초록 ▼

The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect boa

The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. In one embodiment, a sheet of conductive material is processed by employing a known milling, stamping, or chemical etching technique to include a connection pattern which provides for flexible and selective interconnecting of individual electrochemical cells within the housing, which may be a hermetically sealed housing. Fuses and various electrical and electro-mechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.

대표청구항 ▼

[ What we claim is:] [1.] A solid-state energy storage device, comprising:a sealed housing through which a first terminal and a second terminal pass;a plurality of thin-film electrochemical cells disposed in the housing; andan interconnect board disposed in the housing and having a first contact and

[ What we claim is:] [1.] A solid-state energy storage device, comprising:a sealed housing through which a first terminal and a second terminal pass;a plurality of thin-film electrochemical cells disposed in the housing; andan interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals, the interconnect board including an electrically conductive surface comprising a connection pattern that provides selective series and parallel connectivity with the electrochemical cells.