초록 ▼

An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended

An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with a particulate solid such as alumina, boron nitride, graphite, silicon carbide, diamond, metal powders, and mixtures or blends thereof. Advantageous formulations include up to 45% alumina. Another advantageous formulation includes between 10% and 20% by weight of boron nitride, balance polyphenylsulfone.

대표청구항 ▼

[ What is claimed is:] [1.] A relatively thin thermally conductive, electrically insulative mounting pad to be positioned between a base surface of a heat generating solid state electronic device and a mounting surface of a heat-sink; said mounting pad comprising:(a) a film consisting essentially of

[ What is claimed is:] [1.] A relatively thin thermally conductive, electrically insulative mounting pad to be positioned between a base surface of a heat generating solid state electronic device and a mounting surface of a heat-sink; said mounting pad comprising:(a) a film consisting essentially of polyphenylsulfone matrix impregnated with a thermally conductive, electrically insulative particulate filler selected from the group consisting of alumina, boron nitride, graphite, silicon carbide, diamond, metal powders as well as mixtures or blends thereof in an amount ranging from between about 10% and 50% by weight of polyphenylsulfone.