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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Fabrication method for encapsulated micromachined structures

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-029/82   
미국특허분류(USC) 438/051 ; 438/052 ; 438/456 ; 257/415 ; 257/787
출원번호 US-0810387 (1997-03-03)
발명자 / 주소
  • Zhang Xia
  • McIntyre David G.
  • Tang William Chi-Keung
출원인 / 주소
  • Ford Motor Company
대리인 / 주소
    Mollon
인용정보 피인용 횟수 : 69  인용 특허 : 8
초록
▼

A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond areas on a single wafer such that areas surrounding the microstructures are maintained in a planar condition. A second wafer having a plurality of microstructure-receiving cavities is placed atop the first wafer and fusion or anodically bonded. The microstructures are preferably connected to lead bond pads which lie outside the surround, the second wafer also ha...

대표
청구항
▼

[ What is claimed is:] [1.] A process for the micromachining, and simultaneous encapsulating of a plurality of microstructures fabricated on a single planar silicon wafer, comprising:defining a plurality of fusion bond surround areas on said planar silicon wafer;fabricating a plurality of electronically active microstructures within said fusion bond surround areas such that said fusion bond surround areas are maintained in a substantially mutual co-planar condition;providing electrical communication between electronically active portions of said microstr...

이 특허에 인용된 특허 (8)

  1. Spangler Leland J. (Ann Arbor MI), Boron doped silicon accelerometer sense element.
  2. Tang William C. (Colorado Springs CO), Digital capacitive accelerometer.
  3. Salatino Matthew M. ; Young William R. ; Begley Patrick A., Lid wafer bond packaging and micromachining.
  4. Suzuki Masayoshi (Hitachioota JPX) Sasayama Takao (Hitachi JPX) Hanzawa Keizi (Mito JPX) Ichikawa Norio (Mito JPX) Horie Junichi (Hitachinaka JPX) Sugisawa Yukiko (Hitachinaka JPX) Ogasawara Yuuji (H, Method of making a capacitance type acceleration sensor.
  5. Kato Makiko,JPX ; Iwasaki Yasukazu,JPX ; Uchiyama Makoto,JPX, Method of producing device having minute structure.
  6. Cho Steve T., Process for bonding a shell to a substrate for packaging a semiconductor.
  7. Fujimoto Takamitsu (Amagasaki JPX) Kita Shuichi (Amagasaki JPX) Noda Atsuko (Amagasaki JPX) Koezuka Hiroshi (Amagasaki JPX), Resin-sealed semiconductor device.
  8. Takeuchi Yukihiro (Seto JPX) Yamamoto Toshimasa (Bisai JPX) Ohtsuka Yoshinori (Okazaki JPX) Akita Shigeyuki (Okazaki JPX) Hattori Tadashi (Okazaki JPX) Kanou Kazuhiko (Chiryu JPX) Ikeda Hirotane (Chi, Semiconductor accelerometer.

이 특허를 인용한 특허 (69)

  1. Lutz, Markus; Partridge, Aaron; Kronmueller, Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  2. Lutz,Markus; Partridge,Aaron; Kronmueller,Silvia, Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same.
  3. Lutz,Markus; Partridge,Aaron; Frey,Wilhelm; Ulm,Markus; Metz,Matthias; Stark,Brian; Yama,Gary, Anti-stiction technique for electromechanical systems and electromechanical device employing same.
  4. Steinberg, Dan A.; Rasnake, Jasean, Combined wet and dry etching process for micromachining of crystalline materials.
  5. Quenzer, Hans Joachim; Oldsen, Marten; Hofmann, Ulrich, Cover for microsystems and method for producing a cover.
  6. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Electromechanical system having a controlled atmosphere, and method of fabricating same.
  7. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Electromechanical system having a controlled atmosphere, and method of fabricating same.
  8. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  9. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  10. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Encapsulated microelectromechanical structure.
  11. Steinberg, Dan A.; Rasnake, Larry J., Etching process for micromachining crystalline materials and devices fabricated thereby.
  12. Steinberg,Dan A, Etching process for micromachining crystalline materials and devices fabricated thereby.
  13. Steinberg,Dan A.; Rasnake,Larry J., Etching process for micromachining materials and devices fabricated thereby.
  14. Goetz, Martin P.; Hatcher, Merrill A.; Jones, Christopher E., Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same.
  15. Oldsen, Marten; Hofmann, Ulrich, Housing for micro-mechanical and micro-optical components used in mobile applications.
  16. Lutz, Markus; Partridge, Aaron, Integrated getter area for wafer level encapsulated microelectromechanical systems.
  17. Lutz, Markus; Partridge, Aaron, Integrated getter area for wafer level encapsulated microelectromechanical systems.
  18. Lutz,Markus; Partridge,Aaron, Integrated getter area for wafer level encapsulated microelectromechanical systems.
  19. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  20. Lutz,Markus; Partridge,Aaron, Method for adjusting the frequency of a MEMS resonator.
  21. Zolnowski, Dennis Ronald, Method for hermetic leadless device interconnect using a submount.
  22. Von Koblinski, Carsten; Lackner, Gerald; Schrettlinger, Karin; Ottowitz, Markus, Method for manufacturing semiconductor devices having a glass substrate.
  23. Von Koblinski, Carsten; Lackner, Gerald; Schrettlinger, Karin; Ottowitz, Markus, Method for manufacturing semiconductor devices having a glass substrate.
  24. von Koblinski, Carsten; Lackner, Gerald; Schrettlinger, Karin; Ottowitz, Markus, Method for manufacturing semiconductor devices having a glass substrate.
  25. von Koblinski, Carsten; Lackner, Gerald; Schrettlinger, Karin; Ottowitz, Markus, Method for manufacturing semiconductor devices having a glass substrate.
  26. Zelsacher, Rudolf; Ganitzer, Paul, Method for manufacturing semiconductor devices having a metallisation layer.
  27. Zelsacher, Rudolf; Ganitzer, Paul, Method for manufacturing semiconductor devices having a metallisation layer.
  28. Zelsacher, Rudolf; Ganitzer, Paul, Method for manufacturing semiconductor devices having a metallisation layer.
  29. Quenzer, Hans Joachim; Hofmann, Ulrich; Stenchly, Vanessa, Method for producing structured optical components.
  30. Candler, Robert N., Method of accurately spacing Z-axis electrode.
  31. Okojie, Robert S.; Fralick, Gustave C.; Saad, George J., Method of assembling a silicon carbide high temperature anemometer.
  32. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating electromechanical device having a controlled atmosphere.
  33. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Method of fabricating microelectromechanical systems and devices having trench isolated contacts.
  34. Chen, Chien Hua; Haluzak, Charles C, Method of forming a printhead.
  35. Christopher P Fell GB; Kevin Townsend GB; Ian Sturland GB, Method of manufacturing a vibrating structure gyroscope.
  36. Weekamp,Johannus Wilhelmus, Method of manufacturing an electronic device.
  37. Okumura, Mika; Horikawa, Makio; Ishibashi, Kiyoshi, Method of manufacturing thin-film structure.
  38. Lutz, Markus; Partridge, Aaron; Stark, Brian H., Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same.
  39. Lutz, Markus; Partridge, Aaron; Stark, Brian H., Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same.
  40. Lutz, Markus; Patridge, Aaron; Stark, Brian H., Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same.
  41. Dong Il Kim KR; Young Kyum Ahn KR; Sam Won Chung KR; Byung Chang Song KR; Ha Poong Jeong KR, Micro cantilever style contact pin structure for wafer probing.
  42. Hofmann, Ulrich; Oldsen, Marten, Micro-mirror actuator having encapsulation capability and method for the production thereof.
  43. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same.
  44. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  45. Partridge, Aaron; Lutz, Markus; Kronmueller, Silvia, Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same.
  46. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems and devices having thin film encapsulated mechanical structures.
  47. Stark, Brian H.; Lutz, Markus; Partridge, Aaron, Microelectromechanical systems having stored charge and methods for fabricating and using same.
  48. Stark,Brian H.; Lutz,Markus; Partridge,Aaron, Microelectromechanical systems having stored charge and methods for fabricating and using same.
  49. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems having trench isolated contacts, and methods for fabricating same.
  50. Partridge,Aaron; Lutz,Markus; Kronmueller,Silvia, Microelectromechanical systems, and devices having thin film encapsulated mechanical structures.
  51. Steinberg, Dan A.; Rasnake, Jasean; Sherrer, David W., Micromachined structures made by combined wet and dry etching.
  52. Sherrer,David W., Microstructures comprising a dielectric layer and a thin conductive layer.
  53. Sherrer, David W., Microstructures comprising silicon nitride layer and thin conductive polysilicon layer.
  54. Kim, Sangchae; Crist, Steven, Package for an electronic device.
  55. Carpenter, Barry S.; Hagen, Kathy L.; Smith, Robert G., Packaged optical micro-mechanical device.
  56. Langa, Sergiu; Drabe, Christian; Sandner, Thilo, Production method.
  57. Mark G. Allen ; Sung-Pil Chang ; Jeong-Bong Lee, Robust substrate-based micromachining techniques and their application to micromachined sensors and actuators.
  58. Carpenter, Barry S., Self-aligning optical micro-mechanical device package.
  59. Hiroshi Kawai JP, Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same.
  60. Candler, Robert N.; Yama, Gary, Substrate with multiple encapsulated pressures.
  61. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  62. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  63. Lutz,Markus; Partridge,Aaron, Temperature controlled MEMS resonator and method for controlling resonator frequency.
  64. Freidhoff, Carl B., Thin film encapsulation of MEMS devices.
  65. Freidhoff,Carl B., Thin film encapsulation of MEMS devices.
  66. Carpenter, Barry S., Tooling fixture for packaged optical micro-mechanical devices.
  67. Enquist, Paul M.; Tong, Qin Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
  68. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure.
  69. Partridge, Aaron; Lutz, Markus; Gupta, Pavan, Wafer encapsulated microelectromechanical structure and method of manufacturing same.

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