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[미국특허] Substrate transferring mechanism 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • B65G-049/07
출원번호 US-0453031 (1999-12-02)
우선권정보 JP0219769 (1995-08-05)
발명자 / 주소
  • Yonemitsu Shuji,JPX
  • Karino Toshikazu,JPX
  • Yoshida Hisashi,JPX
  • Watahiki Shinichiro,JPX
  • Yoshida Yuji,JPX
  • Shimura Hideo,JPX
  • Sugimoto Takeshi,JPX
  • Aburatani Yukinori,JPX
  • Ikeda Kazuhito,JPX
출원인 / 주소
  • Kokusai Electric Co., Ltd., JPX
인용정보 피인용 횟수 : 46  인용 특허 : 28

초록

A substrate processing apparatus comprises a substrate transfer chamber; a substrate processing chamber disposed on a first side wall of the substrate transfer chamber; an intermediate substrate holding chamber disposed on a second side wall of the substrate transfer chamber; a first substrate holde

대표청구항

[ What is claimed is:] [1.] A substrate transferring mechanism, comprising:a cassette holding device for holding a cassette in which substrates are to be stacked;a substrate holding device for holding said substrate or said substrates;a substrate transfer device for transferring said substrate from

이 특허에 인용된 특허 (28) 인용/피인용 타임라인 분석

  1. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  2. Bean John C. (New Providence NJ), Apparatus for simultaneous molecular beam deposition on a plurality of substrates.
  3. Muka Richard S. (Topsfield MA) Pippins Michael W. (Hamilton MA) Drew Mitchell A. (Portsmouth NH), Cluster tool batchloader of substrate carrier.
  4. Shiraiwa Hirotsugu (Hino JPX), Conveyor apparatus.
  5. Ishii Katsumi (Kanagawa-ken JPX) Kikuchi Hisashi (Esashi JPX), Device for transferring plate-like objects.
  6. Kyogoku Mitsusuke (Tama JPX), Load lock chamber for vertical type heat treatment apparatus.
  7. Nakagawa Yoshinori (Numazu JPX) Mitani Shinichi (Numazu JPX) Kobayashi Takehiko (Mishima JPX) Honda Takaaki (Yokohama JPX), Method for multichamber sheet-after-sheet type treatment.
  8. Akimoto Masami (Kumamoto JPX) Yoshioka Kazutoshi (Kumamoto JPX) Iida Naruaki (Kumamoto JPX), Method for processing wafer-shaped substrates.
  9. Vowles E. John (Deering NH) Maher Joseph A. (Wenham MA) Napoli Joseph D. (Windham NH), Modular vapor processor system.
  10. Ozawa Masahito (Yamanashi JPX) Mizukami Masami (Yamanashi JPX) Kanazashi Masanobu (Kofu JPX) Takasoe Toshihiko (Yamanashi JPX) Narushima Masaki (Yamanashi JPX) Kubodera Masao (Yamanashi JPX), Multi-chamber system provided with carrier units.
  11. Turlot Emmanuel (Verrires le Buisson FRX) Emeraud Thierry (Bures sur Yvettes FRX) Schmitt Jacques (La Ville du Bois FRX), Plasma treatment apparatus and method for operating same.
  12. Iwabuchi Katsuhiko (Sagamihara JPX), Processing apparatus.
  13. Ban Vladimir S. (Hopewell NJ), Radiation heated reactor for chemical vapor deposition on substrates.
  14. Kumagai Hiromi (Tokyo JPX), Semiconductor manufacturing apparatus with a spare vacuum chamber.
  15. Imahashi Issei (Yamanashi-ken JPX), Semiconductor processing system.
  16. Araki Shinichiro (Kumamoto JPX), Semiconductor treatment system and method for exchanging and treating substrate.
  17. Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Somekh Sasson (Los Altos Hills CA) Maydan Dan (Los Altos Hills CA), Staged-vacuum wafer processing system and method.
  18. Yonemitsu Shuji,JPX ; Karino Toshikazu,JPX ; Yoshida Hisashi,JPX ; Watahiki Shinichiro,JPX ; Yoshida Yuji,JPX ; Shimura Hideo,JPX ; Sugimoto Takeshi,JPX ; Aburatani Yukinori,JPX ; Ikeda Kazuhito,JPX, Substrate processing apparatus.
  19. Kondo Hiroshi (Tokyo JPX) Tachibana Mitsuhiro (Yamanashi JPX), System for continuously washing and film-forming a semiconductor wafer.
  20. Iwai Hiroyuki (Sagamihara JPX) Tanifuji Tamotsu (Yamato JPX) Asano Takanobu (Yokohama JPX) Okura Ryoichi (Kanagawa-ken JPX), Treatment apparatus.
  21. Fukasawa Yoshio (Kofu JPX) Hosoda Shozo (Yamanashi-ken JPX) Nakagome Tatsuya (Yamanashi-ken JPX) Tozawa Takashi (Yamanashi-ken JPX) Suzuki Koji (Yamanashi-ken JPX) Ishihara Yasumasa (Kofu JPX) Aoyagi, Vacuum process apparatus and vacuum processing method.
  22. Kato Susumu (Isawa-Cho JPX) Yamaguchi Hirofumi (Sudama-Cho JPX), Vacuum process apparaus.
  23. Kato Shigekazu (Kudamatsu JPX) Nishihata Kouji (Tokuyama JPX) Tsubone Tsunehiko (Hikari JPX) Itou Atsushi (Kudamatsu JPX), Vacuum processing apparatus and operating method therefor.
  24. Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.
  25. Lee Hideki (Nirasaki JPX), Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus.
  26. Williams Owen P. (Phoenix AZ), Vacuum wafer transport and processing system and method using a plurality of wafer transport arms.
  27. Koons John J. (Georgetown TX), Vertical boat for holding semiconductor wafers.
  28. Gadgil Prasad N. ; Seidel Thomas E., Vertically-stacked process reactor and cluster tool system for atomic layer deposition.

이 특허를 인용한 특허 (46) 인용/피인용 타임라인 분석

  1. Moore, Robert B.; Ruhland, Eric; Sundar, Satish; Silvetti, Mario David, Apparatus and method for a multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same.
  2. Mori, Takao; Yamaguchi, Masaru; Kamiyama, Isao, Apparatus and method for manufacturing an organic electroluminescence display.
  3. Mori, Takao; Yamaguchi, Masaru; Kamiyama, Isao, Apparatus and method for manufacturing an organic electroluminescence display.
  4. Sandhu, Gurtej S.; Doan, Trung Tri, Atomic layer deposition methods and atomic layer deposition tools.
  5. Sandhu,Gurtej S.; Doan,Trung Tri, Atomic layer deposition methods and atomic layer deposition tools.
  6. Sugiyama,Hidetoshi; Takahashi,Katsuaki; Yanami,Hideyuki; Sattler,Stephan, Automatic analyzer and part feeding device used for the analyzer.
  7. Lee,Jae Chull; Berkstresser,David, Curved slit valve door with flexible coupling.
  8. Lee, Jae-Chull; Kurita, Shinichi; White, John M.; Anwar, Suhail, Decoupled chamber body.
  9. Kurita, Shinichi; Blonigan, Wendell T., Double dual slot load lock chamber.
  10. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  11. Kurita, Shinichi; Blonigan, Wendell T.; Hosokawa, Akihiro, Dual substrate loadlock process equipment.
  12. Koji Harada JP; Issei Ueda JP, Heat and cooling treatment apparatus and substrate processing system.
  13. Kurita, Shinichi; Blonigan, Wendell T.; Tanase, Yoshiaki, Large area substrate transferring method for aligning with horizontal actuation of lever arm.
  14. Kurita,Shinichi; Blonigan,Wendell T.; Tanase,Yoshiaki, Load lock chamber for large area substrate processing system.
  15. Kurita,Shinichi; Blonigan,Wendell T., Load lock chamber having two dual slot regions.
  16. Lee, Jae-Chull; Anwar, Suhail; Kurita, Shinichi, Load lock chamber with decoupled slit valve door seal compartment.
  17. Kevin Fairbairn ; Howard E. Grunes ; Christopher Lane ; Kelly A. Colborne, Load-lock with external staging area.
  18. Condrashoff, Robert Sergel; Fazio, James Patrick; Hoffman, David Eugene; Tyler, James Scott, Material handling system and methods for a multichamber plasma treatment system.
  19. Brenninger Georg,DEX ; Sedlmeier Wolfgang,DEX ; Furfanger Martin,DEX ; Hansson Per-Ove,DEX, Method and device for detecting an incorrect position of a semiconductor wafer.
  20. Matsuoka, Takaaki, Method and device for heat treatment.
  21. Matsuoka,Takaaki, Method and device for heat treatment.
  22. Ozaki, Takashi; Suzaki, Kenichi; Mizuno, Norikazu, Method for fabricating a semiconductor device and a substrate processing apparatus.
  23. Kurita,Shinichi; Blonigan,Wendell T., Method for transferring substrates in a load lock chamber.
  24. Yahng, Ji-Sang; Park, Young-Wook; Han, Jae-Jong; Chang, Jum-Soo, Method of forming a layer on a wafer.
  25. Hirano, Makoto; Yoshida, Akihiro, Method of manufacturing a semiconductor device.
  26. Hirano, Makoto; Yoshida, Akihiro, Method of manufacturing a semiconductor device.
  27. Michael Abraham DE; Ivo J. M. M. Raaijmakers NL; Alain Gaudon FR; Pierre Astegno FR, Modular substrate measurement system.
  28. Roger V. Heyder ; Thomas B. Brezocsky ; Robert E. Davenport, Multiple loadlock system.
  29. Kurita, Shinichi; Anwar, Suhail; Lee, Jae-Chull, Multiple slot load lock chamber and method of operation.
  30. Keiichi Tanaka JP; Shinsuke Asao JP; Masahito Ozawa JP; Masaki Sohma JP, Process system with transfer unit for object to be processed.
  31. Wang,Hougong; Ngan,Kenny King Tai; Xu,Zheng, Semiconductor wafer preheating.
  32. Yamagishi,Takayuki; Watanabe,Takeshi, Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same.
  33. Nishimura, Kazuhiro; Nakamura, Yasushi; Kawamatsu, Yasuo; Chikamori, Ryuichi, Substrate processing apparatus.
  34. Kurokawa, Harushige, Substrate processing apparatus and reaction tube for processing substrate.
  35. Inagaki, Yukihiko; Onishi, Kensaku; Yamamoto, Jun, Substrate processing apparatus, storage device, and method of transporting substrate storing container.
  36. Inagaki, Yukihiko; Onishi, Kensaku; Yamamoto, Jun, Substrate processing apparatus, storage device, and method of transporting substrate storing container.
  37. Murata, Akira; Enokida, Suguru; Douki, Yuichi, Substrate transfer apparatus, substrate process system, and substrate transfer method.
  38. Mitsuyoshi, Ichiro, Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus.
  39. Hirano, Makoto; Yoshida, Akihiro, Substrate treatment equipment and manufacturing method of substrate.
  40. Bernard, William J.; Poor, Ralph P.; Barbee, Garry W.; Gottschalk, John W., Surface treatment of metallic articles in an atmospheric furnace.
  41. Sakamoto,Koichi; Tonegawa,Yamato; Fujita,Takehiko, System and method for performing semiconductor processing on substrate being processed.
  42. Sakamoto, Koichi; Tonegawa, Yamato; Fujita, Takehiko, System and method for performing semiconductor processing on target substrate.
  43. Selen, Louis J. M.; Timmermans, Eric A. H.; Bolscher, Gerrit ten, System and method of reducing particle contamination of semiconductor substrates.
  44. Sluijk, Boudewijn Gijsbert; De Ridder, Christianus Gerardus Maria, System for the treatment of wafers.
  45. Hiramoto, Noboru, Vacuum heat-treatment apparatus.
  46. Kim, Sam Hyungsam; Lee, Jae-Chull; Sterling, William N.; Brown, Paul, Valve door with ball coupling.

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