초록 ▼

A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal

A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, and higher level assemblies including such devices.

대표청구항 ▼

[ What is claimed is:] [1.] A ceramic composite comprising:a ceramic substrate;a ceramic bonded directly to said ceramic substrate via a direct covalent bond along an interface between said ceramic and said ceramic substrate, said covalent bond being effected by dispersion of a metal organic precurs

[ What is claimed is:] [1.] A ceramic composite comprising:a ceramic substrate;a ceramic bonded directly to said ceramic substrate via a direct covalent bond along an interface between said ceramic and said ceramic substrate, said covalent bond being effected by dispersion of a metal organic precursor of said ceramic and pyrolysis of said metal organic precursor at a temperature of 500.degree. C. or less to form the ceramic composite;said ceramic comprising a ceramic medium whose primary phase precursors have been mixed at the molecular level; andsaid interface between said ceramic substrate and said ceramic being essentially absent of any intermetallic eutectic or adhesive agent.