초록 ▼

A modular apparatus is described which houses electronic equipment. The apparatus includes a plurality of electronic modules surrounded by an air vent system. In one embodiment, the air vent system cools the electronic components indirectly, through a connection module. In another embodiment the ele

A modular apparatus is described which houses electronic equipment. The apparatus includes a plurality of electronic modules surrounded by an air vent system. In one embodiment, the air vent system cools the electronic components indirectly, through a connection module. In another embodiment the electronic components are cooled directly. One of the main advantages of the present invention is its modular configuration which allows additional components to be added with relative ease as the requirements of the system are expanded over time.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for housing electronic equipment comprising:a plurality of electronic module housings; and,an air vent system connected to each of the plurality of electronic module housings, said air vent system comprising first and second towers disposed on opposing sides

[ What is claimed is:] [1.] An apparatus for housing electronic equipment comprising:a plurality of electronic module housings; and,an air vent system connected to each of the plurality of electronic module housings, said air vent system comprising first and second towers disposed on opposing sides of the plurality of electronic module housings,wherein each of the plurality of electronic module housings comprises a case which encloses a circuit card at its upper and lower surfaces having an interface terminal disposed along one side thereof, said case allowing access to the interface terminal through the exterior of the case.