초록 ▼

A method, apparatus and package for packaging contaminant-sensitive articles such as semiconductor wafers on shock absorbers in a sealed rigid plastic enclosure such as a box or the like which may be enclosed within another sealed enclosure wherein the sealed enclosures are each provided with a self

A method, apparatus and package for packaging contaminant-sensitive articles such as semiconductor wafers on shock absorbers in a sealed rigid plastic enclosure such as a box or the like which may be enclosed within another sealed enclosure wherein the sealed enclosures are each provided with a self-sealing member together with a hollow needle connected to a source of purging gas and a vacuum source for selectively piecing one or more of the self-sealing members to communicate the gas and vacuum sources with a selected one of the enclosures interiors for purging and/or evacuating the enclosures interiors to remove ion contaminants, moisture, oxygen, plastic particles, etc. whereby corrosive activity on the articles is eliminated and the sealed condition of both enclosures is maintained after the contaminants, etc. are removed and the needle is withdrawn thereby providing increased productive yields of such articles being processed between manufacturing steps by reducing or substantially eliminating environmental variations.

대표청구항 ▼

[ What is claimed is:] [1.] A method of packaging semiconductor wafers, comprising the steps of:a) providing a rigid first enclosure having an interior compartment therein, the enclosure having a wall with an opening therethrough, the opening being closed by a first self-sealing member;b) locating t

[ What is claimed is:] [1.] A method of packaging semiconductor wafers, comprising the steps of:a) providing a rigid first enclosure having an interior compartment therein, the enclosure having a wall with an opening therethrough, the opening being closed by a first self-sealing member;b) locating the wafers in the interior compartment of the first enclosure;c) closing and sealing the first enclosure;d) providing a second enclosure having an interior compartment, the second enclosure having a wall with an opening therein, the second enclosure opening being closed by a second self-sealing member;e) after closing and sealing the first enclosure, locating the first enclosure in the second enclosure interior compartment;f) aligning the first self-sealing member with the second self-sealing member;g) closing and sealing the second enclosure;h) penetrating the second and first self-sealing members with a tubular instrument;i) introducing purging gas into the interior compartment of the first enclosure through the tubular instrument;j) withdrawing the tubular instrument from the first and second self-sealing members.