$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Lapping apparatus and method for high speed lapping with a rotatable abrasive platen 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0168057 (1998-10-07)
발명자 / 주소
  • Duescher Wayne O.
출원인 / 주소
  • Keltech Engineering
대리인 / 주소
    Schwegman, Lundberg, Woessner & Kluth, P.A.
인용정보 피인용 횟수 : 90  인용 특허 : 64

초록

Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising: a) a frame (e.g., having a total weight

대표청구항

[ What is claimed:] [1.] A process for lapping a surface comprising:a) providing a work piece to be lapped onto a workpiece support, said workpiece having a surface which is to be lapped,b) providing a rotating platen havingi) a back surface andii) front surface,c) providing an abrasive material on

이 특허에 인용된 특허 (64)

  1. Hoopman Timothy L. (River Falls WI), Abrasive article for finishing.
  2. Fujiwara Yukio (Hyougo JPX) Shirai Keiichi (Omiya JPX) Inoue Fumio (Tokyo JPX), Abrasive cloth dresser.
  3. Hasegawa Fumihiko (Urawa JPX) Yamada Masayuki (Shirakawa JPX), Apparatus and method for chamfering the peripheral edge of a wafer to specular finish.
  4. Wittstock Gerhard (Uetersen DEX), Apparatus for controlling operation of a lapping, honing or polishing machine.
  5. Hasegawa Fumihiko (Urawa JPX) Yamada Masayuki (Shirakawa JPX) Kawano Hiroshi (Fukushima JPX) Ohtani Tatsuo (Fukushima JPX), Apparatus for polishing chamfers of a wafer.
  6. Onodera Masami (Niigata JPX), Apparatus for polishing hard disk substrates.
  7. Cronkhite Paul W. (Scottsdale AZ) Bosley Bruce C. (Mesa AZ) Jones James H. (Phoenix AZ) Patel Asit G. (Chandler AZ), Apparatus for polishing semiconductor wafers.
  8. Mahler Peter (Hainburg DEX) Naehring Herbert (Rodenbach DEX), Apparatus for transporting substrates.
  9. Motley Charles B. ; Hechel Dennis L., Automatic apparatus for grinding and polishing samples.
  10. Haus Bruce A. (29500 Bloom St. Box 398 Chisago City MN 55013) Kolkind Andrew A. (Rte. 3 ; Box 370 Isanti MN 55040), Automatic bowling ball resurfacing machine.
  11. Forrester Lester L. (Ridgecrest CA), Automatic positioner with nonlinear drive.
  12. Gosis Anatoly (Palatine IL), Automatic workpiece thickness control for dual lapping machines.
  13. Junker Erwin (Junkerstrasse 1 7618 Nordach DEX), Bearing system for high speed spindles of machine tools.
  14. Zuniga Steven M. ; Blumenkranz Stephen J., Carrier head design for a chemical mechanical polishing apparatus.
  15. Shamouilian Sam ; Shendon Norm, Carrier head with a layer of conformable material for a chemical mechanical polishing system.
  16. Wittstock Gerhard (Uetersen DEX), Control device for the processing pressure on lapping, honing and polishing machines.
  17. Siddall Graham J. (Woodside CA), Deformable chuck driven by piezoelectric means.
  18. Kellar John D. (Pontypool CAX) Pereman Gordon F. (Columbus CAX), Deformable vacuum holder with helical coil springs for shaping glass.
  19. Biebesheimer Klaus (Frankfurt am Main DEX) Hofsess Alexander (Dreieich DEX) Simpfendrfer Dieter (Mhlheim/M. DEX), Finish-machining machine comprising means for feeding an abrasive slurry at a controlled rate.
  20. Highberg Carle W. (Sylvania OH), Fixed-super-abrasive tool and method of manufacture thereof.
  21. Cozzini Artemio S. (3464 N. Dousman Milwaukee WI 53212), Grinding machine.
  22. Sekiya Shinji (Tokyo JPX) Ono Takatoshi (Nagareyama JPX), Grinding wheel for grinding the flat surface of a hard and brittle material.
  23. Moritomo Sadao (Ichikawa JA), High speed grinding spindle.
  24. Aoyama Masaaki (Kanagawa JPX) Kimura Keiichi (Kanagawa JPX), Holding apparatus for holding an article such as a semiconductor wafer.
  25. Mallon Thomas G. (Santa Clara CA), Keyed end effector for CMP pad conditioner.
  26. Duescher Wayne O., Lapping apparatus and process with raised edge on platen.
  27. Hodges ; Lee R., Lens polishing machine.
  28. Junker Erwin (Talstrasse 78 7611 Nordrach DEX), Method and apparatus for high speed profile grinding of rotation symmetrical workpieces.
  29. Jairath Rahul (Austin TX), Method and apparatus for polishing a semiconductor substrate wafer.
  30. Kimura Norio (Fujisawa JPX) Kawamoto Takayoshi (Chigasaki JPX) Ishii You (Fujisawa JPX) Aoki Katsuyuki (Yokohama JPX) Tateishi Kunio (Fujisawa JPX) Yasuda Hozumi (Fujisawa JPX) Namiki Keisuke (Fujisa, Method and apparatus for polishing workpiece.
  31. Hiyama Hirokuni,JPX ; Kimura Norio,JPX ; Yahiro Tomoyuki,JPX, Method of and apparatus for dressing polishing cloth.
  32. Sharkey ; III John F. (Camillus) Buck Robert J. (Holland Patent) Baltazar Lawrence C. (Schenectady NY), Method of and machine for grinding a workpiece.
  33. Tanaka Kouichi (Nishigo-mura JPX) Hashimoto Hiromasa (Nishigo-mura JPX) Suzuki Fumio (Taishin-mura JPX), Method of polishing semiconductor wafers and apparatus therefor.
  34. Nakazima Yukio (Nagano JPX) Kuroyanagi Itsuo (Chiba-ken JPX), Method of polishing wafers, a backing pad used therein, and method of making the backing pad.
  35. Dalke Charles Arthur (San Jose CA), Methods and apparatus for polishing seal surfaces in a nuclear reactor.
  36. Clowers Earl Roger (Jackson TN) Plume Steve Harry (Humboldt TN) Smith John Charles (Jackson TN), Motorized rotary tool having a head mounted by a pivotal joint.
  37. Hilscher Jerome A. (Olathe KS), Opposed disc deburring system.
  38. Woo Christy M.-C., Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to inc.
  39. Sakurai Kunihiko,JPX ; Togawa Tetsuji,JPX ; Nishi Toyomi,JPX ; Katsuoka Seiji,JPX ; Yajima Hiromi,JPX ; Kodera Masako,JPX, Polishing apparatus.
  40. Togawa Tetsuji,JPX ; Sakurai Kunihiko,JPX ; Kikuta Ritsuo,JPX, Polishing apparatus.
  41. Nishi Toyomi,JPX ; Tsujimura Manabu,JPX ; Takahashi Tamami,JPX ; Yajima Hiromi,JPX ; Aoki Riichiro,JPX ; Imoto Yukio,JPX ; Kodama Shoichi,JPX ; Himukai Kazuaki,JPX ; Kouno Gisuke,JPX ; Nishimura Taka, Polishing apparatus including cloth cartridge connected to turntable.
  42. Kawakami Hideo (Numazu JPX) Tazawa Shinichi (Mishima JPX) Endo Masami (Shizuoka JPX), Polishing machine.
  43. Bouladon Gabriel (Les Martinets B 38610 Gieres FRX) Grisel Lucien (Les Combes Herbeys 38320 FRX), Polishing machines incorporating rotating plate.
  44. Yamamoto Yoshiaki,JPX, Polishing pad and polishing apparatus having the same.
  45. Kinoshita Yoshimi (Amagasaki JPX) Kanda Tomoyuki (Amagasaki JPX) Kitano Katsuhisa (Amagasaki JPX) Yoshida Kazuo (Amagasaki JPX) Ohnishi Hiroshi (Amagasaki JPX) Yamanishi Kenichiro (Amagasaki JPX) Sas, Semiconductor producing apparatus comprising wafer vacuum chucking device.
  46. Bonora Anthony C. (Atherton CA) Lorenz Karl (Redwood City CA), Semiconductor wafer polishing machine and wafer carrier therefor.
  47. Korem Aharon (Herzliya ILX), Sheet holding device for an arcuate surface with vacuum retention.
  48. Mondragon Carl W. (Boise ID) Sperry David A. (Boise ID), Silicon wafer holder.
  49. Chandler Willard F. (Byron MN) Jacobson LaVerne B. (Owatonna MN) Johnson Robert D. (Rochester MN) Monahan Steven E. (Rochester MN), Slurry containment device for polishing semiconductor wafers.
  50. Adams John A. (Escondido CA) Krulik Gerald A. (San Clemente CA) Harwood C. Randall (Tempe AZ), Slurry recycling in CMP apparatus.
  51. Kamiya Saburo (Yokohama JPX), Substrate holder.
  52. Fulton Kenneth W. (Sumner WA), Superpolishing agent, process for polishing hard materials, and polished hard materials.
  53. Mitsuhashi Masashige (Tokyo JPX) Ono Hideyuki (Tokyo JPX), Surface polishing apparatus.
  54. Pasch Nicholas F. (Pacifica CA) Mallon Thomas G. (Santa Clara CA) Franklin Mark A. (Scott\s Valley CA), Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers.
  55. Foley Thomas P. (Stony Brook NY) Mosciatti Roger (Coram NY), Vacuum chuck rotary seal.
  56. Takagi Eizi (Ooita JPX), Vacuum holder.
  57. Bryant Robert C. (Honeoye Falls NY), Vacuum holder for sheet materials.
  58. Kleinman Yossie (Rehovot ILX), Vacuum holder particulary useful as a vacuum table.
  59. Kellar John D. (Pontypool CAX) Pereman Gordon F. (Columbus CAX), Vacuum holder with anti-bulging means used to shape glass sheets.
  60. Schwartz Vladimir (Lexington MA) Freytsis Avrum (Swampscott MA), Vacuum pick for semiconductor wafers.
  61. Mehrer Donald D. (3216 29th Ave. West Seattle WA 98199), Vacuum sander.
  62. Coughlin Vincent D. (Box 608 ; R.D. #1 Oxford NJ 08901), Vacuum work piece holder.
  63. Dietrich Hans P. (Adliswil CHX) Ott Hanspeter (Thalwil CHX) Webb David J. (Ruschlikon CHX), Wafer holder method and apparatus in a vacuum deposition system.
  64. daCosta Harry (Paradise Valley AZ) Howerton Hugh K. (Falls Church VA) Hughes William E. (Annandale VA) Monk Gaines W. (Alexandria VA), Workpiece holder.

이 특허를 인용한 특허 (90)

  1. Duescher, Wayne O., Abrasive agglomerate coated raised island articles.
  2. Ely, Colin M.; Rothkopf, Fletcher R., Acoustic modules.
  3. Boyd, John M.; Paterson, Allan, Active gimbal ring with internal gel and methods for making same.
  4. Van Asseldonk, Brandon J.; Rosenthal, Brett A.; Huang, Chien-Ming, Adaptive plug for edge protection.
  5. Koetas,Joseph P.; Leviton,Alan E.; Norton,Kari Ell; November,Samuel J.; Robertson,Malcolm W.; Saikin,Alan H., Apparatus for forming a polishing pad having a reduced striations.
  6. Kolesar,David M.; Post,Robert L.; Saikin,Alan H.; Sarafinas,Aaron, Apparatus for forming a striation reduced chemical mechanical polishing pad.
  7. Brown, Garrett W., Articulated human arm support.
  8. Matthews, Michael W.; Phatak, Sunil B., Asymmetrical wafer configurations and method for creating the same.
  9. Matthews, Michael W; Phatak, Sunil B., Asymmetrical wafer configurations and method for creating the same.
  10. Duescher, Wayne O., Bellows driven air floatation abrading workholder.
  11. Duescher, Wayne O., Bellows driven floatation-type abrading workholder.
  12. Ikenaga, Kazuyuki; Tetsuka, Tsutomu; Furuse, Muneo, Cleaning method.
  13. Matsuyuki, Naoto; Yi, Bin; Qu, Dezheng; Manjunathaiah, Jairam; Nathanson, Scott M.; Ness, Trevor J.; Nazzaro, David I.; Molina, Raul A., Co-finishing surfaces.
  14. Matsuyuki, Naoto; Ness, Trevor J.; Nazzaro, David I., Co-sintered ceramic for electronic devices.
  15. Ghilardi, Pierangelo, Compact vacuum sander.
  16. Brown, Garrett W.; Sacksteder, Anthony D.; Black, Micah; Asmann, David G., Concentric ring gimbal support system.
  17. Hoon, Douglas Martin, Configuring of lapping and polishing machines.
  18. Duescher, Wayne O., Coplanar alignment apparatus for rotary spindles.
  19. Shinozaki, Hiroyuki, Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body.
  20. Monnoyeur, Guy, Device for polishing optical lenses.
  21. Koo,Ja goun, Display apparatus, rotating position detector thereof and portable computer system having the same.
  22. Duescher, Wayne O., Dynamic action abrasive lapping workholder.
  23. Duescher, Wayne O., Equal sized spherical beads.
  24. Duescher, Wayne O., Fixed-spindle and floating-platen abrasive system using spherical mounts.
  25. Duescher, Wayne O., Fixed-spindle floating-platen workpiece loader apparatus.
  26. Duescher, Wayne O., Flexible diaphragm combination floating and rigid abrading workholder.
  27. Duescher, Wayne O.; Duescher, Cameron M., Flexible diaphragm post-type floating and rigid abrading workholder.
  28. Duescher, Wayne O., Floating abrading platen configuration.
  29. Franklin, Jeremy C.; Babiarz, Kristina A., Forming features in a ceramic component for an electronic device.
  30. Brown, Garrett W.; Sacksteder, Anthony D., Gimbal assembly for tool support.
  31. Brown, Garrett W., Gimbaled handle stabilizing controller assembly.
  32. Greaves, Nigel J.; Brown, Garrett W., Gimbaled handle stabilizing controller assembly.
  33. Greaves, Nigel J.; Brown, Garrett W., Gimbaled handle stabilizing controller assembly.
  34. Duescher, Wayne O., High speed flat lapping platen.
  35. Duescher, Wayne O., High speed platen abrading wire-driven rotary workholder.
  36. Kaminski, Jacek; Högnäs, Stefan; Neguembor, Oscar A., In-process compensation of machining operation and machine arrangement.
  37. Franklin, Timothy J.; Marohl, Dan A., Integrated platen assembly for a chemical mechanical planarization system.
  38. Franklin, Timothy J.; Marohl, Dan A., Integrated platen assembly for a chemical mechanical planarization system.
  39. Duescher, Wayne O., Laser alignment apparatus for rotary spindles.
  40. Ishida, Tatsuzo; Kuroki, Yoshihiro; Yamaguchi, Jinichi, Legged mobile robot and method and apparatus for controlling the operation thereof.
  41. Morgenstern, David J.; DeForest, Laura M.; Goldberg, Michelle R.; Rundle, Nicholas Alan; Hu, Yuna; Morishita, Michael K.; Kolodziejski, Jacek M., Manufacturing of computing devices.
  42. Bonner,Benjamin A.; McReynolds,Peter; Menk,Gregory E.; Iyer,Anand N.; Prabhu,Gopalakrishna B.; Rondum,Erik S.; Jackson,Robert L.; Leung,Garlen, Materials for chemical mechanical polishing.
  43. Bonner,Benjamin A.; McReynolds,Peter; Menk,Gregory E.; Iyer,Anand N.; Prabhu,Gopalakrishna B.; Rondum,Erik S.; Jackson,Robert L.; Leung,Garlen, Materials for chemical mechanical polishing.
  44. Wilby, Robert John; Kiermasz, Adrian, Measuring apparatus.
  45. Matthews, Michael W.; Phatak, Sunil B., Method for creating asymmetrical wafer.
  46. Sroka, Gary; Winkelmann, Lane W.; Michaud, Mark D., Method for inspecting and refurbishing engineering components.
  47. Pan, Yi; Preece, Brazel G., Method for lapping a wafer.
  48. Duescher, Wayne O., Method of forming a flexible abrasive sheet article.
  49. Koetas,Joseph P.; Leviton,Alan E.; Norton,Kari Ell; November,Samuel J.; Robertson,Malcolm W.; Saikin,Alan H., Method of forming a polishing pad having reduced striations.
  50. Xu, Cangshan; Zhao, Eugene Y.; Dai, Fen, Methods for making reinforced wafer polishing pads and apparatuses implementing the same.
  51. Xu, Cangshan; Zhao, Eugene Y.; Dai, Fen, Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same.
  52. Piatt, Michael J.; Hix, Kenneth E.; Gelbart, Daniel, Micro-structured drying for inkjet printers.
  53. Black, Micah; Sacksteder, Anthony D., Multi-arm gimbal system.
  54. Zwegers, Corey, Multi-function speed sensor.
  55. Nashner, Michael S.; Russell-Clarke, Peter N., Multi-step pattern formation.
  56. Prucher,Bryan Paul, Overmolded yoke assembly.
  57. Duescher, Wayne O., Pin driven flexible chamber abrading workholder.
  58. Duescher, Wayne O., Pivot-balanced floating platen lapping machine.
  59. Joseph W. Buckfeller, Plasma confinement shield.
  60. Shijian Li ; Fred C. Redeker ; John White ; Manoocher Birang, Platen arrangement for a chemical-mechanical planarization apparatus.
  61. Li, Shijian; Birang, Manoocher; Emami, Ramin; Nagengast, Andrew; Brown, Douglas Orcutt; Wang, Shi-Ping; Scales, Martin; White, John, Platen for retaining polishing material.
  62. Hirokawa, Kazuto; Hiyama, Hirokuni; Wada, Yutaka; Matsuo, Hisanori; Togawa, Tetsuji, Polishing apparatus.
  63. Phillip R. Sommer ; Paul B. Butterfield, Polishing media stabilizer.
  64. Sommer,Phillip R.; Butterfield,Paul, Polishing media stabilizer.
  65. Sommer,Phillip R.; Butterfield,Paul D., Polishing media stabilizer.
  66. Qian, Jun; Benvegnu, Dominic J.; Cui, Ningzhuo; Swedek, Boguslaw A.; Osterheld, Thomas H., Polishing pad and system with window support.
  67. Kurosawa, Yoshiaki; Hashii, Tomohiro; Kakizono, Yuichi, Polishing solution distribution apparatus and polishing apparatus having the same.
  68. Duescher, Wayne O., Raised island abrasive, lapping apparatus and method of use.
  69. Zhang, Hui; Gan, ZhongXue; Wang, Jianjun; Zhang, George, Robotic machining with a flexible manipulator.
  70. Akamatsu, Masaru; Hashizume, Hidehisa; Nakai, Yasuhide, Shape measurement apparatus and shape measurement method.
  71. Duescher, Wayne O., Spider arm driven flexible chamber abrading workholder.
  72. Gagliardi, John J., Splicing technique for fixed abrasives used in chemical mechanical planarization.
  73. Liu,Ta Wei; Lin,Duan Ying, Stylus retaining and releasing mechanism for stylus-receiving housing.
  74. Umetsu, Shigehiro; Shimoyama, Tatsuro; Uchida, Koji, Supporting unit, and moving table device and linear-motion guiding device that use the supporting unit.
  75. Shijian Li ; John M. White ; Lawrence M. Rosenberg ; Martin Scales ; Ramin Emami ; James V. Tietz ; Manoocher Birang, System for chemical mechanical planarization.
  76. Bickersteth, Daniel Thomas; Greene, Robert G.; Gembel, II, Kenneth John, System for lapping ring and pinion gears.
  77. Chang, Shou-Sung; Chen, Hung Chih; Karuppiah, Lakshmanan; Butterfield, Paul D.; Rondum, Erik S., Systems and methods for substrate polishing end point detection using improved friction measurement.
  78. Chang, Shou-Sung; Chen, Hung; Karuppiah, Lakshmanan; Butterfield, Paul D.; Rondum, Erik S., Systems and methods for substrate polishing end point detection using improved friction measurement.
  79. Duescher, Wayne O., Three-point fixed-spindle floating-platen abrasive system.
  80. Duescher, Wayne O., Three-point spindle-supported floating abrasive platen.
  81. Hada, Frank S.; Hermans, Michael A.; Gropp, Ronald F.; Costello, Peter K., Through-air dryer assembly.
  82. Ko, Donggeun, Ultra-flat, high throughput wafer lapping process.
  83. Ko, Donggeun, Ultra-flat, high throughput wafer lapping process.
  84. Ko, Donggeun, Ultra-flat, high throughput wafer lapping process.
  85. Ball, Michael B.; Sanchez, Jose L., Using backgrind wafer tape to enable wafer mounting of bumped wafers.
  86. Duescher, Wayne O.; Duescher, Cameron M., Vacuum-grooved membrane abrasive polishing wafer workholder.
  87. Duescher, Wayne O.; Duescher, Cameron M., Vacuum-grooved membrane wafer polishing workholder.
  88. Gusack, Mark David, Virtual robotic controller system with special application to robotic microscopy structure and methodology.
  89. Duescher, Wayne O., Wafer pads for fixed-spindle floating-platen lapping.
  90. Duescher, Wayne O., Workpiece spindles supported floating abrasive platen.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로