초록 ▼

Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an

Methods and apparatus are disclosed for efficiently and precisely adhering and centering particles on tacky areas on a surface containing an array of tacky and non-tacky areas. These methods and apparatus for particle attachment and centering involve holding and heating of the surface containing an array of tacky and non-tacky areas with particles adhered thereon for a period of time and at a temperature to allow the particles to adhere and center to the tacky areas. The surface containing the array of tacky and non-tacky areas can be heated either prior to, during or after a step of contacting the array with particles. Either discrete sheets or a continuous moving web of material having a surface containing an array of tacky and non-tacky areas can be employed. Each tacky area of an array of tacky and non-tacky areas has a size and bonding strength suitable for adhesion of one particle thereto in formation of an array. The array is populated with conductive-particles, is useful in the precise placement of particles on contact pads of electronic devices, such as circuit boards insemiconductor applications.

대표청구항 ▼

[ What is claimed is:] [1.] An improved method for mounting particles on a surface having an array of tacky and non-tacky areas thereon, comprising the steps of:(a) obtaining the surface having an array of tacky and non-tacky areas thereon at ambient temperature;(b) flowing the particles across the

[ What is claimed is:] [1.] An improved method for mounting particles on a surface having an array of tacky and non-tacky areas thereon, comprising the steps of:(a) obtaining the surface having an array of tacky and non-tacky areas thereon at ambient temperature;(b) flowing the particles across the surface to allow particles to contact the tacky areas and adhere thereto with the proviso that each of the tacky areas has a size suitable for adhesion of only one particle per tacky area; and(c) removing the excess particles not adhered to the tacky areas; whereby the tacky areas are heated to a temperature of at least 30.degree. C. as the particles are adhered thereto prior to step (c) so that the particles move toward the centers of the tacky areas.