sleeved coil and cable assembly within a mold cavity with at least one slidable support;orienting the cable to extend out from the mold cavity;locating said sensing coil within the mold cavity and spacing said front face of said sensing coil a distance from a front wall of the mold cavity with at least one slidable locator and at least one slidable support;retracting the slidable locator from the mold cavity;injecting said self-bonding moldable material into the cavity of the mold to precisely ensconce said sleeved coil and cable assembly and providing a precise face thickness covering said face of said coil;retracting the slidable supports from the sleeved coil and cable assembly so that said self-bonding moldable material will flow into the areas heretofore occupied by the slidable supports;allowing the moldable material to set; andremoving the thus formed transducer from the mold cavity as an integrated unit having a seamless mass of moldable material including an uninterrupted substantially uniform thick front wall substantially parallel with and directly abutting and uniformly extending away from said front face of said active element and transitioning into a substantially uninterrupted side wall circumscribing said full length sleeve for ensconcing said sleeved coil and cable assembly.

이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

Dickie Robert G. (Newmarket CAX) Phillips Michael (Mississauga CAX), Apparatus for plastic injection overmolding.
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Van Den Berg David (Markleeville CA) Peterson Eric C. (Minden NV) Saarem David M. (Minden NV) De Lange Dennis D. (Gardnerville NV), Cable locking and sealing process for sensor.
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Buchschmid Emil (Rosstal DEX) Ebenhh Erich (Ansbach DEX) Moog Michael (Leinfelden-Echterdingen DEX) Huber Werner (Schwaikhaim DEX) Stritzel Berthold (Ansbach DEX), Cable supporting insert closing an opening in the housing of an inductive rotational speed sensor.
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Hermle Eduard (Kirchstrasse 20 D-7303 Neuhausen a.d.Fildern DEX), Electric proximity sensor.
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Forster Joachim (Winnenden DEX), Encapsulated apparatus.
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Plunkett James P. (West Dundee IL) Latchford Joseph T. (Bowmanville CA), Encapsulated coil and method of making the same.
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Weber Bruce (House Springs MO) Kloster Gerald G. (Sturgeon Bay WI), Endshield cover assembly for a motor.
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Byrne John R. (Watertown WI), Floating insert injection mold.
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Lavallee Gerald A. (Belchertown MA) Jarmuzewski Mario R. (Chicopee MA), Golf ball injection mold.
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Mehnert Wolfgang (Lindau-Reutin DEX), Housing for electronic switchgear.
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Goll Manfred (Glauburg DEX) Wehner Erkenbert (Frankfurt am Main DEX), Induction generator.
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Fay John E. (Leominster MA) Faulkner Michael T. (Leominster MA), Injection molding mechanism for forming a monolithic tubular pipette.
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Ormson Timothy J. (2131 Woodruff Blvd. Janesville WI 53545), Kitchen tools and method of preparation.
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Togo Ichiro (Himeji JPX), Magnetic pickup sensor.
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Pierpont, Ralph E., Method for encapsulating a radial leaded electrical component.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Kilgore David C. (Yorktown VA), Method of making a hermetically sealed overmolded free-standing solenoid coil.
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Schutts Mark E. (Reno NV), Method of making a proximity sensor.
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Yokoyama Takaaki (Niiza JPX), Mold assembly.
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Sano Takezo (Shiga JPX) Tsuruyoshi Kenichi (Kusatsu JPX), Molding apparatus with retractable preform support pins.
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Shead Terence H. C. (Chorley Wood EN) Wills David G. (St. Albans EN), Moulding.
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Kohen Isak (Rillieux la Pape FRX), Pickup having encapsulated electrical and magnetic elements.
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Prox Rolf (Mettmann DEX), Proximity sensing head.
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Schutts Mark E. (Reno NV), Proximity sensor resistant to axial and torsional forces.
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Bernardon Edward (Bedford MA) Foley Michael F. (Cambridge MA), Reconfigurable fiber-forming resin transfer system.
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Miyamoto Mitsugu (Chigasaki JPX) Togashi Minoru (Chigasaki JPX) Takahashi Fumio (Yokohama JPX) Fukuoka Yutaka (Tokyo JPX), Resin-seal apparatus for semiconductor element.
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Shaw, Clifford O., Resonant probe and radio frequency coupler.
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Giza John (10 Morningside Ave. Acushnet MA 02743), Retractable pin for an injection mold.
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Giza John P. (Acushnet MA), Retractable pin mold.
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Echasseriau Gilbert (Toulouse FRX) Oliveau Patrice (Toulouse FRX), Variable reluctance electromagnetic sensor with pole piece-magnet assembly locking mechanism and method of assembly.
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이 특허를 인용한 특허 (10) 인용/피인용 타임라인 분석

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Csak, Louis R., Electrical connector and a method for manufacturing same.
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Csak, Louis R., Electrical connector assembly having a spin ring and a pre-mold covering an electrical connector.
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Csak, Louis R, Electrical connector having a pre-molded and an over-molded material.
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Csak, Louis R., Electrical connector having a spin ring and a pre-mold with a wiggle ring groove.
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Csak, Louis R., Electrical connector having a spin ring, a pre-mold and an over-mold.
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Kaltenbach,Dirk; Skarpil,Harry, Housing for movement sensor with protective cover for components.
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Bader,Christopherus, Method for operating a tool shaft.
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Rose, Robert Ivan, Method of making a proximity probe.
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Lamb,Wayne A.; Michelhaugh,Scott E.; Schelonka,Peter A.; Stolfus,Joel D., Thermoplastic overmolding for small package turbocharger speed sensor.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method of manufacturing an encapsulated transducer with an integrally formed full length sleeve and a component alignment preform 원문보기

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이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

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[미국특허] Method of manufacturing an encapsulated transducer with an integrally formed full length sleeve and a component alignment preform 원문보기

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이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (10) 인용/피인용 타임라인 분석

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