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Method and apparatus for bonding using brazing material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/20
  • B23K-031/02
출원번호 US-0038783 (1998-03-11)
우선권정보 JP0113204 (1993-05-14)
발명자 / 주소
  • Mori Yoshiaki,JPX
  • Miyakawa Takuya,JPX
  • Asano Yasuhiko,JPX
  • Kurashina Osamu,JPX
  • Miyamori Satoshi,JPX
  • Kurashima Yohei,JPX
  • Anan Makoto,JPX
출원인 / 주소
  • Seiko Epson Corporation, JPX
대리인 / 주소
    Stroock & Stroock & Lavan LLP
인용정보 피인용 횟수 : 22  인용 특허 : 31

초록 ▼

High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the

대표청구항

[ What is claimed is:] [1.] A fluxless soldering method, comprising:

이 특허에 인용된 특허 (31)

  1. Reisman Arnold (Raleigh) Temple Dorota (Raleigh NC), Alternating cyclic pressure modulation process for selective area deposition.
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  2. Bobbio Stephen M. (Wake Forest NC), Apparatus and method for controlling processing uniformity in a magnetron.
    상세보기
  3. Liu Yung S. (Schenectady NY) Grubb Willard T. (Schenectady NY), Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides.
    상세보기
  4. Tanisaki Tatsuzo (Onomichi JPX), Apparatus for atmospheric plasma treatment of a sheet-like structure.
    상세보기
  5. Freedman Gary M. (Stow MA), Atmospheric pressure gaseous-flux-assisted laser reflow soldering.
    상세보기
  6. Yoneda Masahiro (Itami JPX) Hine Shiro (Minoh JPX) Koyama Hiroshi (Amagasaki JPX), Cleaning device for a plasma etching system.
    상세보기
  7. Jackson David P. (Saugus CA) Buck Orval F. (Santa Monica CA), Cleaning process using phase shifting of dense phase gases.
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  8. Tsai Chin-Chi (Oak Ridge TN) Haselton Halsey H. (Knoxville TN), Coupled microwave ECR and radio-frequency plasma source for plasma processing.
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  9. Kumihashi Takao (Musashino JPX) Tsujimoto Kazunori (Higashiyamato JPX) Tachi Shinichi (Sayama JPX), Dry etching apparatus and method.
    상세보기
  10. Panitz Janda K. G. (Edgewood NM) Jellison James L. (Albuquerque NM) Staley David J. (Los Lunas NM), Dry soldering with hot filament produced atomic hydrogen.
    상세보기
  11. Grewal Virinder S. (Fishkill NY) Laux Volker B. (Munich DEX), Etch chamber having three independently controlled electrodes.
    상세보기
  12. Terada Yasuharu (Uozu JPX) Suzuki Tsuneo (Kurobe JPX) Matsushima Hideyuki (Toyama JPX) Horita Yoshiyuki (Toyama JPX), Fastening device.
    상세보기
  13. Bobbio Stephen M. (Wake Forest NC) Rinne Glenn A. (Cary NC), Fluorinated fluxless soldering.
    상세보기
  14. Bobbio Stephen M. (Wake Forest NC) DuBois Thomas D. (Charlotte NC) Tranjan Farid M. (Charlotte NC) Lucey ; Jr. George K. (Burtonsville MD) Geis James D. (Cheshire CT) Lipscomb Robert F. (Chapel Hill , Fluxless soldering method.
    상세보기
  15. Koopman Nicholas G. (Raleigh NC) Nangalia Sundeep (Raleigh NC), Fluxless soldering of copper.
    상세보기
  16. Dishon Giora (Jerusalem NC ILX) Bobbio Stephen M. (Wake Forest NC), Fluxless soldering process.
    상세보기
  17. Bobbio Stephen M. (Wake Forest NC) Koopman Nicholas G. (Raleigh NC) Nangalia Sundeep (Raleigh NC), Fluxless soldering sample pretreating system.
    상세보기
  18. Bobbio Stephen M. (Wake Forest NC), Magnetron method and apparatus for producing high density ionic gas discharge.
    상세보기
  19. Pedder David J. (Warks) Wort Christopher J. (Northants) Pickering Kim L. (Northampton GBX), Metal surface cleaning processes.
    상세보기
  20. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX, Method and apparatus for bonding using brazing material.
    상세보기
  21. Kusano Yukihiro (20-11 ; Takaidohigashi 2-chome Tokorozawa JPX) Yoshikawa Masato (20-11 ; Takaidohigashi 2-chome Kodaira JPX) Naito Kazuo (20-11 ; Takaidohigashi 2-chome Kawasaki JPX) Okazaki Satiko , Method and apparatus for surface treating an axially symmetric substrate at atmosphere pressure.
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  22. Yoshikawa Masato (Tokyo JPX) Kusano Yukihiro (Tokorozawa JPX) Akiyama Setsuo (Sagamihara JPX) Naito Kazuo (Kawasaki JPX) Okazaki Satiko (Tokyo JPX) Kogoma Masuhiro (Wako JPX), Method and apparatus for surface treatment.
    상세보기
  23. Phillips Eugene (Diamond Bar CA), Method for conditioning drilled holes in multilayer wiring boards.
    상세보기
  24. Tsukamoto Katsuhiro (Hyogo JPX) Tokui Akira (Hyogo JPX), Method for forming a thin layer on a semiconductor substrate and apparatus therefor.
    상세보기
  25. Schuurmans Hubertus J. A. (Amsterdam NLX) Werner Jan (Amsterdam NLX) Schram Daniel C. (Eindhoven NLX) Kroesen Gerardus M. W. (Eindhoven NLX), Method for plasma surface treating and preparation of membrane layers.
    상세보기
  26. Kusano Yukihiro (No. 20-11 ; Takaido Higashi 2-chome Tokorozawa JPX) Yoshikawa Masato (No. 20-11 ; Takaido Higashi 2-chome Kodaira JPX) Naito Kazuo (No. 20-11 ; Takaido Higashi 2-chome Kawasaki JPX) , Method for preparing a rubber-based composite material.
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  27. Nishiwaki Atsushi (1-11 ; Funakoshi-cho 2-chome Chuo-ku ; Osaka JPX) Ikemiya Norihito (Takatsuki JPX) Uchiyama Hiroshi (Hirakata JPX) Inagaki Hideo (Hirakata JPX) Sawada Yasuo (Tokyo JPX) Ogino Kazum, Method for the surface treatment of a metal by atmospheric pressure plasma.
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  28. Tanisaki Tatsuzo (No. 20-11 ; Takaidohigashi 2-chome Onomichi JPX) Okazaki Satiko (No. 20-11 ; Takaidohigashi 2-chome Suginami-ku ; Tokyo JPX) Kogoma Masuhiro (No. 843-15 Shimoniikura ; Wako-shi ; Sa, Method for utilizing a plasma reaction under an atmospheric pressure.
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  29. Okazaki Satiko (Tokyo JPX) Kogoma Masuhiro (Saitama JPX), Method of forming a thin polymeric film by plasma reaction under atmospheric pressure.
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  30. Frei John K. (Mesa AZ) Fiorenzo Russell T. (Scottsdale AZ), Plasma based soldering by indirect heating.
    상세보기
  31. Maruyama Takahiro (Hyogo JPX), Plasma treatment apparatus.
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  1. Dong,Chun Christine; Karwacki, Jr.,Eugene Joseph; Patrick,Richard E., Addition of Dto Hto detect and calibrate atomic hydrogen formed by dissociative electron attachment.
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  2. Dong,Chun Christine; McDermott,Wayne Thomas; Patrick,Richard E.; Schwarz,Alexander, Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation.
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  3. Dong, Chun Christine; McDermott, Wayne Thomas; Patrick, Richard E.; Schwarz, Alexander, Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation.
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  4. Dong,Chun Christine; McDermott,Wayne Thomas; Patrick,Richard E.; Schwarz,Alexander, Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation.
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  5. Dong, Chun Christine; McDermott, Wayne Thomas; Patrick, Richard E.; Schwarz, Alexander, Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation.
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  6. Bollinger,Lynn David; Tokmouline,Iskander, Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes.
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  7. Seseke-Koyro, Ulrich; Frehse, Joachim; Becker, Andreas, Components coated with an aluminum-silicon alloy.
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  8. Dong, Chun Christine; McDermott, Wayne Thomas; Schwarz, Alexander; Arslanian, Gregory Khosrov; Patrick, Richard E.; Orbeck, Gary A.; Seccombe, Jr., Donald A., Electrode assembly for the removal of surface oxides by electron attachment.
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  9. Dong, Chun Christine; McDermott, Wayne Thomas; Schwarz, Alexander; Arslanian, Gregory Khosrov; Patrick, Richard E.; Orbeck, Gary A.; Seccombe, Jr., Donald A., Electrode assembly for the removal of surface oxides by electron attachment.
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  10. Dong, Chun Christine; McDermott, Wayne Thomas; Schwarz, Alexander; Arslanian, Gregory Khosrov; Patrick, Richard E.; Orbeck, Gary A.; Seccombe, Jr., Donald A., Electrode assembly for the removal of surface oxides by electron attachment.
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  11. Dong, Chun Christine; McDermott, Wayne Thomas; Patrick, Richard E.; Ross, Brenda F., Hydrogen fluxless soldering by electron attachment.
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  12. Kitada, Kenji; Miyakawa, Takuya; Saiba, Takashi; Kitawada, Kiyofumi; Denda, Atsushi; Nariai, Maki, Ink jet printer and printing method.
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  13. Higashi, Kazushi; Sasaoka, Tatsuo; Ishitani, Shinji, Joining apparatus with UV cleaning.
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  14. Daniel Gelbart CA, Method of surface preparation using plasma in air.
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  15. Barnett Ronald J., Plasma enhanced wire bonder.
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  16. Bendat, Zvi; Chou, Henry; Powell, Lionel, Process and apparatus for mounting semiconductor components to substrates and parts therefor.
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  17. Tischler, Friedrich, Process for MSG-soldering and use of a shielding gas.
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  18. Park, Jaeyoung; Henins, Ivars, Production of stable, non-thermal atmospheric pressure rf capacitive plasmas using gases other than helium or neon.
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  19. Dong, Chun Christine; Patrick, Richard E.; Arslanian, Gregory Khosrov, Removal of surface oxides by electron attachment.
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  20. Dong, Chun Christine; Patrick, Richard E.; Arslanian, Gregory Khosrov; Ghosh, Ranajit, Removal of surface oxides by electron attachment.
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  21. Dong, Chun Christine; McDermott, Wayne Thomas; Schwarz, Alexander; Arslanian, Gregory Khosrov; Patrick, Richard E., Removal of surface oxides by electron attachment for wafer bumping applications.
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  22. Dong,Chun Christine; McDermott,Wayne Thomas; Schwarz,Alexander; Arslanian,Gregory Khosrov; Patrick,Richard E., Removal of surface oxides by electron attachment for wafer bumping applications.
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