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Flexible heat transfer device and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0154253 (1998-09-16)
발명자 / 주소
  • Richey
  • III Joseph B.
출원인 / 주소
  • Advanced Ceramics Corporation
대리인 / 주소
    Anderson, Kill & Olick P.C.
인용정보 피인용 횟수 : 75  인용 특허 : 13

초록

A thin flexible heat transfer device for transferring heat from a heat source to a heat sink which may be located a substantial distance apart from each other. The heat transfer device includes a thin sheet of a non-structural, high thermal conductivity core material consisting of pyrolytic graphite

대표청구항

[ What is claimed is:] [1.] A thin flexible heat transfer device of indefinite length for transferring heat from a heat source to a heat sink which may be located a substantial distance apart from one another comprising:a thin sheet of a non-structural, high thermal conductivity core material consis

이 특허에 인용된 특허 (13)

  1. Yamazoe Hiroshi (Yokohama JPX) Sugiura Isao (Yokohama JPX), Composite graphite sheets.
  2. Schuft Charles F. (Westford MA), Controlled highly densified diamond packing of thermally conductive electrically resistive conduit.
  3. Thomas Daniel L. (Portland OR), Electrically insulating thermally conductive pad for mounting electronic components.
  4. Lohrke James L. (Valencia CA) Sterry Janet M. (Canoga Park CA) Lyons Michael D. (Saugus CA), Flexible surface deformation-resistant graphite foil.
  5. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  6. Arnold Judson V. (Bedford TX) Peoples James R. (Burleson TX) McKague Elbert L. (Fort Worth TX), High heat density transfer device.
  7. Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
  8. Rawal Suraj Prakash, High thermal conductivity plugs for structural panels.
  9. Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
  10. Dahl ; Michael M. ; Erb ; Lester D., Method for making a liquid heat exchanger coating.
  11. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Semiconductor cooling apparatus.
  12. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523), Thermally conductive joining film.
  13. Eastman George Y. (Lancaster PA), Unfurlable heat pipe.

이 특허를 인용한 특허 (75)

  1. Wayman, Michael J., Apparatus for directing heat to a heat spreader.
  2. Wayman, Michael J., Apparatus for spreading heat over a finned surface.
  3. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat from a heat spreader.
  4. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat in a fin of a heat sink.
  5. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.
  6. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  7. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  8. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  9. Sayir,Haluk; Mariner,John Thomas, Bulk high thermal conductivity feedstock and method of making thereof.
  10. Xu, Zhiyue; Zhao, Lei, Carbon composites.
  11. Spacie, Christopher John; Davies, Robert Kellson; Stirling, Christopher Anthony, Carbon materials.
  12. Zhao, Lei; Xu, Zhiyue; Richard, Bennett M., Coatings containing carbon composite fillers and methods of manufacture.
  13. Hill, Richard F.; Smythe, Robert Michael, Compliant multilayered thermally-conductive interface assemblies.
  14. Ingram,Jason W., Conductive heat transfer system and method for integrated circuits.
  15. Lynch, Manuel; Fraitag, Leonard, Cuttable illuminated panel.
  16. Reis, Bradley E.; Smalc, Martin David; Laser, Brian J.; Kostyak, Gary Stephen; Skandakumaran, Prathib; Getz, Matthew G.; Frastaci, Michael, Cycling LED heat spreader.
  17. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Cycling LED heat spreader.
  18. Shives,Gary D.; Hoffert,Gerald; Varela,William, Display device.
  19. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  20. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  21. Nishikawa, Yasushi; Murakami, Mutsuaki; Akahori, Kiyokazu, Filmy graphite and process for producing the same.
  22. Nishikawa, Yasushi; Murakami, Mutsuaki; Akahori, Kiyokazu, Filmy graphite and process for producing the same.
  23. Nishikawa, Yasushi; Murakami, Mutsuaki; Akahori, Kiyokazu, Filmy graphite and process for producing the same.
  24. Nishikawa, Yasushi; Murakami, Mutsuaki; Akahori, Kiyokazu, Filmy graphite and process for producing the same.
  25. Ellsworth, Jr., Michael J.; Marotta, Egidio; Singh, Prabjit, Finned heat sink.
  26. Yoo, Jae-Wook; Choi, Kyoung-Sei; Cho, Eun-Seok; Choi, Mi-Na; Hwang, Hee-Jung; Bae, Se-Ran, Flexible heat sink having ventilation ports and semiconductor package including the same.
  27. Kilroy, Kevin Donald; Miller, Darren L.; Wavering, Jeffrey T., Flexible thermal transfer strips.
  28. Zhao, Lei; Xu, Zhiyue; Deng, Guijun, Functionally graded articles and methods of manufacture.
  29. Nishikawa, Kazuhiro; Nishiki, Naomi; Kitaura, Hidetoshi; Nakaya, Kimiaki; Tanaka, Atsushi, Graphite structure, and electronic device using the same.
  30. Norley, Julian; Tzeng, Jing-Wen; Klug, Jeremy, Graphite-based heat sink.
  31. Eiger, Jay H, Heat dispersion for implantable medical devices.
  32. Krassowski, Daniel W.; Chen, Gary G., Heat dissipating component using high conducting inserts.
  33. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  34. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  35. Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Capp,Joseph Paul, Heat spreader for display device.
  36. Clovesko, Timothy; Norley, Julian; Smalc, Martin David; Capp, Joseph Paul, Heat spreader for emissive display device.
  37. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  38. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  39. Michael Z. Eckblad ; Pardeep K. Bhatti, Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader.
  40. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Heat spreaders with vias.
  41. Reis, Bradley E.; Cartiglia, James R., Heat spreading circuit assembly.
  42. Dando, III, Charles H.; Larcheveque, Jon; Vos, David L., High performance large tolerance heat sink.
  43. Kim, Ick Chan; Kim, Moo Seong, Hot plate and method of manufacturing the same.
  44. Lin,Kuo Len; Tsui,Hui Min; Hsu,Ken, Isothermal plate assembly with predetermined shape and method for manufacturing the same.
  45. Reis,Bradley E.; Cartiglia,James R., LED with integral via.
  46. Lynch,Manuel; Fraitag,Lenny; Wijesinghe,Rehana, Lighting apparatus.
  47. Hill, Richard F.; Smythe, Robert Michael, Memory modules including compliant multilayered thermally-conductive interface assemblies.
  48. Petroski, James T., Method of making an electronic device.
  49. Ellsworth, Jr.,Michael J.; Marotta,Egidio; Singh,Prabjit, Method of manufacturing a finned heat sink.
  50. Zhao, Lei; Xu, Zhiyue, Methods of making carbon composites.
  51. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  52. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  53. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  54. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  55. Zhao, Lei; Xu, Zhiyue, Reinforced composites, methods of manufacture, and articles therefrom.
  56. Krassowski,Daniel Witold; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Sandwiched finstock.
  57. Fujiwara, Kikuo; Tozawa, Masaaki; Shives, Gary D.; Norley, Julian; Reynolds, III, Robert Anderson, Sandwiched thermal solution.
  58. Zhao, Lei; Xu, Zhiyue, Self-lubricating flexible carbon composite seal.
  59. Zhao, Lei; Xu, Zhiyue, Self-lubricating flexible carbon composite seal.
  60. Merewether, Ray; Olsson, Mark S.; Simmons, Jon E.; Sanderson, IV, John R.; Steiner, Aaron J., Semiconductor lighting devices and methods.
  61. Murakami, Masahiro; Kushino, Masahiko; Deguchi, Akiteru; Amano, Yoshihisa, Semiconductor module.
  62. Kelsch, Daniel N.; Smith, Alexander K.; Toal, Francis J., Superplastic forming for titanium implant enclosures.
  63. Zhao, Lei; Xu, Zhiyue; Goodson, James Edward; Furlan, Wayne R., Swellable compositions, articles formed therefrom, and methods of manufacture thereof.
  64. Zhao, Lei; Xu, Zhiyue; Goodson, James Edward; Furlan, Wayne R., Swellable compositions, articles formed therefrom, and methods of manufacture thereof.
  65. Okabayashi, Yoshiaki, Thermal diffusion sheet and method for positioning thermal diffusion sheet.
  66. Chen, Ga-Lane; Leu, Charles, Thermal interface material.
  67. Jing Wen Tzeng, Thermal management system.
  68. Tzeng, Jing-Wen, Thermal management system.
  69. Hardesty, Robert E., Thermal pyrolytic graphite enhanced components.
  70. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for electronic devices.
  71. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for portable electronic devices.
  72. Zhang,Jian; Tonapi,Sandeep Shrikant; Mills,Ryan Christopher; Gowda,Arun Virupaksha, Thermal transport structure and associated method.
  73. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
  74. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
  75. Zhao, Lei; Xu, Zhiyue; Deng, Guijun, Wear-resistant and self-lubricant bore receptacle packoff tool.
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